Fabless power semiconductor startup Helix Semiconductors has started mass production of its MxC200, a configurable high-efficiency 15W DC-DC power chip. Previously known as the HS200, the MxC200 takes voltage input ranging from 12V to 48V and converts it to selectable lower...

The Mini Infra-Red Remote Robot Controller shield for Arduino Nano is designed to drive mini mobile robots. Low voltage DC Motor controller interface allows Infrared wireless control of two DC motors, two PWM and 2 Direction signal outputs to drive two motors separately. TB6612 IC is...

The Samsung ARTIK™ is an integrated IoT platform consisting of enterprise-grade modules, cloud services, and end-to-end security for the design and development of robust IoT solutions. ARTIK empowers developers with easy-to-use APIs and SDKs, extensive documentation and rich...

F&S Elektronik Systeme has unveiled its latest Pico-ITX format (100 x 72mm) SBC named ArmStone™MX8M. This board is powered by the NXP i.MX processor. Preliminary shipping will not until Q2 of this year. The new ArmStone™MX8M is available with dual or quad-core...

Use PiSupply's PaPiRus ePaper display to monitor your network with a Raspberry Pi. Over the past few days I have been converting my “Speedtest-cron” code to work on the PaPiRus from PiSupply. Whilst going over the code, I decided to start a new Git Repository and rename this...

Synchronous four-switch buck-boost controller suits transport and medical use A 150V high efficiency four-switch synchronous buck-boost DC/DC controller, the LTC3777, by Analog Devices operates from input voltages above, below or equal to the regulated output voltage and had an...

Acknowledged as the UK’s leading source of advanced embedded technology, Solid State Supplies Ltd. now offers the world’s smallest Bluetooth® Low Energy (BLE) SiP module from Silicon Labs. With a package size of 6.5mm x 6.5mm x 1.4mm the BGM11S Blue Gecko SiP (System in Package)...

Intrinsyc’s new Open-Q 845 HDK Development Kit has the same Mini-ITX (170 x 170mm) dimensions and sandwich-style design as the Open-Q 835 from the previous year. The main SoC, Snapdragon 845 is integrated into the board topped by a heatsink. This dev board includes a smartphone...