Chinese manufacturer, LILYGO has continued its run of form, taking the maker niche of the hardware component market by storm with the release of incredibly thoughtful development boards and kits. It recently began selling its newest display module development board; the T-Display-S3...

SeedStudio has launched the reComputer J101 and J202 carrier boards designed to work perfectly with the 260-pin SODIMM modules from NVIDIA. The reComputer J202 has the same size and nearly the same functional design as Nvidia’s official Jetson Xavier NX devkit carrier board, while the...

Edge AI specialist, EyeCloud.AI, is getting set to launch a new OpenNCC Neural Compute Board (NCB) that will act as an open-source alternative to Intel’s Neural Compute Stick 2 (NCS2) in edge AI and computer vision projects. The accelerated AI reference platform will support on-board...

onsemi AR0821 | 4K resolution | HDR | GMSL2 | Multi-camera | NVIDIA Jetson AGX Orin™ e-con Systems™, a leading embedded camera company, launches NileCAM81_CUOAGX, a 4K HDR GMSL2 multi-camera solution for NVIDIA Jetson AGX Orin™ / AGX Xavier™ based on the...

1. Introduction In this project, we will use a PIR sensor to detect motion. Once motion is detected, it will trigger an interrupt and the BleuIO dongle connected to the board will advertise for 25 seconds. You can expand the project based on your needs further. A PIR (passive...

Trameto, a manufacturer of power management semiconductors for energy harvesting (EH PMICs) announces a demonstration platform that enables engineers to quickly evaluate how micro-energy harvesting can reduce or eliminate the use of batteries in IoT devices such as sensors and the...

Epishine has developed a solar cell optimized for indoor use. The light energy harvesting (LEH) modules are optimized to convert light from indoor lighting into enough energy to power small electronic devices. The LEH module is only 0.2mm thick, making it straightforward to fit into...

HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more...