iWave launches i.MX 91 SoC powered System on Module for secure and reliable Linux edge processing solutions
SoM-CoM

iWave launches i.MX 91 SoC powered System on Module for secure and reliable Linux edge processing solutions

iWave adds to the iW-RainboW-G50M family: The Solderable NXP i.MX 91-based LGA System on Module (SoM). The SoM incorporates the newest member of the i.MX 9 applications processor series and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and...

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ICOP NX8MM-35 single board computer comes with an NXP module for industrial applications
SBC

ICOP NX8MM-35 single board computer comes with an NXP module for industrial applications

ICOP, a manufacturer of embedded devices, has recently launched the ICOP NX8MM-35, a powerful single-board computer (SBC) designed for various industrial applications. The SBC integrates the NXP i.MX 8M Mini, is a competent and efficient internal module that ensures high performance and...

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Espressif Systems ESP32-H BLE & IEEE 802.15.4 Modules
IoT

Espressif Systems ESP32-H BLE & IEEE 802.15.4 Modules

Espressif Systems ESP32-H BLE and IEEE 802.15.4 Modules are powerful, generic BLUETOOTH® Low Energy and IEEE 802.15.4 combo modules featuring the ESP32-H2 chip. The ESP32-H is suitable for building IoT applications with high requirements for power consumption. The Espressif ESP32-H...

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AAEON Announces Products Incorporating Modules from the Entire NVIDIA Jetson Orin Series, Post-GTC
AISBC

AAEON Announces Products Incorporating Modules from the Entire NVIDIA Jetson Orin Series, Post-GTC

New additions to AAEON’s line of AI edge solutions will be powered by NVIDIA® Jetson AGX Orin™, NVIDIA® Jetson Orin™ NX, and NVIDIA® Jetson Orin Nano™ modules. AAEON, an industry leading provider of edge AI solutions, will present new additions to its...

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iW-Rainbow-G50M: The NXP Semiconductors i.MX 93 SoC-Based System on Module powering energy efficient edge computing
SBC

iW-Rainbow-G50M: The NXP Semiconductors i.MX 93 SoC-Based System on Module powering energy efficient edge computing

iWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM). The SoM incorporates NXP’s powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor....

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Arduino GIGA R1 Wi-Fi has the same form factor as the Arduino Mega and Due boards
Arduino

Arduino GIGA R1 Wi-Fi has the same form factor as the Arduino Mega and Due boards

Arduino has announced its latest product, the GIGA R1 Wi-Fi, a microcontroller board designed for advanced projects that require high computational power, connectivity, and security features. The GIGA R1 Wi-Fi has the same form factor as the popular Arduino Mega and Due boards, offering...

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Toradex extends its successful Verdin System on Module portfolio with a new entrant
SBC

Toradex extends its successful Verdin System on Module portfolio with a new entrant

Based on the Texas Instruments (TI) AM62x Arm®-based processor family, Toradex’s Verdin AM62 is pin-compatible with other SoMs in the scalable Verdin product family. Toradex, a leading provider of embedded systems solutions, has announced the launch of its Verdin AM62 System on...

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Nordic Semiconductor launches its new nRF7002 development kit that supports Wi-Fi 6
IoT

Nordic Semiconductor launches its new nRF7002 development kit that supports Wi-Fi 6

Nordic Semiconductor has recently launched its new nRF7002 development kit, which supports Wi-Fi 6 and other wireless IoT protocols. The development kit is designed to provide a comprehensive platform for developers to create IoT devices that can connect to a wide range of...

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