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Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool.
Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.
Hot rods keep the die cool – [Link]
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