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Banana Pi’s BPI-CM4 is an Alternative to Raspberry Pi CM4

Posted on 20 June, 202224 June, 2022 by Saumitra Jagdale

Banana PI has announced the release of its new cost-efficient computer module BPI-CM4 for enhanced performance in embedded applications. The company has stated that this new Banana Pi BPI-CM4 replicates Raspberry Pi’s Compute Module 4 (CM4). This board was developed as a substitute or replacement for the Raspberry Pi CM4. In addition to using its design, the BPI-CM4 also shares similar interfacing pins as the Raspberry Pi’s CM4. Banana Pi appears to have packed a lot of punch into its new small-sized computer module.

Deeper Look at Amlogic 311D

The system on chip (SoC) in the BPI-CM4 is Amlogic 311D, a powerful and advanced AI application processor by Khadas which can be also seen in the Banana Pi BMP-MS2. This processor comes with the high power-efficient Quad Arm Cortex-A73 cores clocked at 2.2 GHz and dual Cortex-A53 cores clocked at 1.8 GHz providing high performance. Essentially, the GPU is a mid-range Arm Mali-G52 MP4 (6EE) graphic card and a Neural Processing Unit (NPU) at 5.0 TOPS handling a good amount of computing operations.

Technical specifications of BPI-CM4

Memory -BPI-CM4 will have a 2GB RAM / 4GB RAM variant as well as 16GB of eMMC storage, expandable up to 128GB
Connectivity– Banana Pi offers an option of Wifi 5 /Wifi 6 wireless module providing fast experience and wireless range and GigabitEthernet connectivity fulfilling the high-speed internet needs. It is designed with B to B (board to board) connectors, and a solitary PCIe interface expansion for flexibly connecting high-speed components. Considering the industrial applications, the board is comes with an external antenna.
Display– It is pin-to-pin compatible with raspberry PI’s CM4 but this is the area where it is not a direct replacement as BPI-CM4 consists of only one HDMI port offering resolutions up to 4K whereas the Rasberry Pi Consists of a dual 4k resolution HDMI port

Compared to the pins of RasPi-CM4, the red boxes in the image above show the unsupported pins in BPI-CM4. While interfacing the BPI-CM4, it has the same connection interface as the RasPi-CM4, and the size of the BPI-CM4 is also said to be as same as that of RasPi CM4.

Pricing of BPI-CM4 is not confirmed by Banana Pi yet, but it is expected that this replica of the Rasberry Pi’s CM4 should be more cost-efficient when compared to RasPi-CM4. BPI-CM4 is an overall great power package offered by Banana Pi as it provides the option of the more reliable and less power-consuming latest Wifi version 6 and a powerful chipset Amlogic 311D. For more details visit the official forum page.

MediaTek’s Wi-Fi 7 platforms, the Filogic 880, and the Filogic 380 will meet the industry’s growing connectivity demands

Posted on 19 June, 202221 June, 2022 by Abhishek Jadhav

The Taiwan-based fabless semiconductor company, MediaTek, announces its Wi-Fi 7 platforms, Filogic 880 and Filigoc 380, which offer high-bandwidth applications in the operator, retail, enterprise, and consumer electronics industries. The IEEE 802.11be, also known as the 7th generation of Wi-Fi, is an extremely high throughput wireless network that makes use of 2.4GHz, 5GHz, and 6GHz frequency bands. Wi-Fi 7 makes use of modern technology to boost overall capacity, reduce latency, and improve performance for all devices.

The Corporate Vice President and General Manager of the Intelligent Connectivity business at MediaTek, Alan Hsu says,

“Our wireless connectivity solutions are designed to deliver the fastest performance using the most advanced technologies, and represent MediaTek’s commitment to driving Wi-Fi 7 adoption in a large number of new markets. With Filogic 880 and Filogic 380, our customers can deliver fast, reliable, and always-on connected experiences to meet the industry’s growing connectivity demands.”

