Bourns' high-power surface-mount PPTC resettable fuses expand the hold current range to 0.75 A ~ 6.0 A Bourns' Multifuse® product line expands its model MF-LSMF series high-power surface-mount polymeric positive temperature coefficient (PPTC) resettable fuses. These models expand the...

Omnivision’s OS03B10 3-MP image sensor with DVP and MIPI interface support brings high-quality images to security, IP, and HD cameras. Omnivision has introduced the OS03B10 3-megapixel (MP) 1/2.7-inch optical format CMOS image sensor for security surveillance, IP, and HD analog...

EPC's EPC9160 9 V to 24 V to dual output 5 V/3.3 V synchronous buck converter reference design EPC's EPC9160 is a 9 V to 24 V to dual output 5 V/3.3 V, 15 A synchronous buck converter operating at 2 MHz switching frequency. The EPC9160 features the EPC2055 GaN FET and LTC7890 two-phase...

Toshiba has launched a 150V N-channel power MOSFET “TPH9R00CQH” that uses the latest generation process, “U-MOSX-H,” and that is suitable for use in switching power supplies for industrial equipment - including those deployed in data centers and communications base stations....

All motherboards are equipped with a CMOS battery. In the past, it was necessary to maintain the operation of the CMOS memory, which was responsible for storing BIOS data and other parameters of a personal computer. Previously, BIOS settings were stored in CMOS memory which was powered...

Onboard-RP2040 | USB-C Type Port | Multiple HAT Connectivity | ESP8266 | 0.91 OLED | 40-Pins GPIO Connectivity | 16 Mega-Byte Flash There are several ways where you can find PiSquare very useful, as we were bound to use a single HAT on Raspberry Pi or max to max 5 Raspberry Pi HATs...

AAEON, an industry leader in embedded solutions, is delighted to announce the PICO-TGU4-SEMI, a new addition to its range of compact Pico-ITX boards. With an 11th Gen Intel® Core™ i7/i5/i3/Celeron Processor SoC, the PICO-TGU4-SEMI has extremely high CPU performance, and is the...

New innovation provides weight savings for applications where size, weight and power (SWaP) are key Teledyne Labtech announces a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards (PCBs). Heat management is a...