Analog Devices Inc. ADTF3175 1-MegaPixel Time-of-Flight Module
Analog Devices ADTF3175 1-MegaPixel Time-of-Flight Module is based on the ADSD3100, a 1-Megapixel CMOS indirect Time-of-Flight (iToF) imager and designed for high-resolution 3D depth sensing and vision systems. The ADTF3175 integrates a lens and optical bandpass filter for the imager,...
Continue ReadingMicrochip’s MCP9700 and MCP9701 low-power linear active thermistor ICs provide a low-cost solution
Microchip's low-power MCP9700, MCP9700A, MCP9700B, MCP9701, and MCP9701A analog temperature sensors with linear active thermistor integrated circuit (IC) convert temperature to analog voltage. These sensors have accuracy of ±1°C from +20°C to +70°C (MCP9700B), ±2°C from 0°C to...
Continue ReadingIT8500G+ Series DC Electronic Load
ITECH's IT8500G+ series programmable DC electronic load for ATE systems and component testing ITECH's IT8500G+ series, with a sampling bandwidth of up to 300 KHz, is a programmable DC electronic load specifically designed for high-precision ripple testing. With the built-in ripple...
Continue ReadingDRV8317 3-Phase PWM Motor Driver
Texas Instruments' integrated MOSFET driver is suitable for driving 3-phase motors Texas Instruments' DRV8317 3-phase PWM motor driver provides three integrated MOSFET half-bridges for driving 3-phase brushless DC (BLDC) motors with 5 V, 9 V, 12 V, or 18 V DC rails or 2s to 4s...
Continue ReadingBD14210G ±1% Accuracy Current Sense Amplifier
ROHM’s current sensing IC has a space-saving design that decreases the mounting area by 46% ROHM’s BD14210G-LA current sense amplifier guarantees long time support in the industrial market. This device operates from a single 2.7 V to 5.5 V power supply. It has a wide common-mode...
Continue ReadingThermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series
Bourns' TCO mini-breaker devices are tested to AEC-Q200-listed stress tests AD and SD series resettable miniature thermal cutoff (TCO) mini-breaker devices from Bourns, Inc. are the first TCO devices tested by Bourns to AEC-Q200-listed stress tests. The AD and SD series’ advanced...
Continue ReadingET980 COM Express Module with 12th Gen Intel Core Processors for Edge Computing
IBASE Technology Inc, a world leader in the manufacture of embedded boards and solutions, has added the ET980 series of COM Express modules to its portfolio. Supporting the U-series and P-series of 12th Gen Intel® Core™ processors from i3-1220PE to i7-1265UE (12M Cache, up to...
Continue ReadingDiscover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors
LEMO is thrilled to announce the expansion of its field-proven S Series push-pull connectors with the new 1S.275 Series for 12G-SDI (Serial Digital Interface) 4K Ultra High Definition transmission. The new robust push-pull connectors are compliant with the SMPTE ST 2082-1 standard for...
Continue Reading