Nexperia Industrial & Automotive LFPAK56D half-bridge MOSFETs

LFPAK56D half-bridge – 60% lower parasitic inductance and improved thermal performance

A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. Occupying 30% lower PCB area compared to dual MOSFETs for 3 phase motor control topologies due to the removal of PCB tracks whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilizes existing high volume LFPAK56D assembly processes, with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug-and-play style solution with exceptional current handling capability.

Key features

• 60% lower parasitic inductance due to internal clip connection
• 30% space saving on PCB compared to LFPAK56D dual
• High performance ID max >60 A
• Low thermal resistance
• Flexible leads for BLR
• Footprint compatible with LFPAK56D dual
• External leads for easy AOI
• Beyond AEC-Q101 for automotive products

Applications

• Handheld power tools, portable appliance and space constrained applications
• Brushless or brushed DC motor drive
• DC-to-DC systems
• LED lighting

more information: https://www.nexperia.com/packages/SOT1205.html

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