Erich Styger @ mcuoneclipse.com has a series of tutorials using the new NXP MCUXpresso IDE. He writes: During Embedded World 2017 in Nürnberg I was lucky to get a handful LPC800-DIP boards. To get all students who were lucky to get one, here is a tutorial to make that very exciting...

Peter Clarke @  eedesignnewseurope.com reporting: Research institute IMEC has created a neuromorphic chip based on metal-oxide ReRAM technology that has the ability to self-learn. That self-learning has been applied to music making. Self-learning neuromorphic chip composes music -...

A collection of neat circuit diagrams that shows you how to properly connect almost anything to your Arduino compatible board. Live on kickstarter. ABC: Basic Connections - The Essential Book for Makers -...

Boris Landoni writes about a new open source project a DC motor controller with control LEDs: The circuit board we are presenting this time is based on the dual-bridge driver L298N, in a traditionally mounted version in a Multiwatt container with 15 staggered pins; it has two...

Dilshan Jayakody has published a new build: The current source introduced in this article is capable to handle current up to 6A with maximum input voltage of 50V. This is an operational amplifier based adjustable current source and it uses LM358 in a general voltage follower...

Ingenerare @ instructables.com show us an easy to build IoT weather station able to measure temperature, dew point, humidity, pressure, light index, and rain. He writes: A weather station is a fun project that teaches you a ton about electronics with the added benefit being an...

The LTC7820 is a fixed ratio high voltage high power switched capacitor/charge pump controller. The device includes four N-channel MOSFET gate drivers to drive external power MOSFETs in voltage divider, doubler or inverter configurations. The device achieves a 2:1 stepdown ratio from...

SK Hynix Incorporated introduced the world's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb...