Author: mixos
AAEON Pairs High-Performance Computing with an Intel Arc GPU in a Versatile Industrial AI Edge PC
AAEON’s new MXM-ACMA-PUC combines CPU, GPU, and peripheral support to power Smart City, AOI, and edge workstation solutions. AAEON, a leading provider of industrial and embedded computing solutions, has released the MXM-ACMA-PUC, a new system-level product line incorporating 13th...
Continue ReadingMulti Board Synchronization on RFSoC Board & Systems Demo
The ZynqTM UltraScale+TM RFSoC architecture integrates FPGA fabric with flexibility and the architecture to support direct RF-sampling, highly flexible, reconfigurable logic, and software programmability. This feature is applicable in applications that involve rapid data acquisition,...
Continue ReadingLow Voltage Bidirectional Level Shifter – Renesas
Author: Yurii Schebel, Application Engineering Team Lead, Renesas Electronics, Lviv, Ukraine Based on the application note AN-CM-382 Low Voltage Bidirectional Level Shifter Introduction Modern systems are becoming increasingly complex to meet user demands, stay competitive, and offer...
Continue ReadingTerraMaster Black Friday Offers Up to 25% OFF on NAS!
From November 21 to December 2, the Black Friday and Cyber Monday sales are on! During the promotion period, TerraMaster offers unprecedented discounts: most products will be available at 20% off, with some NAS models offering discounts of up to 25%. Don’t miss this excellent...
Continue ReadingAAEON Reimagines its Flagship UP Board with the Introduction of the UP 710S
Wi-Fi support, serial communication, and a slimmer design make the UP 710S a modernized industrial board with deep ties to its origins. AAEON's UP brand , which began with the creation of the credit-card sized UP developer board almost a decade ago, has introduced the UP 710S, a...
Continue ReadingxMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro Speaker
At one-seventh the size and one-third the thickness of conventional dynamic-drivers, Sycamore gives product designers the space and freedom to innovate thinner and lighter mobile device form factors. Santa Clara, California, November 19, 2024 – xMEMS Labs, developers of the foremost...
Continue ReadingCompex Systems Unveils Wi-Fi 7 Modules with Smart Connectors, Enabling Seamless Multi-Link Operation (MLO) Integration on Conventional CPU Platforms
Compex Systems (Compex), a global leader in wireless communication technology, is taking Wi-Fi 7 to new heights with an innovative connector design for Multi-Link Operation (MLO). This breakthrough enables seamless deployment of MLO across off-the-shelf platforms, including those with...
Continue ReadingTerraMaster Launches Five New BBS Integrated Backup Servers
Offering Comprehensive Hardware and Software Backup Solutions for Businesses In an era where data has become a core asset for modern enterprises, TerraMaster, a global leader in data storage and management solutions, has announced the official launch of five high-performance integrated...
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