Avnet announces its SMARC 2.1.2 standard compliant MSC SM2S-IMX8ULP module

Avnet SMARC module

Most of you have been on the Hackster.io website to check for interesting embedded IoT projects. Hackster’s parent company, a New York-based electronics components distributor, Avnet, has launched the MSC SM2S-IMX8ULP module, which is compliant with the Smart Mobility Architecture (SMARC) 2.1.2 standard form factor. This allows easy integration of the new module with the SMARC baseboards (also referred to as carrier boards). The SMARC-compliant module pairs up the NXP low-power, high-performance processor and LPDDR4 memory integrated with up to 256GB of eMMC flash storage.

At the heart of the MSC SM2S-IMX8ULP module is the NXP i.MX 8M Arm processor architecture features two ARM Cortex-A35 processor cores clocked up to a frequency of 1GHz, and an Arm Cortex-M33 core. While Cortex-A35 is the smallest and power-efficient smart home processor supporting multiple software applications, the Cortex-M33 is efficient for IoT and embedded applications that require digital signal control and security. Additionally, a 3D/2D Graphics Processing Unit (GPUs), a Tensilica Hifi 4 DSP, and Fusion DSP for low-power audio/voice and edge AI/ML processing are also included in the i.MX 8ULP processor.

Specifications of the MSC SM2S-IMX8ULP module

  • Processor:
    • Single or Dual-core ARM Cortex-A35 processor with a clock speed of up to 1.0GHz
    • ARM Cortex-M33 real-time processor at 216MHz
  • GPU: Vivante GPU for 2D/3D multimedia
  • USB: 4x USB 2.0 Host, 1x USB 2.0 Host/Client
  • Memory: Up to 2GB 2400MT/s LPDDR4x SDRAM
  • Storage: eMMC flash of up to 256GB
  • Wireless connectivity: 2.4 GHz IEEE802.11b/g/n Wi-Fi and Bluetooth 5.0
  • Display:
    • LVDS dual-channel interface supports up to 1920×1080 pixels and single-channel interface with up to 1366×768 pixels
    • MIPI-DSI display interface supporting 1920×1080 pixels at 60 frames per second
  • Audio:
    • 2x I2S Audio
    • Tensilica Fusion DSP at 200MHz
    • Tensilica Hifi 4 DSP at 600MHz
  • Software support: Linux, Android, and Microsoft Azure Sphere
  • Temperature range
    • 0℃ to 70℃ for commercial operation
    • -40℃ to 85℃ for extended operation
  • Dimensions: 82×50 mm

The highly scalable and flexible MSC SM2S-IMX8ULP module is equipped with the NXP’s i.MX 8ULP crossover application processor facilitates low-power processing and advanced integrity security with EdgeLock secure enclave to the intelligent edge. Enabling autonomous management of security operations, such as runtime attestation, silicon root of trust, trust provisioning, reusable certifications, and fine-grain key management are all included in the EdgeLock secure enclave. Furthermore, for advanced resistance against attacks, it offers extensive crypto services.

Avnet’s MSC SM2S-IMX8ULP module supports the uboot firmware. The module also offers support for Linux and extends its support to Microsoft Azure Sphere and Android, which will be available on request. For additional details on the MSC SM2S-IMX8ULP module, kindly visit Avnet’s website.

This X-Sense wireless smoke detector covers your entire home – A detailed review

In the past, we have covered X-Sense XP01-W smoke and carbon monoxide alarm detector with a detailed review listing the functions, key features, technical details, and what we think about the hardware. X-Sense has also another smoke detector with a transmission range of 820 feet, and multiple X-Sense smoke detectors can be connected wirelessly– XS01-WR. This sensor family is completely different from the one we previously featured, the X-Sense XP01-W. The X-Sense XS01-WR is a smoke detector with detection of smoke only and uses a single battery as the power source.

X-Sense wireless smoke detector

In most cases, general smoke detector sensors are not connected to each other, hence the alarm system makes it difficult for the user to locate the source sensor of the fire. There can also be several false fire alarms that complicate the safety infrastructure and hence an accurate sensing smoke detector that is wirelessly connected to other sensors and can be monitored is the need of the hour. The X-Sense XS01-WR smoke detector is easy to install and operate as it can be quickly installed on any wall or ceiling without the need for any hardwiring.