The Filogic 880 platform

Combining Wi-Fi 7 access points with an advanced host processor, MediaTek’s Filogic 880 is a complete platform that offers the best of the industry router and gateway solutions for the operator, retail, and enterprise markets. The powerful host processor of the platform includes a quad-core Arm Cortex-A73 and an advanced NPU. Some of its key attributes include:

Incorporation of a networking crypto engine (EIP-197) for accelerating IPSec, SSL/TLS, DTLS (CAPWAP), SRTP and MACsec
High-speed interfaces such as 5Gbps USB and 10Gbps PCI-Express are supported
Its scalable architecture can accommodate up to pentaband 4×4 at 36Gbps.
The Filogic 880 platform supports Wi-Fi technologies such as 4096-QAM, 320MHz, MRU and MLO
Offers support for up to 10Gbps per channel.

The Filogic 380 platform

A combination of the single-chip 6nm Wi-Fi 7 and Bluetooth 5.3, the Filogic 380 is designed to offer the best connectivity. Owing to the Filogic 380 platform, all client devices, including smartphones, tablets, TVs, notebooks, set-top boxes, and OTT streaming devices, will now have access to the Wi-Fi 7 technology. Some of its key features include:

Supports Wi-Fi technologies such as 4096-QAM, 320MHz, MRU and MLO
Features the latest Bluetooth 5.3 with LE Audio
Dual 2×2 radios are supported for dual-band simultaneous operation
Supports 2.4GHz, 5GHz, and 6GHz frequency bands
MLOs with speeds up to 6.5Gbps are supported
Offers support for up to 5Gbps per channel

MediaTek is one of the first adopters of the Wi-Fi 7 technology, which will soon prove to be the backbone of PAN, LAN, and WAN networks to provide seamless connectivity from multi-player applications to 4K calls 8K streaming, and beyond. For more information on the company’s Wi-Fi 7 platforms, kindly visit their press release page.

MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones

Posted on 19 June, 2022 by Abhishek Jadhav

The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The dual connection using mmWave and sub-6Hz enables the Dimensity 1050 to offer the speeds and capacity required to provide smartphone users with an outstanding experience, even in the most densely populated regions.

The deputy general manager of the Wireless Communications Business Unit at MediaTek, CH Chen, says,

“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands. With faster, more reliable connections and advanced camera technology, this chip delivers powerful features to help device makers to differentiate their smartphone product lines.”

Combining both mmWave 5G and sub-6GHz, the Dimensity 1050 allows easy migration between network bands. Furthermore, it’s built on the TSMC 6nm production process with an Octa-core CPU, which supports 3CC and 4CC carrier aggregation on the FR1 and FR2 spectrums, respectively. Additionally, two premium Arm Cortex-A78 CPUs with speeds up to 2.5GHz and the latest Arm Mali-G610 graphics engine are included in the SoC.

Features of the Dimensity 1050

Supports dual 5G SIM (5G SA + 5G SA)
Facilitates dual VoNR, which removes the LTE anchor, allowing the voice call to stay at a 5G network
MediaTek MiraVision 760 offers 144Hz full HD+ displays with intense and vibrant colours
MediaTek APU 550 boosts AI camera action and provides supreme low-light shots with excellent noise reduction
Simultaneous streaming of both front and rear cameras is enabled for users with a dual HDR video capture engine
Wi-Fi 6E offers support for superior power efficiency, and the 2×2 MIMO antenna brings faster, more reliable connections
Supports high-end UFS 3.1 storage and LPDDR5 RAM, ensuring ultra-fast data streams for speedier application performance.

Additionally, to ensure low-latency connections with the new tri-band (2.4GHz, 5GHz, and 6GHz), that extends game duration and performance, the Dimensity 1050 delivers Wi-Fi optimizations alongside MediaTek’s HyperEngine 5.0 gaming technology.

MediaTek has further said that smartphones powered by the Dimensity 1050 will be available on the market during the third quarter of 2022. For more information on Dimensity 1050, kindly visit their press release page.

