35V/3.2A Battery Step-Down Battery Charger with PowerPath and I2C Telemetry. by Zachary Pantely @ analog.com The first step to designing a battery charger is choosing a battery charger IC from the vast field of available solutions. To make an informed decision, a design team must first...

This project is a dashboard for displaying the outputs from up to four different sensors or Internet of Things devices. It's based on an ATtiny85 driving an SPI 96x64 SD1331 colour OLED display. by David Johnson-Davies: You can include any widgets from a selection of different types,...

Microchip has announced at Electronica 2018 in Munich its new  SAM R34/35 integrated LoRa System-in-Package (SiP) family which combines an ultra-low-power 32-bit microcontroller, a sub-GHz RF LoRa transceiver and a software stack. The chip is built specifically for the Internet of...

Do you find it hard to get up from your cozy bed at night, just to turn off the lights? Do you want to operate your home appliances simply by a click of your TV remote? Home appliances include all types of electrical equipment available in your home. It does not matter whether it is a...

Estone Technology is bringing the mobile power of Intel’s Apollo Lake processor platform and the easy integration of Power Over Ethernet technology to their latest embedded board. The new EMB-7610 from Estone Technology is a proprietary form factor board, 160mm x 90mm, designed...

SolidRun has introduced its “ClearFog CX 8K” SBC which is designed based on a “CEx7 A8040” COM Express Type 7 module that operates Linux on a quad -A72 Armada A8040. The board has a similar sandwich-style build like the earlier, dual Cortex-A9 Armada 38x driven ClearFog Pro and...

Commell the worldwide leader of Industrial Single Board Computers, has launched its Intel’s 8th Gen Coffee Lake based 3.5-inch LS-37L board. This comes after they launched the LV-67X back in August. Just like the LV-67X, the LS-37L board has the same FCLGA1151 socket, that supports up...

Process that modifies semiconductor material atom by atom could enable higher-performance electronics. Researchers from MIT and the University of Colorado have fabricated a 3-D transistor that’s less than half the size of today’s smallest commercial models. To do so, they developed...