Specifications of X-Sense XS01-WR smoke detector:

  • Detection type: Smoke
  • Sensor: Photoelectric
  • Battery: Replaceable 3V CR123A lithium battery
    • Operating life: 10 years
    • Battery life: 5 years
  • Current rating:
    • Standby current: <15uA
      Alarm current: <150mA
  • Wireless connection: Provided
  • Maximum number of interconnected units: 24 wireless units
  • Compatibility with remote RC01: Provided
  • Alarm loudness: ≥ 85 dB at 10 ft (3 m)
  • Silence duration: ≤ 9 minutes
  • Operating frequency: 915 MHz (UL), 868 MHz (TÜV)
  • Indicator LED: Red LED
  • Material: ABS
  • Installation method: Screw fixings and mounting bracket
  • Operating temperature: 40-100°F
  • Product weight: 92 grams
  • Usage: Indoor use only
  • Dimensions: Ø 3 x 1.9 in

Key features of X-Sense XS01-WR smoke detector:

  • Coverage: X-Sense has manufactured the XS01-WR smoke detector with the idea of increasing the coverage area. To serve this purpose, XS01-WR smoke detector is able to cover an entire area of 820 feet transmission range. Also, to cover the entire house, the X-Sense smoke detector ecosystem will enable users to connect up to 24 detectors wirelessly and control the security of the house.
  • Installation: Easy installation allows the user to quickly install the X-Sense XS01-WR smoke detector on any wall of your preference. The installation does not require any hardwiring and a simple press of a button will provide the flexibility to interconnect smoke detectors. The package will also include mounting brackets and screws for easy installation.
  • Design: The design of X-Sense XS01-WR smoke detector is an “insect-proof design” that buffers and isolates the sensor from insects thus ensuring high accuracy.
  • Operating accuracy: The smoke detector has been upgraded from its previous version to collect and analyze at least three air samples every 10 seconds to provide greater accuracy.
  • Battery life: The smoke detector has a battery life of 5 years while the device lifespan is of 10 years. The hardware will alert when the battery is low and there is a need to replace the battery to ensure continuous monitoring.
  • After-sales service: All the shipped X-Sense XS01-WR smoke detectors come with a 60-day money-back guarantee and a 5-year warranty with lifetime customer support.

Package content:

  • 3 x alarm units
  • 3 x mounting brackets
  • 2 x screws
  • 2 x anchor plugs
  • 1 x user manual

Conclusion

An interesting fact about the X-Sense XS01-WR smoke detector is that it uses 915MHz RF communication which will not interfere with Wi-Fi signals at home or office. All you have to do is to install and forget these simple smoke detectors. On the other side, the detectors are not connected to a WiFi network, so it’s not compatible with Alexa or other online services. This makes the smoke detector model not provide voiced alarms. Also, there is no mobile application to control the device. In case you want to use such features, you can consider checking out the X-Sense XS01-WT hardware platform.

The 3-sensors pack is priced at 79.99 USD on Amazon which we think it’s quite reasonable for such interconnected devices.

Discount Code

Code: CHTG0120 (20% off all products) at x-sense.com

Oukitel WP19 World’s Most Powerful Outdoor Rugged Smartphone Available Globally Now

Oukitel announced the released global premiere sale date for the WP19 outdoor rugged smartphone early this month. Now, this world’s biggest battery phone is available on AliExpress with more than 50% off discount. Buy Oukitel’s newest smartphone WP19 now, you can get one at the global premiere sale price of $254.99 only! This lowest price offer for Oukitel WP19 can be only available for a limited time (27th June-1st July 2022).

Oukitel WP19 comes with quite a few decent upgraded features, especially the battery capacity and cameras. Its 21000mAh capacity is marked as the world’s biggest battery phone so far, which can easily support 2252 hours standby with a SIM card, 123 hours of music playing, and 36 hours of video viewing, which is 7 days maximum of daily use outdoors. Oukitel WP19’s 33W fast charging function allows you to spend less than 3 hours on powering this huge battery capacity from 0-80%. It is equipped with SAMSUNG 64 MP main camera, a SONY 20MP night vision camera, and a 16MP front camera. Oukitel WP19 could offer you an opportunity to shoot impressive photos anytime and anywhere. Moreover, the 4 Infrared Radiation (IR) emitters at the back of the phone can enable you to capture high-quality images with decent clarity in very dark areas.