Enhancing the development of IoT applications using the U-Blox XPLR-IOT-1 kit

Posted on 19 June, 2022 by Abhishek Jadhav

To address the increasing complexity of IoT devices, U-Blox, known for developing wireless communication technologies, has announced the multifunctional application board U-Blox XPLR-IOT-1 over evaluation kits (EVKs). The hardware is an all-in-one package for testing, evaluating, and validating IoT applications that integrates all U-Blox technologies and services into a powerful prototyping platform with a wide range of sensors and interfaces as well as cloud connectivity.

The all-new XPLR-IOT-1 kit is to make the designing and development of complex IoT applications extremely easy, fast, and user-friendly while reducing the time to market. The board’s core MCU is the U-Blox NORA-B106 Bluetooth LE 5.2 radio module, which hosts the application software and controls other modules. This incorporates a U-Blox SARA-R510S module with built-in cloud security for LTE-M and NB-IoT cellular connectivity. Additionally, it features U-Blox NINA-W156 WiFi and a MAX-M10S positioning module to track four global navigation satellite system (GNSS) constellations at the same time. Hence, provide highly accurate location data whenever GNSS coverage is available.

“The hardware is complemented by a broad selection of sensors commonly used in IoT applications, including accelerometers and gyroscopes, a magnetometer, and temperature, humidity, pressure, and ambient light sensors.”

By providing a trial subscription to MQTT Anywhere, the kit makes it simple for engineers to get started with U-Blox services. The trial accounts enable connection to the Thingstream IoT service delivery platform. The kit can publish data to the cloud and demonstrate a comprehensive end-to-end solution with only a few manual steps.

The XPLR-IOT-1 kit connects to the U-Blox MQTT Anywhere service using the MQTT-SN (MQTT for sensor networks) protocol for power and data-efficient communication with the Thingstream platform. Instead, if the user prefers Wi-Fi, the built-in Wi-Fi module and the U-Blox MQTT Now service provide an alternative route to the cloud. With U-Blox’s positioning in cloud service, tracking applications with the most demanding power needs, such as freight container trackers, may achieve four times longer battery life. CellLocate, on the other hand, is a mobile-network-based location service that extends tracking beyond the reach of GNSS signals.

“The XPLR-IOT-1 is fully geared towards rapid development, testing, and validation of IoT solutions. Offering a single platform to develop a variety of IoT use cases, the versatile explorer kit reduces the expertise required for hardware, software, and service integration and code development,” says Pelle Svensson, Senior Principal, at U-Blox.

Users can implement numerous sophisticated IoT applications that are highly efficient in terms of both performance and power consumption, along with various other features including good connectivity and a wide range of hardware and software support. XPLR-IOT-1 developers can leverage code from U-Blox’s ubxlib GitHub repository to accelerate prototyping of solutions spanning from wireless sensor networks to indoor and outdoor tracking systems to industrial or smart building gateways.

If you want to try out the all-new XPLR-IOT-1, the manufacturer plans to release the kit in June 2022, initially via Digi-Key.

U-Blox designs the world’s smallest LTE CAT 4 module: LARA-L6

Posted on 18 June, 2022 by Abhishek Jadhav

U-Blox, a leading global producer of positioning and wireless communication technology, has launched the world’s compact LTE Cat 4 cellular module with global coverage and 2G/3G fallback. The all-new U-Blox LARA-L6 module’s versatile interfaces, features, multi-band, and multi-mode capabilities make it ideal for a wide range of applications requiring high data speed, seamless connectivity, superior coverage, low latency, and streaming data. The latest addition is meant to deliver download data rates of 150 Mbps and upload data rates of 50 Mbps as a successor to the U-Blox TOBY-L2 module series.

Designed for size-constrained applications, the LARA-L6 offers high data throughput and native compatibility for external U-Blox GNSS receivers. Video surveillance, dashcams, high-end telematics, gateways and routers, and connected health devices are all possible uses for the module. One of the numerous advantages of LARA-L6, it offers a full set of security features such as a root of trust, secure boot, and secure updates.

