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Lynred launches ATI640, easy-to-use VGA LWIR thermal imaging module for new market players in infrared

Posted on by mixos

With offer of seamless IR assembly in any application, plug-and-play module makes thermal imaging more accessible to integrators of surveillance and defense, including drone systems

Lynred, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets, today announces the launch of ATI640, its plug-and-play, longwave infrared (LWIR) thermal imaging module with VGA resolution, for new market players seeking easier access to infrared (IR) technologies. With ATI640’s high image quality, reliability, user-friendly interface and seamless assembly, system developers can now integrate IR optronics without making a major investment or needing specialty knowledge in optical design, sensor calibration or image correction, which previously hindered wider adoption of IR technologies.

By stripping out the complexity in thermal imaging, Lynred’s ATI640 frees up the development time of system integrators, giving them more scope to focus on innovation and product quality, and thus increase their competitiveness with faster access to market.

“ATI640’s plug-and-play solution makes infrared technology more accessible to new entrants in thermal imaging. In choosing this easy-to-use module, system integrators can speed-up their development of longwave infrared (LWIR) cameras and systems,” said Nadia Souhami, product unit director at Lynred. “ATI640 is the latest in a long line of thermal imaging innovations Lynred has brought to the market. We are excited about launching this module at Eurosatory and showing the power of its embedded image processing algorithms, while limiting the power consumption to just 1W. Our solution can bring smart thermal imaging with competitive advantages to any market application, drones in particular, which is a fast-growing market.”

Key product features

ATI640 is based on Lynred’s best-in-class, 640×480, 12µm pixel pitch sensor. It is designed with a SWaP-C (small Size, low Weight, low Power consumption, low Cost) core to optimize integration into optronic systems. The module is calibrated to work in shutterless mode to provide an uninterrupted video experience. Thanks to its shutterless operation and pairing with advanced image processing algorithms, ATI640 offers an excellent image quality with no trade-off on SWaP-C requirements. Its frame rate (60Hz) captures fast moving targets and produces smooth video footage. It is available with or without a lens.

Lynred will display ATI640, in conjunction with other new products, at Eurosatory, booth 5A-C155, taking place in Paris, France, June 17 – 21, 2024.

www.lynred.com

Qualcomm Announces the Edge AI RB3 Gen 2 Chip for IoT and Robotics and a “Micro-Power” Wi-Fi SoC

Posted on by Aditi Ambadkar

micro-power Wi-Fi system

Qualcomm has introduced two innovative products designed to advance the Internet of Things (IoT) and robotics projects: the RB3 Gen 2 system-on-chip (SoC) and a “micro-power Wi-Fi system” SoC. These new offerings aim to provide high-performance computing and significant power savings for embedded applications.

The RB3 Gen 2 SoC is built on the Qualcomm QCS6490 processor and delivers substantial improvements over its predecessor. It features a Kryo 670 CPU complex with a combination of high-performance and low-power cores, including one Cortex-A78 Kryo Gold Plus core running at up to 2.7GHz, three Cortex-A78 Kryo Gold cores at up to 2.4GHz, and four Cortex-A55 Kryo Silver cores at up to 1.9GHz. This configuration ensures robust performance for various IoT and robotics workloads.

The RB3 Gen 2 also boasts a sixth-generation Qualcomm AI Engine, equipped with Hexagon 770 tensor and scalar accelerators and vector processing extensions, delivering up to 12 tera-operations per second (TOPS) of AI computing power. This makes it well-suited for on-device AI tasks, enabling real-time processing and advanced machine-learning capabilities. Additionally, the SoC includes an Adreno 643L graphics processor and an Adreno 633 vision processing unit, enhancing its capabilities for computer vision and graphical applications.

Block Diagram
Block Diagram

Connectivity is another strong point of the RB3 Gen 2, which supports tri-band Wi-Fi 6E and Bluetooth 5.2 with Bluetooth Low Energy Audio. It also includes NFC support, a GNSS receiver for accurate positioning, and five camera inputs managed by a Spectra image processor. The SoC can handle up to two displays at 1080p144 on-device or 4k60 external, supporting both LPDDR5 and LPDDR4X memory. Qualcomm has committed to a 15-year availability under its longevity program, ensuring long-term support for developers and manufacturers.

Complementing the RB3 Gen 2 is the Qualcomm QCC730 SoC, a micro-power Wi-Fi solution targeting battery-powered IoT devices. According to Qualcomm, the QCC730 offers up to 88 percent power savings compared to previous-generation parts. It supports dual-band Wi-Fi connectivity and is designed to handle TCP/IP networking while maintaining low power consumption and a small form factor.

The QCC730 launches with an open-source integrated development environment (IDE) and software development kit (SDK) that includes cloud offload capabilities. This makes it easier for developers to integrate and deploy IoT applications. Qualcomm positions the QCC730 as a high-performance alternative to Bluetooth for IoT applications, given its superior power efficiency and robust networking capabilities.

