Already, there have been a bunch of tiny RP2040-based development boards in the market. However, due to its small size and high performance, the Raspberry Pi in-house tape out of $1.00 RP2040 MCU has increased the demand in order to manufacture compact boards. As the name suggests, the...

The STM32 IoT Discovery Kit, commonly known as B-L462E-CELL1, is a ready-to-use development platform for cellular IoT devices created by STMicroelectronics. According to ST, the Discovery kit integrates a discovery mainboard powered by an LBAD0ZZ1SE module, a global coverage antenna,...

Microchip's PIC18-Q84 8-bit PIC® MCUs with an extensive array of CIPs and CAN FD The PIC18-Q84 family of microcontrollers (MCUs) from Microchip Technology expands the 8-bit PIC MCUs by combining an extensive array of CIPs with controller area network flexible data rate (CAN FD). These...

The M95M04-DR device is electrically erasable programmable memory (EEPROM) organized as 524288 x 8 bits, accessed through the SPI bus. The M95M04-DR can operate with a supply range from 1.8 to 5.5 V, and is guaranteed over the -40 °C/+85 °C temperature range. Flexible and intensive...

Formaldehyde Sensor Module for HVAC and Indoor Air Quality Applications SFA30 is a formaldehyde detection module based on electrochemical sensing technology optimized for lowest false alarm rates. The SFA30 HCHO sensor has alow cross-sensitivity to ethanol and is optimized to operate...

Texas Instruments has announced the high-precision temperature sensor TMP114 with an I2C-compatible digital output in an ultra-thin (0.15 mm) 4-pin package. With a low height package, the TMP114 can be put under surface mount components for the fastest and most accurate temperature...

SparkFun Electronics Thing Plus - STM32 offers power and precision with a 32-bit ARM® Cortex®-M4 RISC core. The Thing Plus provides a DFU bootloader for uploading code and incorporates an extensive range of enhanced I/Os and peripherals. The STM32 Thing Plus utilizes the handy Qwiic...

Murata has developed a silicon process technology capable of fabricating silicon capacitors with a density of 1.3 µF/mm². Intended for the mobile and high-performance computing (HPC) markets these devices have an extremely low ESL (few pH) and low ESR (few mΩ) which support the high...