Author: mixos

Hamamatsu Photonic has developed a new InAsSb photovoltaic detector (P16702-011MN) with built-in preamplifier offering high sensitivity to mid-infrared light, up to 11μm in wavelength. We achieved this by combining the latest InAsSb (indium arsenide antimonide) mid-infrared models...

The UP Xtreme series meets 12th Generation Intel® Core™/Celeron® power with the release of the UP Xtreme i12 Edge. AAEON, a leading manufacturer of AI development solutions, announces the UP Xtreme i12 Edge, its latest addition to the UP product series. The UP Xtreme i12 Edge...

The VAR-SOM-MX93 is based on NXP’s i.MX93 newest application processor, offers ML, power efficiency, and cost-effective advantages Variscite, a leading worldwide System on Module (SoM) designer, developer, and manufacturer, today announced new, state-of-the-art SoM for...

Microchip Technology WBZ451 Curiosity Board is an efficient and modular development platform. It supports rapid prototyping and demonstrates the features, capabilities, and interfaces of Microchip's BLUETOOTH® Low Energy and Zigbee RF Module (WBZ451PE). Features WBZ451PE...

Synaptics’ SYN4778 GNSS IC delivers 80% lower power consumption in a 30% smaller package with 50% greater accuracy. Addressing the challenge of a GNSS receiver consuming a high percentage of available power in battery-based IoT devices, Synaptics Inc. unveiled its SYN4778, claimed...

The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering. Dimensioned just 19 x 13 x 7.5 mm, the device...

Introducing the new leading-edge products of unparalleled power and performance, ASRock Industrial launches the mighty trio- NUC 1300/D5 BOX, NUC 1300/D4 BOX, and NUCS 1300/D4 BOX Series enabled by 13th Gen Intel® Core™ Processors (Raptor Lake-P). Featuring performance hybrid...

ADLINK Technology Inc., a global leader in edge computing, introduces two new Computer-on-Modules based on the latest Intel® Core™ processors, available in two form factors — COM Express (COM.0 R3.1) Type 6 Module based on Intel® 13th Gen Core™ mobile processors and...