Page 137 – Electronics-Lab.com

4 x 45W Quad Bridge Audio Amplifier

This is an AB class audio amplifier based on the TDA7388 chip and it is a great choice for car audio applications. This compact board has 4 channels each 26W with 4 ohms speaker. Then IC consists of a fully complementary PNP/NPN configuration and the TDA7388 allows a rail-to-rail output voltage swing with no need for bootstrap capacitors. The extremely reduced boundary components count allows very compact sets. The TDA7388’s inputs are ground-compatible and can stand very high input signals (±8 Vpk) without any performance degradation. The standard value for the input capacitors (0.1 µF) is adopted, and the low-frequency cut-off amount to 16 Hz. 4 x 3.5 mm stereo EP socket helps to feed audio signals, and the onboard screw terminal makes life easy for speaker connections, and the power supply input. Onboard jumpers are provided to select the standby and mute function. D1 indicates power present. Mounting a proper heatsink is very important for chip health.

Features

Power Supply 12V DC to 15V DC
4 x 45 W / 4 Ω max.
4 x 26 W / 4 Ω @ 14.4 V, 1 kHz, 10 %
Low distortion
Low output noise
Frequency Response 20Hz to 20 Khz
Standby function – On Board Jumper
Mute function – On Board Jumper
Automate at min. supply voltage detection
Low external component count:
Internally fixed gain (26 dB)
No external compensation
No bootstrap capacitors
Standby Current 100uA (Chip)
4 x 3 mm Mounting Holes
PCB Dimensions 73.82 x 55.09 mm

Protections

Output short circuit to GND, to VCC, across the load
Very inductive loads
Overrating chip temperature with soft thermal limiter
Load dump voltage
Fortuitous open GND
Reversed battery

Connections and Other Details

CN1: DC Supply Input Pin1 = VCC, Pin2 GND
CN2: Speaker 4, CN3: Speaker 3, CN7: Speaker 1, CN9: Speaker 2
CN4: Audio Signal Input 3
CN5: Audio Signal Input 4
CN6: Audio Signal Input 2
CN8: Audio Signal Input 1
D1 Power LED
Jumper J2: Standby (GND Standby)
Jumper J1: Mute (GND Mute)

Schematic

Parts List

NO.	QNTY.	REF.	DESC.	MANUFACTURER	SUPPLIER	PART NO
1	5	CN1,CN2,CN3,CN7,CN9	2 PIN SCREW TERMINAL PITCH 5.08MM	PHOENIX	DIGIKEY	277-1247-ND
2	4	CN4,CN5,CN6,CN8	STEREO EP SOCKET 3.5MM FEMALE	CUI AUDIO	DIGIKEY	CP1-3525N-ND
3	1	C1	2200uF/25V ELEKTROLYTIC	NICHICON	DIGIKEY	493-15830-ND
4	6	C2,C3,C6,C7,C8,C9	0.1uF/50V SMD SIZE 1206	YAGEO/MURATA	DIGIKEY
5	3	C4,C11,C12	1uF/25V SMD SIZE 1206	YAGEO/MURATA	DIGIKEY
6	1	C5	0.47uF/25V SMD SIZE 1206	YAGEO/MURATA	DIGIKEY
7	1	C10	47uF/25V ELECKTROLYTIC	NICHICON	DIGIKEY	493-10997-1-ND
8	1	C13	10uF/6.3V SMD SIZE 1206	YAGEO/MURATA	DIGIKEY
9	1	D1	LED-RED	LITE ON INC	DIGIKEY	475-1278-1-ND
10	2	J1,J2	3 PIN MALE HEADER PITCH 2.54MM	WURTH	DIGIKEY	732-5316-ND
11	1	R1	0E	YAGEO/MURATA	DIGIKEY
12	1	R2	2.2K 5% SMD SZE 0805	YAGEO/MURATA	DIGIKEY
13	1	R3	47K 5% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
14	1	R4	10K 5% SMD SIZE 0805	YAGEO/MURATA	DIGIKEY
15	1	U1	TDA7388	ST	DIGIKEY	497-11754-5-ND
16	1	U2	LM7805C/TO	TI	MOUSER	926-LM7805CT/NOPB
17	1	J1,J2-SHUNT	SHUNT	SULINS INC	DIGIKEY	S9001-ND

