Forlinx FET3506J-S SoM and OK3506J-S Carrier Board Feature Rockchip RK3506J SoC for Industrial Applications

Forlinx Embedded’s FET3506J-S System on Module (SoM) features the Rockchip RK3506J, an industrial-grade tri-core Cortex-A7 SoC designed for smart industrial applications. It operates at low power consumption of approximately 0.7W and can withstand temperatures up to +85°C at full load without additional heat dissipation.

Originally introduced in 2023 through a product roadmap, the Rockchip RK3506 was first seen in commercial products at the end of 2024 with the Luckfox Lyra and Lyra Plus. The FET3506J-S is the first SoM to integrate the industrial-grade RK3506J variant, offering enhanced reliability for demanding environments.

The SoM includes RMII, UART, CAN, and display interfaces, supporting industrial automation, transportation systems, and consumer electronics. Forlinx also provides the OK3506 carrier board, which expands connectivity and peripheral options for development and evaluation.

FET3506J-S SoM Specifications:

• SoC: Rockchip RK3506J
  • CPU:
    • 3x Arm Cortex-A7 cores @ up to 1.5 GHz
    • 1x Arm Cortex-M0 real-time core
  • GPU: 2D GPU (no VPU, no NPU)
• Memory and Storage:
  • 256MB, 512MB, or 1GB DDR3 RAM
  • 256MB NAND Flash or 8GB eMMC Flash
  • 4-bit SDIO (available if eMMC is not soldered)
  • FSPI (available if NAND Flash is not soldered)
• Display Interfaces:
  • Optional 2-lane MIPI DSI (1.5 Gbps per lane)
  • Optional 24-bit RGB LCD (RGB888) up to 1280×1280 @ 60Hz (multiplexed with FLEXBUS and DSMC)
  • FLEXBUS parallel interface for high-speed I/Os
  • DSMC data bus for PSRAM and FPGA communication (8-bit/16-bit master, 8-bit slave)
• Audio:
  • 4x SAI (2x 1-lane Tx/1-lane Rx, 1x 4-lane Tx/1-lane Rx, 1x 1-lane Tx/4-lane Rx)
  • 4-channel PDM digital microphone support
  • SPDIF TX/RX
  • Audio ADC
  • 2x Audio DSM
• Networking: 2x 10/100Mbps Ethernet (RMII)
• USB: 2x USB 2.0 including one supporting OTG
• Expansions:
  • 2x CAN 2.0 / CAN-FD
  • 3x SPI, up to 6x UART (UART0 for debugging), 3x I2C (up to 1 Mbps FSPI)
  • Up to 11x PWM
  • 10-bit SAR ADC (1MS/s, 0 to 1.8V input)
  • Up to 8x touch key interfaces
  • Up to 76x GPIOs (70x GPI, 76x GPO)
• Debugging: JTAG
• Power Supply: 5V DC
• Form Factor: 44 x 35mm
• Operating Temperature: -40°C to +85°C

Forlinx Embedded offers a Linux 6.1 BSP with support for LVGL 9.2, AMP architecture, and Linux RT, making it suitable for applications such as graphical user interfaces and real-time control systems. The company also provides the OK3506 carrier board/development board, which expands the SoM’s functionality, which will be described below.

OK3506J-S carrier board Specifications:

• SoM: Forlinx FET3506J-S
• Storage: MicroSD card slot (only supported with NAND flash version)
• Display Interface:
  • 2-lane MIPI DSI connector
  • 24-bit RGB LCD connector (up to 1280×1280 @ 60Hz)
  • Supports only one display at a time
• Audio:
  • 3.5mm audio jack (stereo output & microphone input)
  • Onboard microphone
• Networking:
  • 2x 10/100Mbps Fast Ethernet RJ45 ports
  • Wi-Fi 4 & Bluetooth 4.0 via Realtek RTL8723DU (USB 2.0) module with SMA antenna connector
  • Optional 4G LTE module via mini PCIe (USB 2.0), Nano SIM slot, and SMA antenna connector
• USB:
  • 1x USB Type-C port
  • 2x USB 2.0 Type-A ports
  • Serial Communication
  • 2x CAN Bus and CAN-FD with isolation and protection
  • RS485 with isolation and protection
• Debugging:
  • USB to serial converter via USB Type-C
  • JTAG via header
• Expansion: DSMC header
• Miscellaneous:
  • Power on/off switch
  • 6x buttons (Reset, Maskrom, VOL+, VOL-, MENU, ESC)
  • Onboard RTC chip with coin-cell battery holder
• Power Supply: 12V DC jack

Forlinx has not disclosed pricing for the FET3506J-S CPU module and OK3506J-S carrier board, similar to their other CPU modules and development boards. For more details, refer to the official product page and press release.

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