The screen of the Oukitel WP19 is 6.78-inch FHD+ with 2460*1080 Resolution, 20.5:9 Aspect ratio, and a 90Hz refresh rate. Its operating system has been updated to the latest Android 12. With MediaTek Helio G95 processor and 8GB RAM & 256GB ROM internal storage, WP19 is made for your smooth experience with different Apps. It is a rugged phone for enduring tough environments as it is IP68, IP69, and MIL-STD-810H (waterproof, dust-proof, and drop-proof) certified. Oukitel WP19 does also come with other features (NFC, Dual-sim slot, Global Navigation, etc.).

Seeed Studio teases WiLoBLIno, gets Seeed LoRa-E5 and ESP32 for rapid prototyping

Chinese embedded device manufacturer, Seeed Studio, along with Antonio Cotos Facal, CTO of Black Device have designed a WiLoBLIno hardware platform fueled by the in-house Seeed Studio’s LoRa-E5 and ESP32 modules. WiLoBLIno name is derived from Wi-Fi (Wi), LoRa (Lo), Bluetooth (BL), and Arduino-compatible stack (Ino). The hardware is still in the development phase, but Seeed Studio’s Amanda Sun, overseas marketing and development manager decided to reveal some details and schematics of WiLoBLIno. Through a rich set of wireless communication support, WiLoBLIno is expected to make its way through the overcrowded embedded device industry. The flexibility to interface with Arduino development boards enables the user to take advantage of the existing modules and sensors.

At the heart of the WiLoBLIno is the LoRa-E5 module integrated with STM32WLE5JC Arm Cortex-M4 low-power microcontroller and LoRa SX126X. The board is a compact and high-performance LoRa module designed for various IoT nodes, supporting EU868 and US915. Another onboard module is the ESP32-WROOM-32U which comes with an ESP32-D0WD chip with both the CPU cores that can be controlled individually, and the CPU clock frequency is adjustable from 80MHz to 240MHz.

Specifications of WiLoBLIno development board:

  • LoRa module: Seeed Studio LoRa-E5 wireless module
    • MCU: STM32WLE5JC with Arm Cortex-M4 processor core
    • LoRa: SX126X
    • Long distance use: 158dB link budget
    • Wireless connectivity: Embedded LoRaWAN protocol, AT command, support global LoRaWAN Frequency Plan
    • Serial communication: 3x UART, 1x I2C, 1x SPI
    • Modulation: LoRa, (G)FSK, (G)MSK, and BPSK
    • Power supply: 1.8V to 3.6V
    • Dimensions: 12x12x2.5 mm
  • ESP module: ESP32-WROOM-32U with ESP32-D0WD chip clocked up to a frequency of 240MHz
    • Wi-Fi: IEEE802.11b/g/n
    • Bluetooth: Bluetooth version 4.2 and Bluetooth Low Energy
    • Module interface: SD card, UART, SPI, I2C, LED PWM, Motor PWM, I2S, GPIO, ADC, DAC, etc.
    • Onboard sensor: Hall sensor
    • Storage: Integrated SPI flash of 4MB
    • Operating voltage: 3.0V to 3.6V
    • Operating temperature: -40°C to +85°C
    • Dimension: 18x19x2x3.2 mm
  • Power supply: 3V3 to 5V
  • Ports: USB Type-C for power supply and programming

Currently, we do not have any information on product availability or pricing, but we have contacted Seeed Studio for a response. Stay tuned for more updates as we update the article with more information as the development process progresses.

Meanwhile, you can check out the blog post on Seeed Studio’s website.

Nordic Thingy:53 gets the Edge Impulse firmware for rapid IoT prototyping

Nordic Thingy53

Norwegian embedded device manufacturer Nordic Semiconductor has announced the commercial availability of Nordic Thingy:53, a new addition to the Nordic Thingy family. This multisensor prototyping hardware platform features multiple onboard sensors and robust short-range wireless connectivity for embedded machine learning applications. The hardware also comes with an embedded Edge Impulse machine learning firmware to reduce the time to market and develop edge applications using an advanced wireless connection.

The Nordic Thingy:53 is based on the Nordic’s in-house nRF5340 dual-core Arm Cortex-M33 multiprotocol system-on-chip that incorporates an nPM1100 power management unit and a front-end module nRF21540. The Thing:53 is equipped with a six-axis inertial measurement unit and a low-power accelerometer. The onboard environmental sensor, includes temperature, humidity, air quality, and pressure. There also comes a color and light sensor, buzzer, and Pulse Density Modulation microphone.