Connections

Gerber View

Photos

Video

TDA7388 Datasheet

4 Channel SPI Interface Isolator with three Forward and One Reverse Direction Channels

The project described here is a Quad-channel digital isolator with 5000V_RMS isolation ratings per UL 1577. The board has three forward and one reverse-direction channel which makes this project ideal for isolated SPI interface between microcontroller and subnode unit. The circuit provides isolation between the main SPI unit (microcontroller) and the SPI slave. It has high electromagnetic immunity, reduces noise, and high voltage traveling to the main unit. All the outputs are normally high, use ENABLE pins to disable the outputs. Connecting Enable 1 and Enable 2 pins to GND respective sides puts all outputs LOW and all outputs are disabled. If the input power or signal is lost then the output goes high. Level translation range: 2.25V to 5.5V.

4-wire SPI devices have four signals, 3 Forward and One Reverse-Direction

Clock (SPI CLK, SCLK)
Chip select (CS)
main out, subnode in (MOSI)
main in, subnode out (MISO)

More info about SPI: https://www.analog.com/en/analog-dialogue/articles/introduction-to-spi-interface.html

The ISO7741 device is a high-performance, quad-channel digital isolator with 5000 VRMS isolation ratings per UL 1577. This family includes devices with reinforced insulation ratings according to VDE, CSA, TUV, and CQC. The ISO7741B device is designed for applications that require basic insulation ratings only. The ISO7741 device provides high electromagnetic immunity and low emissions at low power consumption while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. These devices come with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7741 device has three forward and one reverse-direction channel.

Features

Wide supply range: 2.25 V to 5.5 V Main SPI Side
Wide supply range: 2.25 V to 5.5 V Subnode SPI Side
Level Translation Range: 2.25V to 5.5V
2 x Power LED Main SPI side and Subnode Side
100 Mbps data rate
Robust isolation barrier
100-year projected lifetime at 1500 VRMS working voltage
Up to 5000 VRMS isolation rating
Up to 12.8 kV surge capability
±100 kV/µs typical CMTI
Default output high
Wide temperature range: –55°C to 125°C
Low power consumption, typical 1.5 mA per channel at 1 Mbps
Low propagation delay: 10.7 ns typical (5-V Supplies)
Robust electromagnetic compatibility (EMC)
System-level ESD, EFT, and surge immunity
±8 kV IEC 61000-4-2 contact discharge protection across the isolation barrier
Low emissions
PCB dimensions: 40.64 x 27.94mm

Schematic

Simplified Schematic

IC Pinout and Internal Diagram

Parts List

NO	QNTY	REF	DESC.	MANUFACTURING	SUPPLIER	PART NO
1	2	CN1,CN2	7 PIN MALE HEADER PITCH 2.54MM	WURTH	DIGIKEY	732-5320-ND
2	2	C1,C3	10uF/10V SMD SIZE 1210 OR 1206	YAGEO/MUARATA	DIGIKEY
3	2	C2,C4	0.1uF/50V SMD SIZE 0805	YAGEO/MUARATA	DIGIKEY
4	2	D1,D2	LED RED OR GREEN SMD SIZE 0805	LITE ON INC	DIGIKEY	160-1427-1-ND
5	2	R1,R2	1K 5% SMD SIZE 0805	YAGEO/MUARATA	DIGIKEY
6	1	R3	4K7 5% SMD SIZE 0805	YAGEO/MUARATA	DIGIKEY
7	1	U1	ISO7741DWR	TI	DIGIKEY	296-47781-1-ND

Connections

Gerber View

Photos

Video

ISO7741 Datasheet

The new UP 4000 aims to Bridge the Gap to the Next Generation UP Board

Posted on 30 July, 2022 by mixos

The UP 4000 retains the integrity of the original UP Board but with substantial improvements for modern industrial computing solutions.

AAEON blends the classic with the modern with the introduction of the UP 4000, the successor to the trailblazing UP Board. Maintaining the classic form factor of its predecessor, the UP 4000 gives users upgrades in processing power, I/O density, and expansion options; all while remaining compatible with existing UP Board-powered systems.

Of particular note is the 30% increase in CPU speeds available with the UP 4000’s Intel^® Pentium^® N4200/ Celeron^® N3350/ Atom™ E3950 Processor SoC (formerly Apollo Lake). Further to this, there is also a twofold improvement in 3D graphics performance with the Intel Gen 9 HD processor graphics package. These upgrades give users up to 1.7 times the single thread performance compared to the previous generation, along with 1.5 times the graphics burst performance.