With a 24 x 26 x 2.6 mm form factor, the tiny cellular modem is available in two variants: the LARA-L6004 (global) and LARA-L6404 (North America). The new design complements U-Blox’s IoT Security-as-a-Service solution, which safeguards your data both on the device and during transmission to the cloud. This service offers design security, end-to-end security, and access control, all of which can be accessed via the Thingstream service delivery platform. Hence, this ensures that you can focus on your business and enjoy faster time-to-market.

What makes it even more remarkable, the LARA-L6 has pin/pad compatibility with all U-Blox LARA and SARA form factors. According to the manufacturer, this allows customers to design a single PCB that can handle many U-Blox technologies while requiring minimal hardware and software development. It also includes regulatory and MNO certifications, making logistical management for global deployment easy.

“At U-Blox, we understand that customers need compact, flexible, and secure solutions that simplify the complex logistics of product development for global applications. As the smallest globally certified LTE Cat 4 module on the market, LARA-L6 is a clear fit for size-constrained solutions demanding robust security, integration with positioning solutions, and flexibility to adapt designs to use-case-specific data rates requirements,” says Drazen Drinic, Product Manager at U-Blox.

As mentioned earlier, the LARA-L6 is designed to integrate smoothly with U-Blox GNSS receivers, delivering higher positioning performance over competing systems with onboard GNSS receivers. This simplifies the development of IoT applications that rely on satellite-based positionings, such as tracking and telematics devices. With LARA-L6, developers can seamlessly integrate with U-Blox GNSS receivers, thanks to native support for GNSS AT commands used to manage positioning modules and chipsets.

Samples of the U-Blox LARA-L6 will be available in the second quarter of 2022, but there are no details on pricing yet.

Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers

Posted on 18 June, 2022 by Abhishek Jadhav

The China-based embedded electronics specialist, Lilygo, has released a low-cost development board, the T-Zigbee board that combines the ESP32-C3 microcontroller and the Telink TLSR8258 multi-protocol wireless SoC.

The ESP32-C3 is a single-core Wi-Fi and Bluetooth 5 (LE) microcontroller SoC, which includes a 32-bit RISC-V core running at up to 160MHz alongside 400kB of SRAM. It achieves the ideal cost-effective solution for connected devices by striking the proper power, I/O capabilities, and security combination. Due to the device’s availability of Wi-Fi and Bluetooth 5 (LE) connectivity, it not only simplifies configuration but also allows for some use-cases based on dual connectivity.

The board also features Telink’s TLSR8258, a multi-protocol radio controller operating at 48MHz. It extends its support for the Zigbee 3.0 connectivity along with RF4CE BLE 5 Mesh, Thread, HomeKit, ANT, 6LoWPAN, and 2.4GHz proprietary connectivity.

Specifications of the T-Zigbee Board

MCU: ESP32-C3 RISC-V processor that supports Wi-Fi 4 and Bluetooth 5.0 LE connectivity and TLSR8258 multi-protocol radio controller
Antennas: Features 2x PCB antennas and 2x u.FL antenna connectors
USB: 1xUSB Type-C port for programming and power
Misc: Provides reset and user keys and for UART/programming selection between the ESP32-C3 and TLSR8258, the board provides a DIP switch
Power supply: 5V via the USB Type-C port
Dimensions: 7.5 x 2.9 cm

The MCU development board provides 21 general-purpose input/output (GPIO) pins shared between the two processors. It offers four analog inputs, three UART, two I2C, two SPI, a digital MIC, PWM, and I2S buses. The board also offers three user-controllable LEDs, a reset, and a single-user addressable button.

However, this isn’t Lilygo’s first board to feature the ESP32-C3 SoC. Lilygo’s TTGO T-OI PLUS, released last year, was built around this chip, followed by the surface-mounted T-32C3 module a few months later. Despite employing an identical system-on-chip, the T-Zigbee does not use the T-32C3 module, most likely to save footprint on the compact development board.