“Nordic’s ‘Thingy’ family has already proven itself with the developer community as the fastest route to prototype and develop innovative short-range wireless and cellular IoT applications. Now with the addition of Thingy:53, we enhance the range by introducing a prototyping platform using our most powerful and capable multiprotocol SoC,” says Pär Håkansson, Nordic’s Product Manager for Thingy:53.

Specification of Nordic Thingy:53

  • SoC: nRF5340 system-on-chip featuring a high-performance Arm Cortex-M33 application core clocked at 128MHz and an ultra-low-power Arm Cortex-M33 network core clocked at 64MHz.
  • Wireless connectivity: nRF21540 FEM, Bluetooth Low Energy (Bluetooth LE), Thread, Matter, Zigbee, IEEE 802.15.4, NFC, and
  • Bluetooth mesh RF protocols,
  • LEDs: RGB, programmable
  • Interface: Qwiik/Stemma/Groove compatible 4-pin JST
  • Buttons: Available through the casing, programmable
  • Battery: 1350 mAh Li-Po, USB-C rechargeable
  • Sensors: Temperature, humidity, air quality, air pressure, 6-axis with accelerometer, colour and light sensor
  • Microphone: PDM, wake-on-sound capable
  • Buzzer: Piezoelectric, 4 kHz

Nordic Thingy53 Platform

The Nordic Thingy:53 is shipped with a pre-installed nRF Edge Impulse machine learning firmware to transfer training data wirelessly using wireless connectivity to the cloud via the Edge Impulse mobile application. The trained AI model can be wirelessly deployed on the hardware platform. The mobile application is capable of demonstrating the performance of the Thingy:53. The nRF Programmer application for the Nordic Thingy:53 also gives the user additional flexibility for prototyping IoT edge applications. The app will enable developers to flash firmware directly over-the-air from an iOS or Android device.

“The nRF5340 also incorporates Nordic’s PMIC and range extender for excellent battery performance and link budget, and multiple advanced sensors. And for the first time, developers who are not experienced in machine learning can easily leverage the technology through Thingy:53’s pre-programmed Edge Impulse firmware and the nRF Edge Impulse mobile app. Machine learning is the key to tomorrow’s advanced IoT edge processing,” Håkansson added.

For more information on Nordic Thingy:53, head to the official product page.

Google and SkyWater Technology collaborate to launch an Open-Silicon developer portal

Build Open Silicon

With the exponential increase in the demand and requirement of silicon-based chips, Google, in partnership with SkyWater Technology, has launched a new platform to encourage and help the developer community to get started with its Open MPW shuttle program. Leveraging SkyWater’s open-source process design kit (PDK), the platform allows developers to submit open-source integrated circuit designs to get manufactured at zero cost. Therefore, the partnership marks a major breakthrough for the open silicon ecosystem, enabling customers to develop complex and advanced silicons with ease.

Along with Moore’s law termination and the upsurge of connected devices (IoT), there is a significant need to discover more sustainable methods to expand computing. Moving toward more efficient dedicated hardware accelerators is what we need to do instead of just packing more transistors into smaller areas. Due to recent challenges with the global chip supply chain, consumers have seen significant rising prices, shortages, queues, and scalping. Hence, we must accomplish this by using more of the existing global foundry capacity, which provides access to older and proven process node technology.

Build Open Silicon Tapeout

Recommended reading: EFABLESS LAUNCHES CHIPIGNITE WITH SKYWATER TO BRING CHIP CREATION TO THE MASSES

The SKY130 process node (a 130nm technology), enables the development and prototyping of IoT applications that often need to maintain a balance between cost, power, and performance while including an amalgamation of analog blocks and digital logic. The availability of an open-source and manufacturable PDK alters the status quo in the custom silicon design industry and academia. Designers are now free to start their projects without the constraints of NDAs or usage limitations. Further, the open-source platform enables peer developers to replicate complex designs.

“By combining open access to PDKs, and recent advancements in the development of open-source ASIC toolchains like OpenROAD, OpenLane, and higher-level synthesis toolchains like XLS, we are getting us one step closer to bringing software-like development methodology and fast iteration of cycles to the silicon design world. We believe we are at the edge of a similar revolution for custom accelerator development, where hardware designers compete by building on each other’s works rather than reinventing the wheel”, claims Johan Euphrosine.