Both the RB3 Gen 2 and QCC730 SoCs are designed to accelerate the development of advanced IoT solutions. The RB3 Gen 2 offers powerful AI processing and comprehensive connectivity options, while the QCC730 focuses on ultra-low power consumption for always-on, battery-powered devices. Together, these new products from Qualcomm provide a robust platform for the next generation of IoT and robotics applications.

More information on the RB3 Gen 2 is available on the Qualcomm website, along with two development boards built in partnership with Thundercomm — available to pre-order at $399 for the base Core Kit and $599 for the Vision Kit, which includes both high-and low-resolution camera sensors.

W01 U2500 by 52Pi: High-Speed Networking and NVMe Expansion for Raspberry Pi 5

Posted on by Aditi Ambadkar

52Pi W01 U2500 Compatibility

The W01 U2500 by 52Pi is a versatile HAT designed specifically for the Raspberry Pi 5, offering a unique combination of NVMe SSD expansion and USB 2.5G network capabilities. This compact solution is powered by the reliable Realtek RTL8156BG chipset, ensuring seamless integration with your Raspberry Pi 5 for high-speed data transfer and networking performance.

The W01 U2500 enables users to expand their storage capacity with NVMe SSD support, resulting in faster data access and improved system responsiveness. The built-in USB 2.5G network card provides lightning-fast connectivity, ideal for demanding applications, streaming, and online gaming. It’s important to note that the USB 2.5G Ethernet does not support the PoE protocol. Tailored for the latest Raspberry Pi model, the W01 U2500 ensures optimal compatibility. It supports installing NVMe (M-key) drives in M.2 format sizes 2230, 2242, 2260, and 2280, with no soldering required due to the included custom CNC SSD mount screw. The PCIe x1 interface supports both Gen2 and Gen3 standards, enhancing connectivity options.

52Pi W01 U2500 Interfaces
52Pi W01 U2500 Interfaces

The hollow design promotes excellent ventilation and cooling efficiency according to 52Pi. The gold-plated PCB ensures superior electrical performance and reliability, while the short trace routing of PCIe improves reliability and speed, fully meeting PCIe 3.0 signal requirements. An LED light for M.2 disk activity (“ACT”) provides clear status visibility. The board format adheres to the original Raspberry Pi HAT dimensions of 65 x 56.50 mm. The M.2 standard-compliant power system features an integrated voltage regulator delivering up to 3A for the 3.3V power rail.

In addition to the hardware, the package includes all necessary accessories such as an FPC PCIe ribbon, M2 and M2.5 screws, spacers, and an extra custom CNC SSD mount screw. The PCB also has openings for routing two Display/Camera FPC cables, providing flexibility for various project needs. With its blend of high-speed networking and NVMe SSD expansion, the W01 U2500 by 52Pi is an excellent addition for Raspberry Pi 5 users looking to enhance their system’s storage and connectivity capabilities.

The 52Pi Product W01 U2500 is now available to order on the official web store, priced at $29.99; additional information is available on the 52Pi wiki.

Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform

Posted on by Aditi Ambadkar

RB3 Gen 2

The Qualcomm® RB3 Gen 2 Development Kit is the latest iteration in the RB3 series, designed to enhance performance and accessibility for IoT development. Powered by the advanced Qualcomm® QCS6490 Chipset, this kit offers a significant upgrade over its predecessor, with substantial improvements in AI computing and overall processing capabilities.

Key features of the Qualcomm® RB3 Gen 2 Development Kit include a powerful QCS6490 processor, which supports a variety of Linux-based distributions tailored for IoT applications. The AI computing performance has quadrupled, reaching an impressive 12 TOPS. This development kit is compatible with multiple SDKs and tools, such as the Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, and Qualcomm® Intelligent Robotics Product SDK. Additionally, it provides a comprehensive set of demo applications and tutorials to accelerate IoT application development. The kit adheres to the 96Boards specification and supports a wide array of sensors, including multiple cameras, depth sensing solutions, and various other sensors like IMU, pressure sensors, and magnetometers.

Qualcomm® RB3 Gen 2 Development Kit

The RB3 Gen 2 offers robust AI processing and computer vision capabilities, making it suitable for a broad range of IoT solutions across enterprise, robotics, industrial, and automation sectors. It features support for Qualcomm® Linux®, a complete package of OS, software, tools, and documentation specifically designed for Qualcomm’s IoT platforms. The QCS6490 chipset significantly boosts AI processing capabilities, enabling higher inferences per second, improved power efficiency, and the ability to run multiple networks simultaneously. This on-device machine learning capability, combined with edge computing, allows for near real-time processing of vast data amounts.

