login
This is the image preview of the following page:
Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool. Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted o... Read More
Image Downloads:
- full (684x456)
- thumbnail (150x150)
- medium (300x200)
- medium_large (640x427)
- large (640x427)
- 1536x1536 (684x456)
- 2048x2048 (684x456)
- re_large (684x456)
- re_xxmedium (290x230)
- re_xmedium (359x236)
- re_medium (420x320)
- re_a_xsmall (186x174)
- re_xsmall (125x96)
- crp_thumbnail (292x236)
- menu-24x24 (24x16)
- menu-36x36 (36x24)
- menu-48x48 (48x32)
- woocommerce_thumbnail (300x225)
- woocommerce_single (600x400)
- woocommerce_gallery_thumbnail (100x100)
- wp_rp_thumbnail (150x150)
- wp_rp_thumbnail_prop (150x100)
RELATED POSTS
15 December, 2019 Introduction to UTSOURCE.net Parts Distributor
21 April, 2022 Vishay RAME0x Rotational Absolute Magnetic Encoders
13 May, 2020 BeagleBone Green Gateway SBC features Sitara AM3358, Ethernet, and a DC Jack
29 October, 2019 SEGGER Embedded Studio now supports DAP-Link
22 September, 2015 Industruino – Arduino compatible industrial controller
7 January, 2020 FPGA platform is twice as fast at half the power