Previous versions of the Open MPW Shuttle Program received contributions varying from the Microwatt OpenPOWER 64-bit core to RISC-V cores to Sudoku accelerators, hardware implementations of games, SRAM/ReRAM generators, and other small ASICs. The design submissions also included crypto and ML operations accelerators along with multiple group submissions.

With this collaboration, the end-user can avail the advantage of a standardized 2.92mm x 3.52mm user area and 38 I/O pins for each project. The design can be hardened by a predefined harness. Additionally, the platform also provides the necessary test infrastructure to test and validate the chip specifications before submitting the design for tape out.

Google has launched its new developer portal that provides instructions to get started with various tools of the open-source silicon ecosystem. To get started on your silicon journey, check out the Google Open-Source Blog.

Crowdfunding ShaRPiKeebo handheld Linux computer comes with a Raspberry Pi

ShaRPiKeebo Linux Computer

French electronic designer Morpheans has launched a crowdfunding project, ShaRPiKeebo, a Raspberry Pi Zero W and Zero 2 W powered portable Linux computer that features a classic QWERTY keyboard and a 2.7-inch memory display. The tiny ShaRPiKeebo computer is designed with a low-power, black and white SHARP memory display that works efficiently even in the daylight. On the wireless connectivity side, the handheld Linux computer supports Wi-Fi and Bluetooth along with a long-range wireless transceiver.

Looks similar to the Pocket C.H.I.P. indie gaming machine, the ShaRPiKeebo computer brings the power of one of the famous Raspberry Pi tiny modules, Raspberry Pi Zero 2 W. After the successful launch of Raspberry Pi Zero W, there were a lot of developers looking for a better and more powerful computer in the same form factor when the Raspberry Pi Foundation released the new version– Raspberry Pi Zero 2 W. Thanks to the in-built wireless connectivity of the Raspberry Pi module, making the handheld Linux machine an ideal candidate for your IoT applications.

Specifications of the ShaRPiKeebo

  • Module: Raspberry Pi Zero W and Zero 2 W
  • Wireless connectivity: Wi-Fi IEEE802.11b/g/n, Bluetooth 4.2 LE, and long-range wireless communication with the 433 MHz RFM95 LoRa transceiver
  • Display: LS027B7DH01 2.7-inch SHARP memory display with low latency, low power and a resolution of 400×240 pixels
  • Power: 5V via Type-C USB port and support for an onboard battery module through the 2-pin JST connector (LiPo battery)
  • Dimensions: 115x66x20 mm
  • Weight: Approximately under 100 grams

ShaRPiKeebo Linux Computer View

Morpheans’ ShaRPiKeebo is a battery-powered nanocomputer designed for gamers, system administrators, developers, makers, and students. But as far as the hardware is concerned, it cannot serve applications requiring complex computational. For open-source hardware, the manufacturer has provided all the design files in the official GitHub repository for interested developers to engage and contribute. The portable Linux-powered computer offers a JST connector allowing the user to quickly connect to the LiPo battery of their choice to achieve an extended battery life.

Additionally, the portable computer offers four independently controlled LEDs that are easily programmable using the classic GPIO commands in C++ or Python. ShaRPiKeebo can be used as an external keyboard when attached to another device, for instance, a rack server. It extends its support for QMK-keyboard flashing or upgrades via the ISP programming port.

The crowdfunding goal of ShaRPiKeebo is $45,000, and the campaign runs until July 21, 2022. Priced at $150, the developer can pledge the price tag to get their own ShaRPiKeebo handheld Linux computer.

Metalenz and STMicroelectronics collaboratively announce the world’s first optical metasurface technology

ST Metalenz metasurface technology

Metalenz, the fabless semiconductor company, and the Swiss semiconductor manufacturing company STMicroelectronics announced the VL53L8 direct Time-of-Flight (dToF) sensor, a market debut of the meta-optics devices developed through their partnership.

The meta-optics technology by Metalenz can replace existing complex and multi-element lenses and provide new functionality. This is achieved by supplying 3D sensor modules that improve performance, power, size, and cost in various consumer, automotive, and industrial applications. The metasurface technology has been made commercially available for the first time now for its use in consumer electronics.

The co-founder and CEO of Metalenz, Rob Devlin, said,

“We have multiple wins that mark the first application of our platform technology, and we are now designing entire systems around its unique functionality. Our meta-optics enable exciting new markets and new sensing capabilities in mobile form factors and at a competitive price.”

