AAEON Reimagines its Flagship UP Board with the Introduction of the UP 710S
Wi-Fi support, serial communication, and a slimmer design make the UP 710S a modernized industrial board with deep ties to its origins. AAEON's UP brand , which began with the creation of the credit-card sized UP developer board almost a decade ago, has introduced the UP 710S, a...
Continue ReadingxMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro Speaker
At one-seventh the size and one-third the thickness of conventional dynamic-drivers, Sycamore gives product designers the space and freedom to innovate thinner and lighter mobile device form factors. Santa Clara, California, November 19, 2024 – xMEMS Labs, developers of the foremost...
Continue ReadingKAGA FEI ES4L15BA1 Low-Power BLE Module Features Cortex-M33, RISC-V Coprocessor, and Multi-Rate BLE Support
Kaga FIE has recently announced the ES4L15BA1, a Low-Power BLE wireless module that’s currently under development, designed to offer high-performance connectivity with Bluetooth 6.0, supporting data rates of 2M, 1M, 500k, and 125kbps, as well as advanced features like Angle of Arrival...
Continue ReadingCompex Systems Unveils Wi-Fi 7 Modules with Smart Connectors, Enabling Seamless Multi-Link Operation (MLO) Integration on Conventional CPU Platforms
Compex Systems (Compex), a global leader in wireless communication technology, is taking Wi-Fi 7 to new heights with an innovative connector design for Multi-Link Operation (MLO). This breakthrough enables seamless deployment of MLO across off-the-shelf platforms, including those with...
Continue ReadingTerraMaster Launches Five New BBS Integrated Backup Servers
Offering Comprehensive Hardware and Software Backup Solutions for Businesses In an era where data has become a core asset for modern enterprises, TerraMaster, a global leader in data storage and management solutions, has announced the official launch of five high-performance integrated...
Continue ReadingMYC-LR3576 System-On-Module
The MYC-LR3576 System-On-Module (SOM), with its compact size of 43mm x 45mm, delivers exceptional reliability for your upcoming embedded design projects. Powered by the robust Rockchip RK3576 application processor, it boasts a quad-core Cortex-A72 and a quad-core Cortex-A53, an...
Continue ReadingAAEON’s FWS-2370 Offers up to 14 LAN with Power-Optimized Intel Soc for High-Speed Networking Solutions
The FWS-2370 is the most expansive, versatile network platform AAEON has ever developed, offering unparalleled wired and wireless networking options. AAEON, a leading provider of scalable and flexible network solutions, has expanded its network security catalog with the launch of the...
Continue ReadingRohde & Schwarz presents the R&S RTB 2, a new entry level oscilloscope with class leading specifications
Rohde & Schwarz upgrades its oscilloscope portfolio with the new R&S RTB 2, an evolution of the R&S RTB2000, which was the first entry level oscilloscope to offer touchscreen operation and 10 bit vertical resolution. The R&S RTB 2 expands on these class leading features...
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