Priced at $13.27, the T-Zigbee development board can be purchased from AliExpress, excluding the taxes and shipment costs. Further information on the dual MCU development board can also be found on the product page.

FriendlyELEC unveils NanoPi R5S single board computer fueled by RK3568

Posted on 18 June, 2022 by Abhishek Jadhav

FriendlyELEC has announced its newest addition to the NanoPi range, the NanoPi R5S. The NanoPi R5S is a single-board computer that includes three Ethernet ports, of which two are capable of 2.5-gigabit operations, and one is capable of gigabit connectivity. Furthermore, it also provides M.2 NVMe facilitating storage expansion capabilities.

At the heart of the single-board computer is the Rockchip RK3568 which includes the quad-core Arm Cortex-A55 CPU, Mali-G52 GPU, and a VPU with 4K 60fps video decoding, 1080P 60fps video encoding, and a neural network coprocessor that offers up to 0.8 TOPS of performance. The SoC also facilitates wireless transmission by supporting Wi-Fi 6. Additionally, it provides a system memory of 2GB of LPDDR4X.

Specifications of NanoPi R5S

SoC: Rockchip RK3568 with quad-core Arm Cortex-A55 CPU
GPU: Mali-G52 GPU
Storage: Support for the M.2 2280 (PCIe 2.0 x1) NVMe SSD is offered with a key M socket, offers a MicroSD card socket, 8GB eMMC flash for the operating system, and supports network boot with an optional SPI flash
USB: Offers two USB 3.0 Type-A ports
HDMI: Supports HDMI 1.4 and HDMI 2.0 operation, up to 10 bits deep colour modes are supported, offers support for 3-D video formats
Power Supply: 5V/9V/12V input for USB Type-C port and supports USB power delivery
Weight: The board weighs 260g with a metal enclosure and 57.5g without the case
Dimensions of the board: Printed Circuit Board: 90 x 62 mm; Metal enclosure: 94.5 x 68 x 30 mm
Operating temperature range: 0℃ to 70℃

Compatible with NVMe storage and other PCI Express devices, the board provides a microSD port and an M.2 Key M slot on the underside allowing for storage expansion. Although the board doesn’t have a readily available GPIO header, the available pins are carried out to a high-density FPC connector for use with a breakout board. This includes a single SPI bus, up to three UART buses, and eight GPIO pins, four of which enable pulse-width modulation (PWM). Furthermore, with the help of a second connector, the SDIO 3.0 and I2S signals are provided.

FriendlyELEC offers support for the FriendlyWrt 22.03 (64-bit) and FriendlyCore Focal Lite images based on OpenWrt 22.03 and Ubuntu 20.04, but with Linux 5.10 LTS and U-boot 2017.09. The firm has also emphasized its support for Docker and has included instructions for installing the Jellyfin multimedia applications on its wiki page.

More information on the technical specifications of the NanoPI R5S can be availed from the FriendlyELEC’s wiki page.

Esperanto Technologies’ Evaluation Program gives access to the ET-SoC-1 AI inference accelerator

Posted on 18 June, 2022 by Abhishek Jadhav

At the Hot Chips 33 conference, California-headquartered Esperanto Technologies, known for providing high-performance machine learning inference accelerators, unveiled the company’s new ET-SoC-1 “supercomputer-on-a-chip” based on the RISC-V open-standard instruction set architecture. On April 20, 2022, Holly Stump, an Integrated Marketing Consultant with Esperanto Technologies, announced the initial evaluation for its ET-SoC-1 AI inference accelerators with support from their lead customers.

As part of Esperanto’s evaluation program, users can monitor performance by running several AI models, including recommendation, transformer, and visual networks on the ET-SoC-1 AI inference accelerator. The user can set options for models, dataset selection, data type, batch size, and compute configuration from options of up to 32 clusters and over 1000 RISC-V cores.

