Search Results for : Arm Cortex-M core

Kaga FIE has recently announced the ES4L15BA1, a Low-Power BLE wireless module that’s currently under development, designed to offer high-performance connectivity with Bluetooth 6.0, supporting data rates of 2M, 1M, 500k, and 125kbps, as well as advanced features like Angle of Arrival...

The Infineon EZ-USB FX20 is a next-generation USB peripheral controller engineered for high-speed applications, delivering an impressive performance of up to 20 Gbps. Building on the legacy of the EZ-USB FX3, which has been pivotal in fields such as machine learning, machine vision...

The D-Robotics RDK X3 dev board is specifically designed for edge AI applications, particularly in robotics. It utilizes the Sunrise X3 processor with a quad-core Arm Cortex-A53 CPU and a dual-core BPU (Brain Processing Unit) that features a 5 TOPS NPU for AI tasks. This makes it...

The MYD-LD25X Development Board is an evaluation platform designed around the STMicroelectronics STM32MP257D processor, featuring dual ARM Cortex-A35 cores (up to 1.5GHz) and a Cortex-M33 core (400MHz). It supports Linux 6.1 and Debian 12 and operates within an industrial temperature...

STMicro has introduced the STM32C071 a mainstream microcontroller built around the high-performance Arm Cortex-M0+ 32-bit RISC core, running at up to 48 MHz. This chip has 128KB of memory and 24KB of fast memory with extra protection, and it can save power by going into different sleep...

The RP2350 is a dual-core microcontroller featuring two ARM Cortex M33 and two Hazard3 RISC-V processors, with a selectable boot option for any two cores. It operates at 150 MHz, has 520 kB SRAM in 10 banks, and includes peripherals like two UARTs, two SPI controllers, two I2C...

Arm Targets the AIoT with High-Performance Ethos-U85 NPU and Corstone-320 Platform New accelerator boasts four times the peak performance and a 20 percent power efficiency boost over its predecessors. Arm has announced its latest designs for the Artificial Intelligence of Things (AIoT)...

The newly developed System-in-Package (SIP) is a significant advancement for power-efficient cellular projects. It features a 64MHz Arm Cortex-M33 processor, LTE-M/NB-IoT cellular connectivity, and DECT NR+ connectivity, all integrated into a single chip. What sets this SIP apart is its...