While the UP 4000 represents a great advancement in maker board technology, the board will follow the original UP Board’s ethos of bridging the gap by providing fantastic value for money. Despite its low price, the UP 4000 boasts a number of new features, such as a 6-pin wafer to support audio function, TPM 2.0 for enhanced security, and a HDMI 1.4 port. With the introduction of mic-in and line-out utility being supported directly via the board, a DP1.2-supporting USB Type-C connector also enables dual visual displays up to 4K at 60Hz.

Further balancing the legacy of the first-generation UP Board with the more sophisticated needs of its customers, AAEON has equipped the UP 4000 with a denser I/O containing a wealth of expansion options, all on the same 3.37” x 2.22” (85.6mm x 56.5mm) form factor.

The compact board features three USB 3.2 Gen 1 ports, two USB 2.0 via 10-pin wafer, and a USB Type-C slot, with an optional carrier board, giving customers the option of supporting Wi-Fi, 5G, or AI modules via two M.2 Key ports.

AAEON sees the UP 4000 as the foundation for superior solutions typically associated with the first-generation UP Board, such as digital signage, IOT devices, and industrial automation. With its compact design and competitive pricing, the UP 4000 represents the successor to the UP Board, while maintaining the core of what made the original iconic.

For more information on the new UP 4000, visit its product page, or directly to the UP Shop for ordering information.

Innodisk Announces Launch of Edge AI SSDs

Posted on 30 July, 2022 by mixos

Innodisk, a global leader in industrial-grade storage and embedded peripherals, is pushing the development of edge AI technology

In doing so has officially launched a new edge computing solid-state drive (SSD) product line, consisting of the 2.5” SATA 3TS6-P, 3TS9-P and M.2 (P80) 4TS2-P drives. Innodisk’s new edge AI SSDs feature low latency, high DWPD (drive writes per day), and large capacities. In addition, the included iCell and AES technologies protect data from losses and breaches. Aiming at smart retail, smart city, smart fleet management, and NAS network storage applications, Innodisk is providing high speeds, reliability, and industrial-grade high quality to respond to the rising market needs.

Research suggests that the edge data center market is expected to reach a compound annual growth rate of 24.58% between 2020 and 2028. With the rapid development of AI, IoT, and 5G, data utilization has shifted from cloud to edge applications, driving the demand for edge servers and edge data centers. Innodisk is ready to roll out edge server market solutions and open up new business opportunities.

Edge AI SSDs inside edge servers are required to process data at high speeds at the source, instead of sending all data back to a central data center, thus improving latency and reducing cost. As an example, smart street lights and traffic monitoring units rely on the SSD to provide high-speed read/write, a large capacity, and low-latency to process data in real-time, and the same can be said for edge data centers. With the series reaching 6.4TB, these new SSDs are sure to disrupt the edge storage market and improve experiences for end users.

CC Wu, GM of Innodisk’s Flash Division, pointed out that Innodisk has already actively started focusing on applications for the fast-growing 5G and AI fields. This new product line integrates Innodisk’s R&D capabilities in software, hardware, and firmware. With the introduction of specialized SSDs that combine the advantages of industrial SSDs with the characteristics of data center SSDs, Innodisk hopes to seize edge computing business opportunities and meet the needs of the ever-growing sector.

Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE

Posted on 29 July, 2022 by mixos

The Munich based high-tech startup Toposens is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following more than seven years of R&D and product commercialization.

Addressing the unmet need for higher safety of mobile robots in industrial settings, the Toposens 3D Ultrasonic Echolocation Sensor ECHO ONE^®and Toposens PROCESSING UNIT with sophisticated filters for 3D collision avoidance is now available, having been run through rigorous commercial testing in real-life industrial scenarios with reputable mobile robotic companies. This kind of “co-developing” of a high-tech product together with leading tech firms ensures highest levels of performance for the commencing serial deployment.

Detecting the Undetectable

With the autonomous vehicle industry booming and mobile robots, such as automated forklifts, AMRs and AGVs, experiencing exponential growth levels, the safety of humans and machines is kept at the forefront of manufacturing efforts. The market has come to realize that 3D collision avoidance is a necessity, since the obligatory 2D safety LiDARs can only deliver two-dimensional data output not matching highest safety needs.