“Our data science team was very impressed with the initial evaluation of Esperanto’s AI acceleration solution,” said Dr Patrick Bangert, vice president of Artificial Intelligence at Samsung SDS. “It was fast, performant and overall easy to use. In addition, the SoC demonstrated near-linear performance scaling across different configurations of AI compute clusters. This is a unique capability, and one we have yet to see consistently delivered by established companies offering alternative solutions to Esperanto.”

Esperanto’s ET-SoC-1 is a high-performance AI inference accelerator delivering high performance per watt for various AI workloads. The flexibility and scalability allow the “Supercomputer-on-a-chip” (SoC) to support all inference applications and to be deployed at a scale to provide highly parallelized performance.

The specifications provided by the manufacturer as a part of the Esperanto Access Program are:

Thousands (1093) of RISC-V processors on a 7nm process chip
1088 ET-Minion 64-bit RISC-V in-order processor cores with a vector/tensor unit
Four high-performance ET-Maxion 64-bit RISC-V processor out-of-order cores
One on-chip 64-bit RISC-V service processor core
Operations at under 20 watts for ML recommendation workloads
Low power architecture and circuit design techniques

Esperanto’s evaluation program gives exclusive access to technology that will eventually evaluate the functionality of ET-SoC-1 for inferencing in several AI models. The performance evaluation of ET-SoC-1 will take place in specific models and software environments. The custom-designed performance evaluation for the customer’s platform, models and datasets will provide better insights. Participants will also receive a higher supply priority.

“Harnessing the power of over 1,000 RISC-V processors is a major accomplishment, and we are very pleased with the results which validate our initial projections of performance and efficiency,” said Art Swift, president and CEO of Esperanto Technologies. “We look forward to extending access to a broader range of qualified companies as we accelerate our RISC-V roadmap efforts with a growing number of strategic partners for applications spanning from Cloud to Edge.”

If you are interested, you can reach out to the company as additional slots are available for “qualified” customers.

Oukitel WP19 Biggest Battery Rugged Phone Global Premiere Time – Discount and Specs Released

Posted on 16 June, 2022 by mixos

Oukitel WP19, the Newest Rugged Outdoor Smartphone Global Premiere Date with Biggest Discount has already been confirmed. Oukitel WP19 global premiere time is 27th June – 1st July. This latest outdoor rugged smartphone with the world’s largest battery now is available for pre-order on AliExpress. WP19’s retail price will be $599.99. During this limited time, the first buyers can enjoy early bird offers at $299.99, plus an additional $30 coupon discount. Add to your cart now, you can even get your Oukitel WP19 at the lowest price of $269.99 only. Stay tuned, and there will be more discounts during its Global Premiere sale.

Now it is time to reveal the real face of Oukitel WP19.

21000mAh Explorer-Power Beast

You would be amazed by WP19’s massive 21000mAh battery capacity, which is well-known as the world’s largest one so far in the phone’s category. Having a WP19 phone is a great choice for those who spend most of their time outdoors, such as adventures and field rescue, since it can last 7 days after a single charge. The 33W fast charging features a time saver. To charge this power beast from 0-80%, you only need to wait less than 3 hours! Additionally, its OTG reverse charging function allows you to refill your other devices outdoors when you barely reach any power.

64MP Main Camera+Night Vision Camera

Oukitel WP19 also features other decent specs, particularly the high-pixel cameras. WP19 is equipped with a 64MP SAMSUNG S5K main camera, SONY IMX350 20MP night vision Camera, and 2MP macro camera. Its night vision camera not only can offer you an opportunity to take clear pictures in the dark area, moreover, but this function can also help you to detect all potential dangers outdoors.

6.78-inch FHD+ Display and 90Hz Refresh Rate

The Oukitel WP19’s 6.78-inch FHD+ anti-scratch screen with 397 pixels per inch (PPI) and 90Hz refresh rate enable you to enjoy more display real estate and clearer details viewing. Furthermore, the MediaTek Helio G95 4G chipset, together with 8GB RAM and 256GB ROM internal storage promise a smooth and thrilling gaming or movie-watching experience.

