Author: mixos

The project presented here is a differential output amplifier that converts a single-ended audio signal input to a balanced output pair. This balanced audio project consists of high-performance OPAMPS with on-chip precision resistors. They are fully specified for high-performance audio...

Through increased adoption of data-driven telematics use cases in vehicles, there has been a rising need for telematics edge hardware across a range of vehicles. Telematics and connected vehicle solutions help unlock value across a range of vehicle types: passenger cars, heavy duty...

With the announcement of the NVIDIA® Jetson AGX Orin™ developer kit, AAEON is excited to utilize the many benefits that such a powerful system-on-module (SOM) can bring to its own product lines. With the same form factor and pin compatibility as the NVIDIA Jetson AGX...

ROHM's USB Type-C power delivery provides for quick and easy design and implementation of USB Type-C PD for sink applications (UFP) ROHM's ICs are members of their proven full-featured USB Type-C power delivery (PD) controller portfolio. They allow quick and easy design and...

At DesignCon 2022, Rohde & Schwarz will showcase live demos covering industry trends in cooperation with industry experts such as Samtec, ataitec, Clear Signal Solutions, and more. At DesignCon Rohde & Schwarz is demonstrating a mix of unique solutions for high-speed digital...

The project presented here is designed for high-voltage and high-speed driving for MOSFETS and IGBTs that operate up to +1200V. The project consists of a FAN73912 gate driver chip and 2 x IGBTs, DC bus capacitors, current sense resistor for current feedback etc. The advanced input...

This project enables the user to create a high current DC-DC converter. The project consists of a high current inductor, high current low voltage 2 x MOSFETs, half-bridge driver LT1158 chip, voltage feedback using onboard R9 and R10 resistor dividers, shunt resistor for overcurrent...

Panasonic AQY4C PhotoMOS PCB Mount Solid State Relays are CC-type, normally closed, ultra-miniature, TSON packaged (1.95mm x 1.80mm x 0.8mm) relays using capacitive isolation technology. These relays are approximately 88% smaller than the previous SOP-packaged devices, offering a 3.5mm2...