Seeed Studio has recently released the XIAO ESP32S3 for Meshtastic and LoRa development kit that integrates the XIAO ESP32S3 board with the compact Wio-SX1262 LoRa module, connected via a board-to-board interface for seamless operation. The dual-core Xtensa ESP32S3 processor powers the...

Synaptics has finally revealed the SYN4383 and the SYN43756(E) high-performance, compact tri-band SoCs, that integrate Wi-Fi, Bluetooth, and IEEE 802.15.4 radios to optimize wireless connectivity for IoT devices. Both chips support Wi-Fi 6/6E with 2x2 MIMO antenna configurations,...

StreamUnlimited has recently developed in partnership with Realtek Semiconductors, the Stream210, a compact, embedded hardware module designed for audio streaming and IoT applications. This module supports Realtek Ameba RTL8730E as its core, chosen for its performance in power, size,...

In industries with advanced equipment, precise and efficient voltage sources are essential, especially for applications involving nanoampere-level current measurements. One notable innovation in this area is the NanoTracer, developed by Gero Mueller and INRIA, which delivers a...

The DFI RPS101/RPS103 is a Mini-ITX industrial motherboard designed specifically for automation and kiosk applications. It supports Intel Core processors from the 12th to the 14th generation, making it suitable for real-time processing in industrial environments. With a compact form...

Datanoise is a Berlin-based music hardware company, that recently released the PicoADK v2 by Datanoise, the successor to PicoADK v1 is designed for Audio Digital Signal Processing (DSP). It is a Synthesizer Development Platform used for building and experimenting with sound synthesis....

Wi-Fi support, serial communication, and a slimmer design make the UP 710S a modernized industrial board with deep ties to its origins. AAEON's UP brand , which began with the creation of the credit-card sized UP developer board almost a decade ago, has introduced the UP 710S, a...

At one-seventh the size and one-third the thickness of conventional dynamic-drivers, Sycamore gives product designers the space and freedom to innovate thinner and lighter mobile device form factors. Santa Clara, California, November 19, 2024 – xMEMS Labs, developers of the foremost...