Author: mixos
A miniature microfluidics heat sink For high-performance chip cooling
At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance...
Continue ReadingIMB-1215 Coffee Lake – Mini-ITX Intel® Core™ 8th Gen Q370 SBC
Overview The IMB-1215 is the lower cost 'brother' of the IMB-1213. As you'll see the IMB-1215 still retains a lot of the main features of the "full spec" IMB-1213 but with minor modifications around power, for example, where the standard is single power input (19V DC in) versus the...
Continue ReadingNew PicoScope 9400 5 GHz oscilloscope
The PicoScope 9404-05 is the first of a new class of oscilloscopes that combine the benefits of real-time sampling, equivalent-time sampling and high analog bandwidth. The PicoScope 9404-05 has four 5 GHz input channels with market-leading ADC, timing and display resolutions for...
Continue ReadingThree quantum computer components integrated on one chip
Scientists at the University of Stuttgart and the KIT succeed in important further development on the way to quantum computers. Quantum computers one day should be able to solve certain computing problems much faster than a classical computer. One of the most promising approaches is...
Continue ReadingKontron Presents SOM Based on the New STM32MP157 by STMicroelectronics
Dual Cortex-A7 and Cortex-M4 integrated – graphics, communication and real-time control on one chip – evaluation board available Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), is one of the first companies to introduce a System-on-Module (SOM) based...
Continue ReadingTake Flight with AI Core X featuring Intel® Movidius™ Myriad™ X VPU
AI Edge Computing Board with Intel® Movidius™ Myriad™ X VPU, MYDX x 1 AAEON is leading the industry as the first to offer a compact AI module powered by Intel® Movidius™ Myriad™ X VPU; the AI Core X. Part of our UP family of edge computing platforms, the...
Continue ReadingNew IC is capable of 100mV cold start, with extended input voltage range
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology...
Continue ReadingIEL launches PICO-ITX form factor “HYPER-AL”
IEL provides solutions in the various sectors of Industrial automation, Smart Transportation, Healthcare, etc. Earlier this year, IEL launched “HYPER-RK36” PICO-ITX form factor SBC which runs on Rockchip RK3399 Processor with high computing and multi-media performance. It has...
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