Category: Parts

Murata’s Ultra-thin LW Reversed, Low ESL Chip MLCCs in 0204 inch Size Design for In-vehicle ADAS Applications Murata introduces the ultra-thin LW reversed, low equivalent series inductor (ESL) multilayer ceramic capacitor (MLCC) with a capacitance value of 1.0 µF ±20% for 4...

KEMET, a subsidiary of Yageo Corporation (“Yageo”) (TAIEX: 2327) and leading global supplier of electronic components, announces the launch of three hybrid aluminum polymer capacitor series: A780, PHA225, and PHH225. These AEC-Q200 qualified capacitors offer a combination of highly...

SiTime Corporation announced that it has entered the $2 billion precision resonator market with the ApexMEMS family of MHz resonators. These new devices are the third-generation of SiTime silicon ctechnology and are available in a variety of MHz frequencies for high-volume electronics....

Automotive Grade Devices Offer High Ripple Currents Up to 3.8 A, Operating Temperatures to +105°C, and Useful Life of 10,000 Hours at 105°C Vishay Intertechnology, Inc. today introduced a new series of low impedance, Automotive Grade miniature aluminum electrolytic capacitors...

Diodes Incorporated introduced DMT47M2LDVQ automotive compliant 40V dual MOSFET in a 3.3mm x 3.3mm package for automotive systems. It smartly integrates two n-channel enhancement-mode MOSFETs with the lowest RDS(ON) (10.9mΩ at VGS of 10V and ID of 30.2A). The low on-resistance...

Bel Fuse and premier global manufacturer of circuit protection devices, announces their 0ZT Series of high temperature SMD resettable PPTC fuses for automotive, ethernet, and other applications which require a high operating temperature range of -40°C to 125°C. The 0ZT Series include...

Recently, Qorvo, a leader when it comes to providing us with innovative RF solutions for our communication needs, acquired Decawave, a pioneer in UWB (Ultra Wide Band) technology dedicated to mobile, automotive and IoT applications. But what does this mean for us, engineers? Well, it...

The CP series of solid-state micro Peltier modules from CUI Devices has a footprint down to 3.4mm square. CUI Devices’ Thermal Management Group has launched a sreies of solid state thermoelectric cooling modules with small footprint. The micro Peltier modules have a package sizes...