iWave Systems’ iW-RainboW-G30M System-on-Module and iW-RainboW-G30D Development Kit
iWave Systems has designed a new SoM that is based on the highly power-efficient AMD Xilinx ZU4/ZU5/ZU7 Zynq UltraScale+ FPGA MPSoC which is claimed to deliver advanced capabilities to LiDAR sensors. The new iW-RainboW-G30M SoM best suits scientific and military projects such as point cloud pre-processing, signal processing and machine learning acceleration. It is equipped with up to 4GB of RAM for the programmable logic, 8GB of RAM for the processing system, 240-pin high-density, 4x GTR transceivers, 16x high-speed PL-GTH transceivers at up to 16.3Gbps and high-speed connectors with many user I/Os.
Key Features and Specifications of the iW-RainboW-G30M Include:
- ZU7/ZU5/ZU4 – Zynq ultrascale+ MPSoC with processing system featuring
- 2x or 4x Arm Cortex-A53 core @ 1.5GHz, 2x Cortex-R5 cores @ 600MHz
- Arm Mali-400 MP2 GPU @ 677MHz
- H.264/H.265 Video Encoder/Decoder
- FPGA with up to 504K Logic Cells and 230K LUTs
- 16bit, 2GB DDR4 RAM for PL upgradeable up to 4GB
- 64-bit, 4GB DDR4 RAM for PS upgradeable up to 8GB
- Upgradeable 8GB eMMC flash
- RGMII Ethernet PHY transceiver
- USB 2.0 ULPI transceiver
- 240-pin board to board connector from PS Block
- 4-bit SD interface
- 1x GbE using PHY on the SoM; 1x RGMII interface
- 1x USB 2.0 OTG port
- Optional ULPI interface
- Up to 6Gbps high-speed PS-GTR transceivers (2x)
- 1x SPI, 2x CAN bus, 1x UART, 2x I2C
- Debug UART, PS JTAG
- 240-pin board to board connector from PL Block
- Up to 16.3 Gbps high-speed PL-GTH transceivers (16x)
- Up to 48x LVDS IOs/96x single-ended (SE)
- Up to 23x LVDS IOs/46x single-ended (SE)
- GC Global Clock Input pins – Up to 15x LVDS/SE
- Up to 16x differential/single-ended ADC input pins
- Power Input: 5V through B2B connector
- Temperature Range: -40°C to +85°C
- Dimensions: 75mm x 95mm
- Environmental Specification and Compliance: RoHS & REACH, CE
- OS Support: Linux BSP – Petalinnux/vivado 2020.1 and Baremetal BSP – Vivado 2020.1
The product page also talks about a hardware development kit named the iW-RainboW-G30D with the following Specifications:
- 10Gbps Ethernet through SFP+ connector
- Dual GbE through RJ45MagJack
- M.2 SATA 3.1 connector
- DP1.2a DisplayPort connector
- HD BNC connectors for video in/out
- PCIe Gen2 x4 slot
- 2x PMOD connectors
- USB 3.0 OTG
- USB 2.0 OTG
- CAN header
- RTC
- Operating temperature range: -20°C to +85°C
- Dimension: 130 mm x 140 mm
The company did not give any price details, but the SoM and the development kit seem to be available. Other useful details, such as the datasheet, user guide, software support, and documentation, can be found on the product page.