Author: mixos
![BD14210G ±1% Accuracy Current Sense Amplifier BD14210G ±1% Accuracy Current Sense Amplifier](https://www.electronics-lab.com/wp-content/uploads/2023/04/SSOP6.jpg)
BD14210G ±1% Accuracy Current Sense Amplifier
ROHM’s current sensing IC has a space-saving design that decreases the mounting area by 46% ROHM’s BD14210G-LA current sense amplifier guarantees long time support in the industrial market. This device operates from a single 2.7 V to 5.5 V power supply. It has a wide common-mode...
Continue Reading![Thermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series Thermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series](https://www.electronics-lab.com/wp-content/uploads/2023/04/SD_Series_SPL.png)
Thermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series
Bourns' TCO mini-breaker devices are tested to AEC-Q200-listed stress tests AD and SD series resettable miniature thermal cutoff (TCO) mini-breaker devices from Bourns, Inc. are the first TCO devices tested by Bourns to AEC-Q200-listed stress tests. The AD and SD series’ advanced...
Continue Reading![ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing](https://www.electronics-lab.com/wp-content/uploads/2023/04/IBASE_ET980_banner_300dpi.jpg)
ET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing
IBASE Technology Inc, a world leader in the manufacture of embedded boards and solutions, has added the ET980 series of COM Express modules to its portfolio. Supporting the U-series and P-series of 12th Gen Intel® Core™ processors from i3-1220PE to i7-1265UE (12M Cache, up to...
Continue Reading![Discover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors Discover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors](https://www.electronics-lab.com/wp-content/uploads/2023/04/66652_12G-SDI-4K-Ultra-High-Definition_HD-Images_rsz-1024x1024.jpg)
Discover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors
LEMO is thrilled to announce the expansion of its field-proven S Series push-pull connectors with the new 1S.275 Series for 12G-SDI (Serial Digital Interface) 4K Ultra High Definition transmission. The new robust push-pull connectors are compliant with the SMPTE ST 2082-1 standard for...
Continue Reading![Texas Instruments bq25628/bq25629 Battery Charger ICs Texas Instruments bq25628/bq25629 Battery Charger ICs](https://www.electronics-lab.com/wp-content/uploads/2023/04/190527235.png)
Texas Instruments bq25628/bq25629 Battery Charger ICs
Texas Instruments bq25628/bq25629 Battery Charger ICs are highly-integrated 2A switch-mode battery charge management and system power path management devices for single-cell Li-ion and Li-polymer batteries. The solution is highly integrated with built-in current sensing, loop...
Continue Reading![Energy harvesting PMIC from Nexperia includes MPPT tracking Energy harvesting PMIC from Nexperia includes MPPT tracking](https://www.electronics-lab.com/wp-content/uploads/2023/04/Chip-product-image-NEH2000BY-Top-e1680783190401-1024x560.png)
Energy harvesting PMIC from Nexperia includes MPPT tracking
Nexperia, the expert in essential semiconductors, today announced an expansion to its range of Power ICs with Energy Harvesting solutions to simplify and enhance the performance of low-power internet of things (IoT) and other embedded applications. The NEH2000BY is a high-performance...
Continue Reading![Highly stable digital MEMS gyroscope for dynamic applications Highly stable digital MEMS gyroscope for dynamic applications](https://www.electronics-lab.com/wp-content/uploads/2023/04/bild-wo-background-en-data-1024x768.jpg)
Highly stable digital MEMS gyroscope for dynamic applications
TDK Corp. introduces the Tronics Gypro4300, a highly stable and vibration-resistant digital MEMS gyroscope for dynamic applications. The gyro is also ideally equipped for use in vehicles. The Tronics Gypro4300 features an input measurement range of ±300 °/s, a bandwidth of 200 Hz and...
Continue Reading![iWave’s most anticipated 64-bit Arm-A55 and RISC-V MPU-based System on Module is launched at EW23 iWave’s most anticipated 64-bit Arm-A55 and RISC-V MPU-based System on Module is launched at EW23](https://www.electronics-lab.com/wp-content/uploads/2023/04/Picture2.png)
iWave’s most anticipated 64-bit Arm-A55 and RISC-V MPU-based System on Module is launched at EW23
iWave Systems announced an upcoming iW-RainboW-G53M: RZ/G2UL, RZ/A3UL, RZ/Five based System on Module (SOM) built on OSM v1.1 Size-M specification at the Embedded World 2023 trade fair. The module delivers sophisticated features and enhanced performance for IoT endpoint devices while...
Continue Reading