![Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip](https://www.electronics-lab.com/wp-content/uploads/2019/10/intrinsyc_openq845usom.jpg)
Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip
Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of...
Continue Reading![Toradex announces its Apalis SoM based on the NXP i.MX 8QuadMax applications processor Toradex announces its Apalis SoM based on the NXP i.MX 8QuadMax applications processor](https://www.electronics-lab.com/wp-content/uploads/2019/10/Toradex-Apalis-iMX8-SoM-1024x713.jpg)
Toradex announces its Apalis SoM based on the NXP i.MX 8QuadMax applications processor
Toradex, a leader in embedded computing, announced today general availability for its Apalis System on Module (SoM) based on the NXP® i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers...
Continue Reading![Arduino MKR 20×4 I2C OLED shield Arduino MKR 20×4 I2C OLED shield](https://www.electronics-lab.com/wp-content/uploads/2019/10/2019-10-09T05-39-07.913Z-IMG_20190810_143535-1024x804.jpg)
Arduino MKR 20×4 I2C OLED shield
20x4 character alphanumeric I2C OLED shield for Arduino MKR series. It provides high quality OLED screen to the newest Arduino platform. With 3.3V operation you can power your project from lithium battery. This is a bright and wide temperature range OLED that works below freezing,...
Continue Reading![Microchip simplifies hardware-based IoT security Microchip simplifies hardware-based IoT security](https://www.electronics-lab.com/wp-content/uploads/2019/10/190902-spg-pr-trustplatform-9x5-1024x569.jpg)
Microchip simplifies hardware-based IoT security
A pre-provisioned solution that provides secure key storage for low-, mid- and high-volume device deployments using the ATECC608A secure element is now available from Microchip Technology. According to the company, the Trust Platform for its CryptoAuthentication family enables companies...
Continue Reading![New MKR WAN 1310 for LoRa connectivity comes with 2MByte Flash and extended battery life New MKR WAN 1310 for LoRa connectivity comes with 2MByte Flash and extended battery life](https://www.electronics-lab.com/wp-content/uploads/2019/10/abx00029_unbox.jpg)
New MKR WAN 1310 for LoRa connectivity comes with 2MByte Flash and extended battery life
Arduino announced the launch of the Arduino MKR WAN 1310, which offers a practical and cost-effective solution for those looking to add LoRa connectivity to their projects. The new MKR WAN 1310 enables you to connect your sensors and actuators over long distances harnessing the power...
Continue Reading![Extend battery life with the 60nA quiescent current TPS62840 Extend battery life with the 60nA quiescent current TPS62840](https://www.electronics-lab.com/wp-content/uploads/2019/10/med_tps62840-1dlcevm55_tps62840-1dlcevm55-angled.jpg)
Extend battery life with the 60nA quiescent current TPS62840
If you’re looking to reduce quiescent current and extend the lifetime of your system’s battery, then the TPS62840 is the device for you. At an astonishing 60nA of operating IQ, TPS62840 is the world’s lowest quiescent current DC/DC switching regulator. From IoT to smart meters,...
Continue Reading![RK3328-based industrial SBC eases Raspbian porting RK3328-based industrial SBC eases Raspbian porting](https://www.electronics-lab.com/wp-content/uploads/2019/10/novasom_m7plus_hdmi.jpg)
RK3328-based industrial SBC eases Raspbian porting
In February, Novasom Industries launched its Linux-powered, Rockchip RK3328 based SBC-M7 single board computer, which Novasom now calls the Novasom M7, along with an SBC-M8 board based on a Snapdragon 410E. Now, Novasom has followed customer feedback to upgrade the somewhat Raspberry...
Continue Reading![Samsung unveils 12-layer 3D-TSV chip packaging technology Samsung unveils 12-layer 3D-TSV chip packaging technology](https://www.electronics-lab.com/wp-content/uploads/2019/10/samsung-bonding-1024x617.jpg)
Samsung unveils 12-layer 3D-TSV chip packaging technology
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @...
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