Amsterdam-based embedded device manufacturer Actinius has launched a cost-effective cellular IoT board in a feather wing form factor, Icarus, built around the Nordic Semi nRF9160 modem and combines LTE-M and NB-IoT connectivity. Adafruit Feather boards have been very popular due to...

I'm definitely not the only one that thinks PCB rulers are awesome. I grab one every chance I get, events, gift bags, etc., and I may have too many of them right now, but don't blame me, they carry those minute but important information and drastically reduce the time you spend...

We recently witnessed the market position of Infineon in the embedded systems with the integration of its CYW43439 wireless chip into the very famous Pico family, Raspberry Pi Pico W microcontroller board. The company recently announced a battery-powered Smart Alarm System, which is a...

JLCPCB for faster electronics manufacturing, carrying out its new standard PCB assembly service as an ace project created by JLCPCB, has been committed to reducing PCB assembly costs, improving ordering experience, speed up SMT lead-time, therefore, it gives the hand for professional...

The global semiconductor giant STMicroelectronics has simplified interaction with trained devices with its new inertial sensor ISM330ISN featuring an Intelligent Sensor Processing Unit (ISPU). ISPU is essentially a low-power, high-performance programmable core with high computational...

Specialist in extreme low-power wireless IoT modules and a fabless semiconductor company, InnoPhase has announced its partnership with Ingenic Semiconductor Co Ltd. which is known to be superior in the world of microprocessors and CPU technologies. The primary aim of this partnership is...

Since machine vision is increasingly becoming important in the field of robotics development, several top-level companies in the robotic industry are taking interest in projects that aid the rapid development of hardware-accelerated applications for robotics, machine vision, and...

Japanese communications and embedded device manufacturer, Brookman Technology, collaborated on using a hybrid Time-of-Flight method developed by Prof. Shoji Kawahito of Shizuoka University. The collaboration has led to the (as claimed) "world's first" next-generation 3D Time-of-Flight...