Author: mixos

GaN power switching technology has been around for many years. By now, many design engineers are familiar with the technology and have redesigned their products to take advantage of GaN power devices’ key features such as fast switching, zero reverse recovery current, etc… By using...

CUI Devices’ Sensors Group today announced the expansion of its ultrasonic sensors product line with a range of new ultrasonic transceiver models. Featuring ingress protection ratings of IP67 or IP68 and high frequency ratings up to 400 kHz, these ultrasonic transceivers boast...

JLCPCB for faster electronics manufacturing, carrying out its new standard PCB assembly service as an ace project created by JLCPCB, has been committed to reducing PCB assembly costs, improving ordering experience, speed up SMT lead-time, therefore, it gives the hand for professional...

Maxim Integrated DS28E30 1-Wire® ECDSA Secure Authenticator is a cryptographic-based authentication solution that provides a root-of-trust to detect and prevent counterfeit products and to enable secure use management of limited life peripherals. The DS28E30 provides a highly secure...

In 2017, VOOPOO acquired the American chip brand GENE. After that VOOPOO independently developed and created two types of gene chips called GENE.AI and GENE.TT that are used in their products. Below are some of their highlights. GENE AI Chip Artificial Intelligence Smart...

Author: Marian Hryntsiv, Senior Technical Documentation Apps Engineer, Renesas Electronics 1. System Overview Nowadays, humidifiers have become popular devices. They are frequently used to increase the level of humidity in rooms in many houses across continents. Ultrasonic humidifiers...

MYIR introduces a cost-effective MYC-YT507H CPU Module powered by ALLWINNER’s T507-H industrial processor which among Allwinner T5 series with a 1.5GHz quad-core Cortex-A53 CPU and a Mali-G31 MP2 GPU. The module is ready to run Linux OS and targets a wide variety of applications like...

iWave Systems unveils the first look of Intel® Stratix® 10 powered System on Module at embedded world 2022. The System on Module is compatible with the SX and GX series of Stratix 10 SoC and FPGA, and is available in a form factor of 110mm x 75mm. Stratix 10 brings about a...