![Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology](https://www.electronics-lab.com/wp-content/uploads/2022/06/ST-Metalenz-metasurface-technology-1024x482.jpg)
Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology
Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership. The meta-optics technology by...
Continue Reading![Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules](https://www.electronics-lab.com/wp-content/uploads/2022/06/01-AAEON-EW22-header-1024x512.jpg)
Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules
Providing High-Performance Computing in a Globally Connected World AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard Extensive lineup of COM Express modules from AAEON...
Continue Reading![Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4 Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4](https://www.electronics-lab.com/wp-content/uploads/2022/06/Figure-1-BPI-CM4.jpg)
Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4
Banana PI has announced the release of its new cost-efficient computer module BPI-CM4 for enhanced performance in embedded applications. The company has stated that this new Banana Pi BPI-CM4 replicates Raspberry Pi’s Compute Module 4 (CM4). This board was developed as a substitute or...
Continue Reading![MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands](https://www.electronics-lab.com/wp-content/uploads/2022/06/MediaTek-Filogic-380-and-Filogic-880-SoC.jpg)
MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands
The Taiwan-based fabless semiconductor company, MediaTek, announces its Wi-Fi 7 platforms, Filogic 880 and Filigoc 380, which offer high-bandwidth applications in the operator, retail, enterprise, and consumer electronics industries. The IEEE 802.11be, also known as the 7th generation...
Continue Reading![MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones](https://www.electronics-lab.com/wp-content/uploads/2022/06/Mediatek-Dimensity-1050-1024x576.jpeg)
MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones
The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The...
Continue Reading![Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit](https://www.electronics-lab.com/wp-content/uploads/2022/06/U-Blox-XPLR-IOT-1-kit-1024x1024.png)
Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit
To address the increasing complexity of IoT devices, U-Blox, known for developing wireless communication technologies, has announced the multifunctional application board U-Blox XPLR-IOT-1 over evaluation kits (EVKs). The hardware is an all-in-one package for testing, evaluating, and...
Continue Reading![U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6 U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6](https://www.electronics-lab.com/wp-content/uploads/2022/06/U-Blox-LARA-L6.png)
U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6
U-Blox, a leading global producer of positioning and wireless communication technology, has launched the world's compact LTE Cat 4 cellular module with global coverage and 2G/3G fallback. The all-new U-Blox LARA-L6 module’s versatile interfaces, features, multi-band, and multi-mode...
Continue Reading![Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers](https://www.electronics-lab.com/wp-content/uploads/2022/06/LILYGO-T-Zigbee-ESP32-C3.jpg)
Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers
The China-based embedded electronics specialist, Lilygo, has released a low-cost development board, the T-Zigbee board that combines the ESP32-C3 microcontroller and the Telink TLSR8258 multi-protocol wireless SoC. The ESP32-C3 is a single-core Wi-Fi and Bluetooth 5 (LE)...
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