A few years ago, one of Google’s hardware partners, TechNexion, launched a 2 board development kit that consists of a System-on-Module and a carrier baseboard – the PICO-PI-IMX7. PICO-PI-IMX7 is a highly-integrated single board computer with enhanced features designed to enable...

We saw thermal imaging cameras for the evaluation of the hardware temperature of various devices. Open thermal camera is compatible with mobile phone applications for thermal imaging and FLIR ETS320 a non-contact thermal imaging camera solution for electronic testing are some of the...

AppSens, a Norway-based medical technology manufacturer, designed 'ECG247 Smart Heart Sensor' - a Bluetooth LE enabled wearable ECG sensor, powered by Nordic's nRF52832 SoC, to detect irregular heartbeats. This device is a wearable electrocardiographic (ECG) heart monitor designed to...

Generally, the SoCs have complex integration processes for deployment purposes. Even if the integration is simple then there is a compromise with the performance factor of the device. Tibbo Technology’s Plus1 SP7021 SoC ensures simple integration with efficient performance comparable...

Leading global defense technology company, RADA, signs letter of intent to invest $3M in RadSee RadSee Technologies Ltd. announced the availability of the automotive industry’s first 4D imaging radar for ADAS and autonomous vehicles able to deliver ultra-high performance and...

With two new source measure units (SMU), Rohde & Schwarz enters a market previously not addressed by the power products of the test and measurement specialist. The performance of the new R&S NGU201 and R&S NGU401 SMUs enables simultaneous sourcing and measuring of currents...

Miniaturization and micro-devices company Xidas has introduced what it says is the industry's first plug & play, universal energy harvesting and power management module for IoT devices. The EHM-UNIV, says the company, is a small surface-mount energy harvesting and power management...

Vishay Techno CDMM AEC-Q200 SMD Thick Film Chip Dividers are high voltage or high precision chip dividers offered in a ribbed molded package with compliant surface-mount leads. Designed to reduce component counts, improve TC tracking performance, and ratio stability in automotive and...