Category: Sensor

Infineon launches its XENSIV PAS CO2 Shield2Go evaluation board for CO2 monitoring, which supports both Arduino and Raspberry Pi development. Infineon Technologies AG has launched the XENSIV PAS CO2 Shield2Go board for carbon dioxide (CO2) measurement. The evaluation board is...

The project presented here is a sensitive sound sensor. The circuit converts sound frequency and outputs DC voltage.  The board consists of LM358 OPAMP and LM2907 IC. LM358 is used as a dual-stage microphone preamplifier and LM2907 acts as a frequency to voltage converter. The circuit...

SparkFun has just launched a new family of four boards: the Qwiic Micro, which offers popular breakouts in a really small footprint. “Qwiic Micro is our smallest I2C-supported board form-factor yet!” says the company. “At only 0.75in. by 0.30in. (or 24.65mm by 7.62mm for metric...

The Munich based high-tech startup Toposens is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following...

The Broadcom/Avago AFBR-S4N44P164M 4×4 NUV-MT Photo Multiplier Array features encapsulation achieving excellent mechanical stability and robustness. A clear epoxy mold compound realizes these features, which is highly transparent down to UV wavelengths, resulting in a broad response in...

Analog Devices has unveiled a robust high resolution, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems -- the first ever in the industry. “Machine vision needs to make the leap to perceiving smaller, more subtle objects faster in industrial environments...

CUI Devices’ Sensors Group today announced the expansion of its ultrasonic sensors product line with a range of new ultrasonic transceiver models. Featuring ingress protection ratings of IP67 or IP68 and high frequency ratings up to 400 kHz, these ultrasonic transceivers boast...

Japanese communications and embedded device manufacturer, Brookman Technology, collaborated on using a hybrid Time-of-Flight method developed by Prof. Shoji Kawahito of Shizuoka University. The collaboration has led to the (as claimed) "world's first" next-generation 3D Time-of-Flight...