Due to their physical properties, other 3D Sensor systems, such as LiDAR or camera have limitations in their perception capabilities when for example the optical conditions in their environment are unfavorable or objects like forklift forks are close to the floor. As a result, they struggle to detect objects well enough, making them an unreliable and insufficient collision avoidance solution. In fact, the leading cause of industrial accidents in 2022 has been identified as blocked vision, and the associated costs are forecast to amount to over 2,5 Bn $ by 2025 in over 50.000 factories being equipped with mobile robots. Also, the traditional one-dimensional ultrasonic sensor does not deliver the needed data for reliable 3D collision avoidance, as it can only measure simple distance data (= time-of-flight), compared to the 3D point cloud the Toposens 3D COLLISION AVOIDANCE SYSTEM is able to generate.

Toposens 3D Collision Avoidance System illustrated: Detection of forklift forks in warning zone and stopping zone

Re-defining robotic safety

Trying to find a way to compensate these shortcomings and provide the market with a best-in-class 3D collision avoidance, Toposens has over the past few years been working towards a commercial version of its
3D Ultrasonic Echolocation Sensor to serve the need for a reliable mobile robot 3D collision avoidance.

Based on the principle of echolocation as seen in bats, Toposens ECHO ONE^® compensates the drawbacks of optical sensors through sound-based triangulation in combination with sophisticated noise-filtering software. This in turn delivers robust 3D data output in real-time for each obstacle detected within the fully adjustable warning- and stopping zones. What’s more, the zones can both be set to dynamically follow a mobile robot taking a left- or right turn and adjust to the speed of the vehicle.

The sensor sends the obtained data (echo reflections perceived by three microphones) in a 3D point cloud format to the Toposens PROCESSING UNIT which is equipped with an easy-to-configure advanced 3D collision avoidance software. From there, depending on which 3D zone violations are detected, the Toposens PROCESSING UNIT triggers either a “slow down” or “stop” command to the mobile robot’s CPU. When no zone violations are detected, the mobile robot drives on.

Bat vision versus bad vision

“Being able to detect multiple difficult-to-detect obstacles reliably and in real-time, regardless of environmental conditions, enables us to provide next-level robotic safety for our customers. Our technology addresses the shortcomings of optical sensors, such as LiDARs, which can fail to detect floor-based objects like forklift forks on the floor, in unfavorable lighting conditions or transparent or mirrored object surfaces. Receiving data output in 3D, meaning in x, y, and z coordinates, guarantees the most reliable level of 3D collision avoidance”, says Tobias Bahnemann→, CEO and Co-Founder of Toposens and continues:

“Ahead of production, we have been co-developing and testing our Toposens ECHO ONE^® in pilot projects and actual real-life set-ups with renowned companies for almost two years. This has put us in a position, from which we can now offer our customers a state-of-the-art, next-level robotic safety system. With 3D collision avoidance capabilities missing in existing sensor solutions, the economic setback of damaged goods, or even expensive production stops as a consequence of undetected obstacles, can considerably limit the ROI of any mobile robot system. This highlights the necessity for mobile robots to “see” their environment using a different kind of vision technology – we call it “BAT VISION” and are delighted to now be moving on to serial production.”

Toposens is now taking orders for its first commercial version of its 3D ultrasonic collision avoidance technology with the all-new Toposens ECHO ONE^®.

ams OSRAM OSLON Black Flat X KW4 HPL631.TK LEDs (4 Chip)

Posted on 29 July, 2022 by mixos

ams OSRAM OSLON® Black Flat X KW4 HPL631.TK LEDs are high-performance 4-chip light-emitting diodes optimized for forward lighting applications. These high-efficiency LEDs offer up to 2115lm at 1000mA, making them ideal replacements for halogen lamps. The pad geometry of the OSLON Black platform offers excellent thermal performance, enabling developers to reduce heatsink size or remove it from the application design entirely.

The OSLON Black Flat X KW4 HPL631.TK LEDs from ams OSRAM has an extremely high contrast 1:200 design due to the black case material and TiO₂ casting. These devices feature a compact 7.59mm x 3.75mm x 0.50mm package ideal for high-density applications.

