AAEON Pairs High-Performance Computing with an Intel Arc GPU in a Versatile Industrial AI Edge PC
SBC

AAEON Pairs High-Performance Computing with an Intel Arc GPU in a Versatile Industrial AI Edge PC

AAEON’s new MXM-ACMA-PUC combines CPU, GPU, and peripheral support to power Smart City, AOI, and edge workstation solutions. AAEON, a leading provider of industrial and embedded computing solutions, has released the MXM-ACMA-PUC, a new system-level product line incorporating 13th...

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Multi Board Synchronization on RFSoC Board & Systems Demo
RFSoC-SiP

Multi Board Synchronization on RFSoC Board & Systems Demo

The ZynqTM UltraScale+TM RFSoC architecture integrates FPGA fabric with flexibility and the architecture to support direct RF-sampling, highly flexible, reconfigurable logic, and software programmability. This feature is applicable in applications that involve rapid data acquisition,...

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Low Voltage Bidirectional Level Shifter – Renesas
Miscellaneous

Low Voltage Bidirectional Level Shifter – Renesas

Author: Yurii Schebel, Application Engineering Team Lead, Renesas Electronics, Lviv, Ukraine Based on the application note AN-CM-382 Low Voltage Bidirectional Level Shifter Introduction Modern systems are becoming increasingly complex to meet user demands, stay competitive, and offer...

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TerraMaster Black Friday Offers Up to 25% OFF on NAS!
Products

TerraMaster Black Friday Offers Up to 25% OFF on NAS!

From November 21 to December 2, the Black Friday and Cyber Monday sales are on! During the promotion period, TerraMaster offers unprecedented discounts: most products will be available at 20% off, with some NAS models offering discounts of up to 25%. Don’t miss this excellent...

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AAEON Reimagines its Flagship UP Board with the Introduction of the UP 710S
SBC

AAEON Reimagines its Flagship UP Board with the Introduction of the UP 710S

Wi-Fi support, serial communication, and a slimmer design make the UP 710S a modernized industrial board with deep ties to its origins. AAEON's UP brand , which began with the creation of the credit-card sized UP developer board almost a decade ago, has introduced the UP 710S, a...

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xMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro Speaker
Audio

xMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro Speaker

At one-seventh the size and one-third the thickness of conventional dynamic-drivers, Sycamore gives product designers the space and freedom to innovate thinner and lighter mobile device form factors. Santa Clara, California, November 19, 2024 – xMEMS Labs, developers of the foremost...

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Compex Systems Unveils Wi-Fi 7 Modules with Smart Connectors, Enabling Seamless Multi-Link Operation (MLO) Integration on Conventional CPU Platforms
RFTechnology

Compex Systems Unveils Wi-Fi 7 Modules with Smart Connectors, Enabling Seamless Multi-Link Operation (MLO) Integration on Conventional CPU Platforms

Compex Systems (Compex), a global leader in wireless communication technology, is taking Wi-Fi 7 to new heights with an innovative connector design for Multi-Link Operation (MLO). This breakthrough enables seamless deployment of MLO across off-the-shelf platforms, including those with...

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TerraMaster Launches Five New BBS Integrated Backup Servers
Products

TerraMaster Launches Five New BBS Integrated Backup Servers

Offering Comprehensive Hardware and Software Backup Solutions for Businesses In an era where data has become a core asset for modern enterprises, TerraMaster, a global leader in data storage and management solutions, has announced the official launch of five high-performance integrated...

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