![Samsung’s Two New USB PD Controllers support up to 100W-charging Samsung’s Two New USB PD Controllers support up to 100W-charging](https://www.electronics-lab.com/wp-content/uploads/2019/05/1559113144_6344-1024x400.jpg)
Samsung’s Two New USB PD Controllers support up to 100W-charging
SE8A is the first power delivery controller with embedded Secure Element for added protection against unauthorized chargers The new chips support up to 100W-charging and meets latest USB-PD 3.0 specifications. Samsung Electronics, a world leader in advanced semiconductor technology,...
Continue Reading![Sensirion – Evaluation Kit for Environmental Sensors with New Modular Approach Sensirion – Evaluation Kit for Environmental Sensors with New Modular Approach](https://www.electronics-lab.com/wp-content/uploads/2019/05/Sensirion_PressRelease_EvaluationKit_SEK-ES_300dpi-1024x395.jpg)
Sensirion – Evaluation Kit for Environmental Sensors with New Modular Approach
Sensirion, the expert in environmental sensing, relaunches the evaluation kit SEK-Environmental Sensing with a new modular approach. The SEK-Environmental Sensing allows engineers to evaluate sensors and develop innovative sensor applications even more quickly and easily. The kit...
Continue Reading![Intel launches first 10th Gen Ice Lake CPUs with 10nm fabrication Intel launches first 10th Gen Ice Lake CPUs with 10nm fabrication](https://www.electronics-lab.com/wp-content/uploads/2019/05/Intel-10th-Gen-Chip-Motherboard-690x690_c-e1559120884787.jpg)
Intel launches first 10th Gen Ice Lake CPUs with 10nm fabrication
10th Gen Intel Core Processors: Highly Integrated; Broad-Scale AI to the PC Intel announced the first 10th Gen Intel Core processors, bringing high-performance AI to the PC at scale with Intel® Deep Learning Boost (Intel DL Boost). The processors are built on the company’s 10nm...
Continue Reading![Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform](https://www.electronics-lab.com/wp-content/uploads/2019/05/212A-SOM-front-web-lrg.jpg)
Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform
Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things...
Continue Reading![Maximizing power density and thermal performance in power-module designs Maximizing power density and thermal performance in power-module designs](https://www.electronics-lab.com/wp-content/uploads/2019/05/4b9ae7db7071ff6f7b909ca682dbf752.png)
Maximizing power density and thermal performance in power-module designs
Power-module designs require high power density, excep-tional thermal performance and a full feature set in order to be competitive. One way that power-module designs can meet these needs is with buck controllers with exter-nal metal-oxide-semiconductor field-effect transistors...
Continue Reading![Ruideng DPS5020 – 50V 20A Power Supply Module Review Ruideng DPS5020 – 50V 20A Power Supply Module Review](https://www.electronics-lab.com/wp-content/uploads/2019/05/DPS5020-e1558541347588.jpg)
Ruideng DPS5020 – 50V 20A Power Supply Module Review
The DPS5020 is a constant voltage/current programmable control power supply module, that integrates analog and digital control in one device. Th e module is a 0-50V/0-20A Lab PSU module that comes in 2 parts, the main controller and a front panel. The main board has connections for...
Continue Reading![Future Electronics presents Ultra-low power Bluetooth 5.0 radio SoC Future Electronics presents Ultra-low power Bluetooth 5.0 radio SoC](https://www.electronics-lab.com/wp-content/uploads/2019/05/171806266_OnSemiconductor_RSL10Multi-ProtocolSystem-on-Chip.png)
Future Electronics presents Ultra-low power Bluetooth 5.0 radio SoC
The RSL10 from ON Semiconductor is an ultra-low power Bluetooth® 5.0 radio SoC for sensor and IoT applications. Designed for applications using 1.2V or 1.5V batteries, it runs from a supply between 1.1V and 3.3V without the need for a DC-DC converter. Ultra-low power Bluetooth 5.0...
Continue Reading![Open frame non-isolated DC-DC converter is only 3.50mm thick Open frame non-isolated DC-DC converter is only 3.50mm thick](https://www.electronics-lab.com/wp-content/uploads/2019/05/es1-1024x683.jpg)
Open frame non-isolated DC-DC converter is only 3.50mm thick
Designed for applications requiring non-isolated step-down circuits, Mornsun’s K78-JT-500R3 Series of open frame non-isolated DC-DC converters is only 3.50mm thick, with an SMD package footprint of 12.50x13.50mm. The new series provides an ultra-wide input voltage range of 4.75 to...
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