Metcal announced plans to launch its new GT90 and GT120 Soldering Systems. The GT90 and GT120 offer market-leading performance due to their use of inductive heating technology and are Metcal’s first platforms with adjustable temperature offered to the market. The GT family of...

The more the electronic devices to charge, the more the multiple-port USB chargers to have, especially intelligent ones! Yes, charging multiple devices at the same time can be very tiring; from having to deal with the mess of the plenty of cables and adapters needed for the different...

Arrow Electronics, Panasonic Industry, and STMicroelectronics (ST) have introduced a low-power wireless multi-sensor edge-intelligence solution for smart factory, smart home, and smart life applications. The IoT Solution Module combines Arrow’s engineering and global distribution...

New tool, ‘Code Defect AI,’ allows earlier discovery of bugs, minimizing the cost to fix them and speeding up the development cycle. Altran, the global leader in engineering and R&D services, today announced the release of a new tool available on GitHub that predicts the...

IBASE Technology Inc., a leading provider of industrial motherboard and rugged computing solutions, is pleased to announce its AMS210 high-performance embedded box PC. Designed for factory automation, machine vision, digital signage and a wide range of industrial IoT applications, the...

SkyTraq announced a 12- x 16-mm size PX1122R multi-band RTK receiver for centimeter-level accuracy GNSS positioning applications. The receiver works with all the four global navigation satellite systems using GPS L1/L2C, Galileo E1/E5b, GLONASS L1/L2, and Beidou B1I/B2I signals...

Murata Electronics today announced that their LTE-M solution powered by Altair Semiconductor’s advanced cellular chipset has secured Deutsche Telekom certification for operating on the carrier’s German 4G LTE wireless network. Measuring just 11.1 x 11.4 x 1.4 mm, the module is the...

SMART Wireless Computing® (part of SMART Global Holdings), a leading provider of Snapdragon™ embedded computing platforms and solutions, today announced a compact compute module in an LGA package, Inforce 6503. Inforce 6503 enables advanced visual computing, enhanced graphics,...