MikroElektronika presents a development board with a debugger over Wi-Fi The MIKROE-3512 Fusion for Armv8 development board from MikroElektronika is designed for rapid development of embedded applications. Redesigned from the ground up, it offers broad set of standards as well as...

ADC12DJ5200RF promises the fastest sampling rate and lowest power consumption. via www.eenewsembedded.com At 8 GHz, the ADC12DJ5200RF enables engineers to achieve as much as 20 percent higher analog input bandwidth than competing devices, which gives engineers the ability to...

Contributing to delivery of wireless communication services that are stable over long distances and while moving at high speeds. Tokyo, Japan—Sony Corporation today announced the upcoming release of the CXM1501GR communication module, which is compatible with the ELTRES™...

SE8A is the first power delivery controller with embedded Secure Element for added protection against unauthorized chargers The new chips support up to 100W-charging and meets latest USB-PD 3.0 specifications. Samsung Electronics, a world leader in advanced semiconductor technology,...

Sensirion, the expert in environmental sensing, relaunches the evaluation kit SEK-Environmental Sensing with a new modular approach. The SEK-Environmental Sensing allows engineers to evaluate sensors and develop innovative sensor applications even more quickly and easily. The kit...

10th Gen Intel Core Processors: Highly Integrated; Broad-Scale AI to the PC Intel announced the first 10th Gen Intel Core processors, bringing high-performance AI to the PC at scale with Intel® Deep Learning Boost (Intel DL Boost). The processors are built on the company’s 10nm...

Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things...

Power-module designs require high power density, excep-tional thermal performance and a full feature set in order to be competitive. One way that power-module designs can meet these needs is with buck controllers with exter-nal metal-oxide-semiconductor field-effect transistors...