Ceva introduces Ceva-Waves Links200 multi-protocol wireless connectivity platform IP

Ceva has introduced the Ceva-Waves Links200 multi-protocol wireless connectivity platform IP that integrates multiple communication standards into a single turnkey solution, particularly targeting smart edge devices such as hearables, wearables, and consumer electronics. Importantly, the Links200 platform allows multiple wireless standards to operate simultaneously, leveraging advanced coexistence mechanisms to reduce interference. It combines Bluetooth, Zigbee, Thread, and Matter into one integrated solution.

Generally, designing a multi-protocol SoC is complex due to power optimization, interference management, and software stack integration. Ceva-Waves Links200 addresses these challenges with an optimized, preconfigured solution. The solution avoids integration issues by providing a ready-to-use hardware and software stack. Additionally, it also reduces design cycle times, allowing for faster product launches.

Interestingly, the Ceva-Waves Links200 comes with Bluetooth High Data Throughput that has more than double the traditional Bluetooth speed reaching up to 7.5 Mbps. The connectivity offers lossless, multi-channel, low-latency audio streaming for TWS earbuds, smart speakers, gaming peripherals, and car audio systems. According to Ceva, this is achieved using advanced modulation schemes optimized for TSMC 12nm FinFET process technology.

The multi-protocol wireless connectivity platform also provides compatibility with other widely adopted IoT communication standards such as Zigbee, Thread, and Matter. These standards enable low-power, short-range, and secure mesh networking for home automation, industrial applications, and smart city infrastructure. The platform IP can be combined with Wi-Fi and Ultra-Wideband (UWB) for expanded wireless connectivity options making it suitable for next-gen smart edge AI SoCs.

The Links200 provides advanced localization by enabling direction finding, useful for indoor navigation, asset tracking, and location-based services. It also provides accurate and secure ranging, essential for positioning applications. As a turnkey solution, the Links200 pre-integrates RF, MAC, PHY, controller, and protocol software to reduce complexity and time-to-market.

Ceva says that the Links200 can be further improved with AI integration through its NeuPro-Nano AI processors to bring on-device AI capabilities. These AI capabilities enable advanced AI-driven applications, such as voice recognition, predictive analytics, and real-time decision-making in smart devices.

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