As a rugged phone, WP19 has passed IP68 & IP69K & MIL-STD-810H ruggedness tests, which indicates it can survive in any tough environment as this phone is marked waterproof, dustproof, and drop-proof. WP19 is also designed with more handy functions, such as customized key, fingerprint & face ID, NFC Google Pay, digital outdoor toolkit, etc.

Video

Video Link: https://youtu.be/14BIntpwtlw

WP19 Giveaway：https://oukitel.com/pages/oukitel-wp19

ADLINK releases its new AIoT SMARC module, a first based on MediaTek® SoC, featuring Genio 1200 with an 8-core CPU + 5-core GPU

Posted on 16 June, 2022 by mixos

Summary:

The ADLINK’s new module is of SMARC 2.1 specification, short size, based on the MediaTek® Genio 1200 processor, and designed to drive AIoT, 4K graphics applications at the edge
It features an octa-core (4x Cortex-A78 + 4x Cortex-A55) CPU at 2.2GHz, a 5-core GPU for advanced 3D graphics, and an integrated APU (AI Processor Unit) for on-device AI while supporting multiple 4K displays and camera inputs, all packed with exceptional power efficiency

ADLINK Technology Inc., a global leader in edge computing, announces the release of its very first SMARC module built with a MediaTek® SoC. Utilizing the MediaTek® Genio 1200 processor, this ADLINK SMARC COM features high-performance AI and graphics-centric capabilities, ideal for various AIoT use cases at the edge. This includes everything from advanced smart home, human-machine interface, and 4K multimedia applications, to industrial IoT, robotics, and more.

ADLINK’s MediaTek Genio 1200 SMARC Module harnesses an octa-core CPU (4x Cortex-A78 + 4x Cortex-A55 at 2.2GHz) for running compute-intensive workloads, a 5-core GPU for advanced 3D graphics and an APU (AI Processor Unit) for on-device AI processing, such as deep learning, neural network (NN) acceleration, and computer vision. Its spate of functionalities includes support for multiple 4K displays, up to three MIPI camera inputs, and extended IO connectivity.

“With a powerful 8-core CPU and integrating GPU plus APU, the module showcases a computing prowess previously only seen in x86 platforms, and at half the power envelope,” said Henri Parmentier, Senior Product Manager, ADLINK. “It enables our clients to bring advanced intelligent systems that can not only handle extreme workloads but also reduce energy costs and leverage for an improved carbon footprint.”

“MediaTek’s Genio AIoT platform was designed to play a key role in helping drive the next generation of innovation at the edge,” said Richard Lu, Vice President of MediaTek’s AIoT Business Unit. “We look forward to seeing the many new user experiences that are brought to life through ADLINK’s latest Genio 1200-powered SMARC module.”

For industrial AIoT innovations, the module can build powerful robots for use in harsh industrial conditions and in temperatures that range from -40° to 85°C.

Its features include:

MediaTek® MT8395 CPU (Arm Cortex-A78 x4 + Cortex-A55 x4)
Up to 5 TOPS APU system
Up to 8GB LPDDR4
1x onboard UFS, up to 256GB
DSI up to 1080P
HDMI up to 4K/60
3x MIPI CSI interfaces
10 year product availability

ADLINK’s MediaTek Genio 1200 SMARC Module is part of ADLINK’s portfolio of SMARC form factors that support both ARM and x86 designs. ADLINK has worked closely with MediaTek to deliver a smart, powerful solution for AI and graphics-centric IoT applications. Alongside its high-performance, on-device AI and multitasking compute capabilities, the module is offered with low power consumption and extended temperature tolerance option, empowering system integrators to run complex AI workloads even in harsh environments, and making it the ideal solution to various AIoT use scenarios in any industry.

Visit ADLINK Technology to learn more about the MediaTek Genio 1200-powered module or ADLINK’s prototyping-dedicated I-Pi wiki for its development kit — I-Pi SMARC 1200.