![Google and SkyWater Technology collaborate to launch an Open-Silicon developer portal Google and SkyWater Technology collaborate to launch an Open-Silicon developer portal](https://www.electronics-lab.com/wp-content/uploads/2022/06/Build-Open-Silicon.jpg)
Google and SkyWater Technology collaborate to launch an Open-Silicon developer portal
With the exponential increase in the demand and requirement of silicon-based chips, Google, in partnership with SkyWater Technology, has launched a new platform to encourage and help the developer community to get started with its Open MPW shuttle program. Leveraging SkyWater’s...
Continue Reading![Crowdfunding ShaRPiKeebo handheld Linux computer comes with a Raspberry Pi Crowdfunding ShaRPiKeebo handheld Linux computer comes with a Raspberry Pi](https://www.electronics-lab.com/wp-content/uploads/2022/06/ShaRPiKeebo-Linux-Computer-scaled-1024x703.jpg)
Crowdfunding ShaRPiKeebo handheld Linux computer comes with a Raspberry Pi
French electronic designer Morpheans has launched a crowdfunding project, ShaRPiKeebo, a Raspberry Pi Zero W and Zero 2 W powered portable Linux computer that features a classic QWERTY keyboard and a 2.7-inch memory display. The tiny ShaRPiKeebo computer is designed with a low-power,...
Continue Reading![Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology](https://www.electronics-lab.com/wp-content/uploads/2022/06/ST-Metalenz-metasurface-technology-1024x482.jpg)
Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology
Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership. The meta-optics technology by...
Continue Reading![Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules](https://www.electronics-lab.com/wp-content/uploads/2022/06/01-AAEON-EW22-header-1024x512.jpg)
Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules
Providing High-Performance Computing in a Globally Connected World AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard Extensive lineup of COM Express modules from AAEON...
Continue Reading![Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4 Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4](https://www.electronics-lab.com/wp-content/uploads/2022/06/Figure-1-BPI-CM4.jpg)
Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4
Banana PI has announced the release of its new cost-efficient computer module BPI-CM4 for enhanced performance in embedded applications. The company has stated that this new Banana Pi BPI-CM4 replicates Raspberry Pi’s Compute Module 4 (CM4). This board was developed as a substitute or...
Continue Reading![MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands](https://www.electronics-lab.com/wp-content/uploads/2022/06/MediaTek-Filogic-380-and-Filogic-880-SoC.jpg)
MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands
The Taiwan-based fabless semiconductor company, MediaTek, announces its Wi-Fi 7 platforms, Filogic 880 and Filigoc 380, which offer high-bandwidth applications in the operator, retail, enterprise, and consumer electronics industries. The IEEE 802.11be, also known as the 7th generation...
Continue Reading![MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones](https://www.electronics-lab.com/wp-content/uploads/2022/06/Mediatek-Dimensity-1050-1024x576.jpeg)
MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones
The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The...
Continue Reading![Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit](https://www.electronics-lab.com/wp-content/uploads/2022/06/U-Blox-XPLR-IOT-1-kit-1024x1024.png)
Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit
To address the increasing complexity of IoT devices, U-Blox, known for developing wireless communication technologies, has announced the multifunctional application board U-Blox XPLR-IOT-1 over evaluation kits (EVKs). The hardware is an all-in-one package for testing, evaluating, and...
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