Features

AEC-Q102 qualified
SMD epoxy package
UX:3 chip technology
Luminous flux @ 1000mA
- KW4 HPL631.TK-BCBH-4L05M0-AGAE: 1640lm to 2040lm
- KW4 HPL631.TK-BCBJ-4L07M0-AGAE: 1640lm to 2115lm
- KW4 HPL631.TK-BDBJ-6L07M0-AGAE: 1700lm to 2115lm
120° (Lambertian emitter) typical radiation
4L07M0 color binning
White color
- Cx = 0.321
- Cy = 0.339 according to CIE 1931
Corrosion Robustness Class: 3B
Color over angle: Better than passus 3.7.2.1 of supplement proposal 7 to ECE reg. 128
ESD: 8kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
-40°C to +135°C operating temperature range
7.59mm x 3.75mm x 0.50mm package

more information: https://www.osram.com/ecat/KW%20HHL532.TK/com/en/class_pim_web_catalog_103489/prd_pim_device_13481280/

Cincon CFM20S 20W Open-Frame AC-DC Modules

Posted on 29 July, 2022 by mixos

Cincon CFM20S 20W Open-Frame AC-DC Modules offer up to 87% high efficiency and ±2% voltage accuracy. These modules feature a 90V_AC to 264V_AC universal input voltage range, 5000m operating altitude, over-voltage protection, and continuous short circuit protection. The CFM20S 20W modules are available in 1.3″ x 2.38″ dimensions and meet IEC/EN 60335-1, EN 55032 Class B, and CISPR/FCC Class B approval safety standards.

Features

Over-voltage protection
Continuous short circuit protection
Class II
IEC/EN 60335-1 approval
EN 55032 Class B and CISPR/FCC Class B approval

Specifications

90V_AC TO 264V_AC universal input voltage range
Up to 87% high efficiency
5V to 48V output voltage
4A to 0.42A output current
±2% voltage accuracy
5000m operating altitude
<0.1W no-load power

more information: https://www.cincon.com/productdetail/CFM20.html

Arducam 108MP USB3.0 Camera Evaluation Kit with Ultra High-Resolution Sensors

Posted on 29 July, 2022 by Abhishek Jadhav

Camera embedded hardware specialist Arducam has launched a new 108-megapixel camera evaluation kit with high-resolution sensors that can be interfaced through a USB 3.0 port. With a simplistic design, the company uses a single-camera solution that can have equivalent coverage with multiple low-resolution cameras to reduce the footprint. Arducam aims to reduce the overall cost of the design architecture by using the 108-megapixel camera evaluation kit as a unified solution for camera development and streaming multiple inputs.

Arducam 108-megapixel camera evaluation kit is an expensive investment for your applications as it brings high-end sensors used in smartphones into hackable solutions for everyone’s use. The integration of technological advancements enables the Arducam 108MP camera evaluation kit to serve demanding applications for visual computing and industrial security surveillance.

Specifications of Arducam 108MP Camera Evaluation Kit:

Type: Arducam 108-Megapixel USB3.0 Camera Evaluation Kit
Optical size: 1/1.5″
Number of effective pixels: 12000×9000
Frame rate: 4000×3000 at 11 frames per second and 12000×9000 at 1.3 frames per second
Interface: MIPI 2-lane
Focus: 8cm INF
Focal length: 5.89
View angle: 82 diagonal
Shutting type: Rolling
Color filter: RGB
Output format: RAW10
Dimensions: 38×38 mm

Video

Arducam has demonstrated an image taken at a 1-meter distance that compares the image quality of camera modules – Raspberry Pi Camera HQ, Raspberry Pi V2, Arducam 16MP, Arducam 64MP, and Arducam 108MP. As expected, the latest and most advanced Arducam 108MP camera kit produces the best image quality among all other camera modules tested.

Marketed as a camera evaluation kit, the camera module takes any image sensor and turns it into a working camera with a complete SDK and a convenient USB interface for quick tests. The evaluation system has three solutions as listed by Arducam– tested and proven evaluation kits, mix-and-match with different sensors, lenses, and customize with anything you want.

The Arducam 108-megapixel camera evaluation kit is currently listed for purchase on the official product page for $399.00 USD.

AAEON Pico ITX Mini PC with Intel core i7 starts at $1324.00

Posted on 29 July, 2022 by Abhishek Jadhav

A few months ago, AAEON released a Pico-ITX form factor mini personal computer, PICO-TGU4-SEMI, powered by an Intel processor system on chip for powerful and complex artificial intelligence applications. The Pico-ITX embedded rugged computer comes with a high-performance CPU and low power consumption design to provide a flexible architecture with a rich set of interface expansions. The hardware comes with various system-on-chip variants starting with an 11th Gen Intel Core Celeron processor and can provide up to Intel Core i7 processor to run advanced edge AI applications.

