Intel launches first 10th Gen Ice Lake CPUs with 10nm fabrication
10th Gen Intel Core Processors: Highly Integrated; Broad-Scale AI to the PC Intel announced the first 10th Gen Intel Core processors, bringing high-performance AI to the PC at scale with Intel® Deep Learning Boost (Intel DL Boost). The processors are built on the company’s 10nm...
Continue ReadingIntrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform
Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things...
Continue ReadingMaximizing power density and thermal performance in power-module designs
Power-module designs require high power density, excep-tional thermal performance and a full feature set in order to be competitive. One way that power-module designs can meet these needs is with buck controllers with exter-nal metal-oxide-semiconductor field-effect transistors...
Continue ReadingRuideng DPS5020 – 50V 20A Power Supply Module Review
The DPS5020 is a constant voltage/current programmable control power supply module, that integrates analog and digital control in one device. Th e module is a 0-50V/0-20A Lab PSU module that comes in 2 parts, the main controller and a front panel. The main board has connections for...
Continue ReadingFuture Electronics presents Ultra-low power Bluetooth 5.0 radio SoC
The RSL10 from ON Semiconductor is an ultra-low power Bluetooth® 5.0 radio SoC for sensor and IoT applications. Designed for applications using 1.2V or 1.5V batteries, it runs from a supply between 1.1V and 3.3V without the need for a DC-DC converter. Ultra-low power Bluetooth 5.0...
Continue ReadingOpen frame non-isolated DC-DC converter is only 3.50mm thick
Designed for applications requiring non-isolated step-down circuits, Mornsun’s K78-JT-500R3 Series of open frame non-isolated DC-DC converters is only 3.50mm thick, with an SMD package footprint of 12.50x13.50mm. The new series provides an ultra-wide input voltage range of 4.75 to...
Continue ReadingSingle chip from Melexis drives BLDC motors from 100 to 1,000W
Latest generation II motor predriver offers more Flash memory, LIN interface and easy sensor integration. Melexis announces the latest addition to its generation II embedded motor driver product portfolio for automotive applications, with the release of the MLX81206. This single-chip...
Continue ReadingSnapmaker 2.0 3D printer: fastest ever project to reach $1M on Kickstarter!
Snapmaker, the 3D printer brand that had the second most funded and fulfilled 3D printing campaign on Kickstarter, has secured another crowdfunding success with the launch of the Snapmaker 2.0. Having raised over $2M in only an hour on Kickstarter, the Snapmaker 2.0 is the latest...
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