HARTING 3D-MID Component Carriers

25 August, 2022

1.269

Views0 Comments

HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature thermoplastic, enabling compatibility with reflow soldering.

Features

Universal design of substrate
Customized layout for traces
High-temperature plastic for reflow soldering
Shipped in tape and reel as sub-assembly for fully automated SMT processing

more information: https://www.harting.com/DE/en-gb/company/harting-ag-3d-mid

Please follow and like us:

tags

3D-MID chip HARTING ic MPN: 78010300005 PCB

About mixos

Email : info@electronics-lab.com

Mike is the founder and editor of Electronics-Lab.com, an electronics engineering community/news and project sharing platform. He studied Electronics and Physics and enjoys everything that has moving electrons and fun. His interests lying on solar cells, microcontrollers and switchmode power supplies. Feel free to reach him for feedback, random tips or just to say hello :-)

view all posts by admin