The hardware is designed to provide enhanced computing performance to suit AI edge deployment in drone, robotic and industrial automation while providing more system memory for simultaneous applications. The CPU options include 11th Gen Intel Core Celeron/i3/i5/i7 processor core on a compact Pico-ITX form factor. The AAEON PICO-TGU4-SEMI rugged computer comes with dual LAN ports, an Intel i225 2.5Gbps port for high-speed LAN connectivity, and an Intel i219M port to support Intel vPro for remote system monitoring.

Specifications of AAEON Pico ITX Mini PC:

SoC: 11th Gen Intel Core Celeron/i3/i5/i7 processor
Form Factor: Pico-ITX
Memory: Onboard LPDDR4 up to 32GB
USB ports: 2x USB 3.2 Gen 2
Display:
- Chipset: Intel Iris Xe (i5 and i7 support) and Intel UHD graphics (i3 and Celeron support)
- Video output: 1x HDMI 2.0b with 4kx2k at 60Hz
Audio: High-definition audio interface
Expansion: 1x M.2 M Key 2280, 4x PCIe Gen 4 (by default) and SATA, 1x full size mSATA/mPCIe or USB2.0, 1x eSPI and SMBUS/I2C, TPM2.0
Serial ports: 2x RS-232/422/485
Bios: UEFI
Power supply: DC Jack at 12V ATX
Power consumption: 2.89A at +12V, i7-1185G7E, LPDDR4x on board 32GB
Operating system: Windows 10 (64bit), Linux Ubuntu 20.04.2/Kernel 5.8
Dimensions: 122×80.8×50.4 mm
Weight: 0.38 kg
Operating temperature: 0°C to 50°C

Video

For display support, different chipsets are used for different processor variants, as seen in the specifications. The Intel i5 and i7 processor core use Intel Iris Xe chipset, while i3 and Celeron will support Intel UHD graphics. In comparison, the Celeron processor version will come with only 4B LPDDR4 memory, which will be upgraded to 8GB for other processor options, i3/i5/i7 cores. All other expansions will remain the same irrespective of the processor variants.

For software support, the AAEON PICO-TGU4-SEMI will operate on Windows 10 (64-bit) version and Linux Ubuntu 20.04.2. The hardware comes with Unified Extensible Firmware Interface, modern software to replace legacy BIOS for improved security, faster boot times, large capacity hard drive support, and many more.

For more information, head to the product page for detailed specifications and feature listings.

Ynvisible introduces a low-power printed e-paper display for high-reliability applications

Posted on 29 July, 2022 by Abhishek Jadhav

Vancouver-based display manufacturer has announced a new low-power printed e-paper display that consumes 50% less energy per switch than its predecessor and can last 10 times longer when switched on and off. The low-energy consumption display features an improved performance of faster processing speeds at especially low temperatures and provides a high-quality print display.

The company claims it to be one of the thinnest displays on the market that can even be stored inside a cardholder. Due to its highly customizable features, the e-paper print display has positioned itself well in the printed display space. The e-paper display kit contains various display designs, a manual display driver, and an I2C interface.

“We continuously collect market feedback from prioritizing our development efforts and technology roadmap. With this new generation display release, we know that we are responding to our customers’ needs whilst expanding the use of our printed display technology in a wider range of e-paper devices.”

Specifications of Ynvisible e-paper display

Product type: Segment e-paper print display
Contrast ratio: 1:3
Angle dependency: No, Lambertian
Thickness: 300 μm
Dimensions: 1mm to 100mm
Response time: 100 to 1000ms
White reflectance: 40%
Supply voltage: 1.5V
Energy consumption: 1mJ/cm2
Operating temperatures: -20°C to +60°C
Pulse energy: 0.25mJ/cm2

Ynvisible e-paper print display uses electrochemical reflective technology with very low angle dependency. The low-power display features semi-bistability, which means that the display consumes power during display switches but requires a short refresh pulse approximately every two minutes.

“This latest upgrade will significantly benefit specific industries such as digital signage, smart monitoring labels, authenticity & security and retail.”

The hardware requires very few additional components to add the Ynvisible e-paper display to a circuit. There are four circuit suggestions– voltage regulator circuit, DAC output on common electrode, a 2-level variable counter electrode, and digital outputs. For more information on the Ynvisible e-paper display, head to the product page, where the datasheet provides enough information on the hardware specifications.