With LCR-, ESR-meter, AC/DC Voltage/Current meter, Oscilloscope and Signal Generator this device covers all needs for low frequency PCB debugging. LCR-Reader-MP recently released by Siborg Systems Inc. which joins the LCR-Reader family of handheld LCR- and ESR-meters, offers users...

FastCAP Systems has launched its latest product – a board mountable chip ultracapacitor. This new product offering is the first low ESR, thin-profile, reflowable ultracapacitor on the market and is now available for purchase in FastCAP’s online store. This chip ultracap has the...

Sinovoip had announced its new board Banana Pi M2 Magic. At first, it is an ARM SoC development board that features a high computing performance in a 51mm square portable design. In addition to onboard WiFi and Bluetooth, M2 Magic offers 8GB eMMc storage and DDR3 SDRAM of 512 MB. There...

The project is built for professional photo flash systems. Circuit generates high voltage from low voltage battery to operate a photo-flash tube. The project can also be used in other applications like high voltage capacitor charger, emergency strobe, high voltage power supply,...

Virtual reality and Augmented reality became essential technologies these days. They have an important role in making products much exciting and entertaining, especially in education. Recently, Livit Studios announced its new augmented reality book series "Imagina Book". Imagina...

Technologic Systems,Inc. announced that it will be partnering with Canonical to make Ubuntu Core available for their newest single board computer: the TS-7970. The TS-7970 is a high-performance single board computer based on the NXP i.MX6 CPU which implements the ARM® Cortex A9...

Sensirion, a leading provider of environmental and flow sensor solutions, presents the STS35 temperature sensor – the most accurate sensor of the versatile STS3x series. The high-accuracy temperature sensor has been designed to fulfill the needs of demanding markets such as the...

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip...