Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology
Sensor

Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology

Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership. The meta-optics technology by...

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Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules
SBC

Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules

Providing High-Performance Computing in a Globally Connected World AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard Extensive lineup of COM Express modules from AAEON...

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Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4
SBC

Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4

Banana PI has announced the release of its new cost-efficient computer module BPI-CM4 for enhanced performance in embedded applications. The company has stated that this new Banana Pi BPI-CM4 replicates Raspberry Pi’s Compute Module 4 (CM4). This board was developed as a substitute or...

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MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands
SBCTop Stories

MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands

The Taiwan-based fabless semiconductor company, MediaTek, announces its Wi-Fi 7 platforms, Filogic 880 and Filigoc 380, which offer high-bandwidth applications in the operator, retail, enterprise, and consumer electronics industries. The IEEE 802.11be, also known as the 7th generation...

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MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones
SBC

MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones

The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The...

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Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit
IoT

Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit

To address the increasing complexity of IoT devices, U-Blox, known for developing wireless communication technologies, has announced the multifunctional application board U-Blox XPLR-IOT-1 over evaluation kits (EVKs). The hardware is an all-in-one package for testing, evaluating, and...

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U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6
IoT

U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6

U-Blox, a leading global producer of positioning and wireless communication technology, has launched the world's compact LTE Cat 4 cellular module with global coverage and 2G/3G fallback. The all-new U-Blox LARA-L6 module’s versatile interfaces, features, multi-band, and multi-mode...

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Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers
IoT

Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers

The China-based embedded electronics specialist, Lilygo, has released a low-cost development board, the T-Zigbee board that combines the ESP32-C3 microcontroller and the Telink TLSR8258 multi-protocol wireless SoC. The ESP32-C3 is a single-core Wi-Fi and Bluetooth 5 (LE)...

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