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A manufacturer and service provider for PCB prototyping, Beta LAYOUT has developed a 3D MID CAD program to speed up the prototyping and small-series manufacturing of 3D Mechatronic Interconnect Devices (MIDs). by Julien Happich @ edn-europe.com:
Circuit carriers of the three-dimensional circuit boards are produced at Beta LAYOUT using 3D printing. This eliminates the need for costly injection moulding dies, as commonly used in series production. After this, the MID components are processed on a special production line using laser direct structuring, and then assembled.
Layout software eases 3D prototype production – [Link]
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