The metalens technology by Metalenz is completely planar, unlike traditional curved and molded lenses. The planar metasurface optics are now manufactured on silicon wafers alongside electronics in STMicroelectronics’ front-end semiconductors. While taking up less area, meta-optics collect more light, give several functionalities in a single layer, and enable new forms of sensing in smartphones and other devices. Certain existing optics in ST’s FlightSense ToF modules have been replaced by Metalenz’s flat-lens technology, allowing it to serve in applications like drones, robots, smartphones, and vehicles.

The executive vice president and general manager of ST’s Imaging Sub-Group, Eric Aussedat, said that

“Perfectly complementing ST’s advanced manufacturing capabilities and ToF technology, the introduction of products embedding Metalenz’s game-changing metasurface optics now enables significant power efficiency, optical performance, and module-size optimization that all bring benefit across consumer, industrial, and automotive markets.”

The collaboration between Metalenz IP and ST manufacturing brings together the accuracy and precision of the electronics chip industry to make very precise and repeatable meta-optics. This furthermore unlocks a completely new way to make lenses that combine high quality with large-scale, cost-effective manufacturing.

More information on this revolutionary optical technology can be found on the press release page in the newsroom.

Smaller, Faster, and Stronger Solutions with AAEON’s Computer-on-Modules

Providing High-Performance Computing in a Globally Connected World

  • AAEON launches the latest 12th Generation Intel® Core™ processor (formerly Alder Lake-S) based Computer on Module (COM) with the new COM-HPC standard
  • Extensive lineup of COM Express modules from AAEON includes the Intel® Xeon® D series processor (formerly Ice Lake D) based COM Express Type 7 and the 11th Generation Intel® Core™ processor (formerly Tiger Lake UP3) based COM Express Type 10
  • Dedicated engineer team support for COM projects helps to shorten the time to market

In today’s globally connected world, data is shared more frequently and in greater volumes than ever before. Consequently, this requires more powerful information processing technology, yet there remains a demand across all computing mediums for the hardware processing this information to be smaller, faster, and more sophisticated.

For this reason, AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced its latest Computer-on-Module (COM) innovations, including the 12th Generation Intel® Core™  processor-based COM-HPC standard client module, the Intel® Xeon® D series processor-based COM Express Type 7, and the 11th Generation Intel® Core™ processor-based COM Express Type 10.

The AAEON COM-HPC module, HPC-ADSC, features the 12th Generation Intel® Core™ processor (formerly Alder Lake S) for high-speed processing, widespread connectivity, and environmental resilience for flexible deployment in IoT industrial contexts. It supports PCIe x16 Generation 5 interface and two DDR5 SODIMM memory sockets with in-band ECC support for up to 128 GB capacity. It is integrated with 25 GbE and 2.5 GbE interfaces for huge data transmission.

The AAEON COM Express Type 7, COM-ICDB7, is powered by the latest Intel® Xeon® D series (formerly Ice Lake D). It’s a high-performance computing unit for enhancing connectivity, streamlining communication, and building the infrastructure of the future. It supports PCIe x16 Generation 4 and four DDR4 SODIMM sockets with in-band ECC support for up to 128 GB. It is integrated with four 10 GbE and one 1 GbE interface.

The AAEON COM Express Type 10, NanoCOM-TGU, features the 11th Generation Intel® Core™ series (formerly Tiger Lake UP3) for high-speed processing on the smallest form factor. It supports PCIe x4 Generation 4 interface, LPDDR4x for up to 16GB, and onboard NVMe for up to 512 GB. It is integrated with a 2.5 GbE interface, a DDI interface, and eDP interface. It supports a wide temperature range between -40~ +85C for harsh environment applications.

Additions, customizations, and project-specific features can be accommodated on AAEON COM Express modules thanks to AAEON’s expertise in OEM and ODM. For quick and high-quality technical service support on Computer-on-Module projects, AAEON offers the “Q Service.”

The AAEON Q Service is a dedicated engineering support team that will co-design and co-debug alongside customers during the development of their COM Express projects. With experienced design and field application engineers, AAEON’s Q Service is committed to helping customers reduce the time spent on troubleshooting and expediting the development process.

AAEON will showcase the new COM-HPC standard and COM Express product line at their booth in Embedded World on June 21 – 23, 2022. Visit Booth #306 in Hall 1 at Nuremberg Messe, Germany to learn more.

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