Teseo-LIV3F GNSS Prototyping Solution by ST
GPS

Teseo-LIV3F GNSS Prototyping Solution by ST

The Teseo-LIV3F is a standalone positioning receiver IC that works simultaneously in multiple constellations (GPS, Galileo, Glonass, BeiDou and QZSS), being an easy to use GNSS (Global Navigation Satellite System) module. It brings the proven accuracy and robustness of the Teseo chips...

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Low-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC
SBC

Low-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC

IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series...

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Qorvo Ultra-Wideband (UWB) Technology Portfolio
Parts

Qorvo Ultra-Wideband (UWB) Technology Portfolio

Recently, Qorvo, a leader when it comes to providing us with innovative RF solutions for our communication needs, acquired Decawave, a pioneer in UWB (Ultra Wide Band) technology dedicated to mobile, automotive and IoT applications. But what does this mean for us, engineers? Well, it...

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Vecow Launched MTC-8000 Series Energy-Efficient Multi-Touch Computer
Products

Vecow Launched MTC-8000 Series Energy-Efficient Multi-Touch Computer

Vecow Co., Ltd., a team of global embedded experts, announced the release of the latest Industrial Multi-Touch Computer, MTC-8000 Series. Powered by energy-efficient Intel Atom™ x7-E3950 processor with Intel® HD Graphics 505 chipset, MTC-8000 Series provides astounding 3D...

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Axiomtek’s RISC-based DIN-rail Fanless Embedded System – Agent200-FL-DC
Products

Axiomtek’s RISC-based DIN-rail Fanless Embedded System – Agent200-FL-DC

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is unveiling the Agent200-FL-DC, an extremely compact RISC-based DIN-rail industrial IoT...

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Challenges involved in 5G Testing
Test/Measurements

Challenges involved in 5G Testing

The imminent large-scale rollout of 5G technology imposes new and tough challenges for designers of PCB, network equipment and electronic devices in general. 5G will not only represent an increase in data rates, but it will be a real revolution, with latency times reduced up to 1ms and...

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Nordic Semiconductor’s nRF52820 Multi-protocol SoC combines Bluetooth 5.2 with USB 2.0
Mcu

Nordic Semiconductor’s nRF52820 Multi-protocol SoC combines Bluetooth 5.2 with USB 2.0

Are you on the market for an SoC with advanced wireless connectivity in a really small package? Then, you should take a look at the Nordic Semiconductor nRF52820 SoC, that offers you advanced wireless connectivity and built-in USB 2.0, ready to size-down your awesome projects! At first...

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Mouser signs groundbreaking deal with e-peas
IC

Mouser signs groundbreaking deal with e-peas

Mouser Electronics has become the first authorized distributor of e-peas energy-harvesting PMICs and processing and sensing solutions. The products are available for immediate shipment around the world. With products that help design engineers enable their hardware to be powered...

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