The RSL10 from ON Semiconductor is an ultra-low power Bluetooth® 5.0 radio SoC for sensor and IoT applications. Designed for applications using 1.2V or 1.5V batteries, it runs from a supply between 1.1V and 3.3V without the need for a DC-DC converter. Ultra-low power Bluetooth 5.0...

Designed for applications requiring non-isolated step-down circuits, Mornsun’s K78-JT-500R3 Series of open frame non-isolated DC-DC converters is only 3.50mm thick, with an SMD package footprint of 12.50x13.50mm. The new series provides an ultra-wide input voltage range of 4.75 to...

Latest generation II motor predriver offers more Flash memory, LIN interface and easy sensor integration. Melexis announces the latest addition to its generation II embedded motor driver product portfolio for automotive applications, with the release of the MLX81206. This single-chip...

Snapmaker, the 3D printer brand that had the second most funded and fulfilled 3D printing campaign on Kickstarter, has secured another crowdfunding success with the launch of the Snapmaker 2.0. Having raised over $2M in only an hour on Kickstarter, the Snapmaker 2.0 is the latest...

This 16×2 LCD shield for Arduino Nano includes various addons, like 5 Tactile Switches, 3 Trimmer Potentiometers, LM35 Temperature sensor and the 16×2 LCD itself. It’s a compact shield designed to fit in small enclosures and it is intended to develop measuring devices like...

A few weeks ago, we examined the features of ESP32 module and built a simple hello world program to get ourselves familiar with the board. Today, we will continue our exploration of the ESP32 on a higher level as we will look at how to interface a 16×2 LCD with it. Displays provide a...

Bipolar transistors in LFPAK56 – the true power package for smart efficiency These high-power bipolar transistors, housed in LFPAK56 (Power-SO8) packages, deliver DPAK-like thermal and electrical performance in just half the footprint. Offering reliable, energy-efficient performance,...

Avnet Integrated has incorporated AMD’s R1000 embedded processor family, based on the Ryzen core architecture, into its COM Express Type 6 modules. The ready-to-use computer on modules (COMs) enable developers to quickly implement the new processor technology in compact embedded...