Qualcomm® RB3 Gen 2 Development Kit Features:

  • Advanced ISPs for superior image and video capture with single or multiple concurrent camera support.
  • AI-accelerated workplace security and visibility.
  • Multi-gigabit Wi-Fi 6E for fast, low-latency wireless connectivity.
  • Superior Bluetooth® 5.2 and LE audio with low latency and extended range.
  • Low-speed expansion for GPIOs, I2C, SPI, UART, and audio.
  • High-speed expansion for PCIe, USB, MIPI CSI/DSI, and SDIO, designed for 96Boards mezzanines.

The development kit includes hardware that complies with the 96Boards open hardware specification, allowing for a range of mezzanine-board expansions, starting with the Vision Mezzanine. The Qualcomm® Spectra™ ISP 570L image processing engine delivers exceptional photography and videography experiences. It supports connections to multiple cameras, including stereo, depth, and Time-of-Flight (ToF). The Qualcomm® Adreno™ 633 VPU provides UltraHD video encoding and decoding, while the Adreno 1075 DPU supports both on-device and external UltraHD displays. Additionally, the kit features multi-gigabit Wi-Fi 6E for fast wireless connectivity and low latency, along with advanced features such as Qualcomm® 4K QAM and support for high-speed 160MHz channels.

Block Diagram

The Qualcomm® Kryo™ 670 CPU and Qualcomm® Hexagon™ processor with a fused AI-accelerator architecture ensure powerful connections and computing performance. This makes the RB3 Gen 2 development kit ideal for various industrial and commercial IoT applications, including ruggedized handhelds, human-machine interface systems, point-of-sale systems, drones, kiosks, edge AI boxes, and connected cameras.

Qualcomm RB3 Gen 2 platform is available for pre-order now on Thundercomm for $399 (Core Kit) and $599 (Vision Kit) with a 12V wall power supply, a USB Type-C cable, mini speakers, a setup guide, and a pick tool for setting switches, and the Vision Kit also adds a mounting bracket for the high-resolution and low-resolution CSI cameras part of the kit. More details may be found on the product page.

Pomelo: Affordable and Versatile Gamma Spectroscopy Module for Hobbyists and Developers

Posted on by Aditi Ambadkar

Pomelo Gamma Radation Detector

Pomelo is an innovative radiation detector tailored for hobby-level gamma spectroscopy, designed to be both accessible and versatile. Developed to provide a complete low-power gamma-ray spectrometer, Pomelo can function independently or be seamlessly integrated into other projects, offering a broad range of applications for enthusiasts and developers alike.

The Pomelo gamma spectroscopy module is built around a set of well-defined requirements, prioritizing low cost and low power consumption. The target is to keep the component cost below 150 euros, making it an affordable option for hobbyists and educational purposes. At its core, the module utilizes a commercial off-the-shelf (COTS) scintillator and a silicon photomultiplier (SiPM), ensuring reliability and performance.

The detector assembly, branded as Pomelo Physics, comprises a CsI(Tl) scintillator measuring 10mm x 10mm x 30mm from OST Photonics and a Broadcom AFBR-S4N44P014M SiPM. This combination effectively detects gamma rays within an energy range of 50 keV to 3 MeV. To maintain accuracy and protect the SiPM from stray light, the scintillator is housed in a 3D printed dark box. Additionally, the module includes a Texas Instruments TMP126 temperature sensor to provide temperature compensation, ensuring consistent performance across varying environmental conditions.

Block Diagram
Block Diagram

Pomelo Core, the accompanying electronics module, integrates several features that enhance its functionality and ease of use. It includes a bias supply, an analog front end, and digital electronics, all essential for effective gamma ray detection and data processing. One of the standout features of Pomelo is its versatile connectivity options. The module supports USB connectivity (CDC) for data dumping to a terminal, making it straightforward to interface with laptops and other USB-equipped devices. Additionally, it features UART for interfacing with external microcontroller units (MCUs), such as Arduinos or Raspberry Pis. The onboard level shifter on the UART lines ensures compatibility with both 3.3V and 5V systems.

Pomelo is designed to be user-friendly while offering robust performance. It supports onboard histogramming and run control, enabling spectrum readout, reset functions, and timed measurements directly from the device. For more advanced applications, the module provides a list-mode data option, allowing detailed analysis of individual gamma events.

Furthermore, Pomelo includes dedicated hardware handshaking for coincidence measurements with two devices, enhancing its capability for complex experiments. The software-configurable energy threshold adds another layer of customization, allowing users to tailor the module’s sensitivity to specific requirements.

Pomelo stands out as a comprehensive solution for gamma spectroscopy, combining affordability, low power consumption, and versatile connectivity in a compact design. Its integration of commercial scintillator and SiPM components, coupled with thoughtful features like temperature compensation and coincidence measurements, makes it a powerful tool for hobbyists, educators, and developers exploring the fascinating world of gamma spectroscopy. Whether used as a standalone device or integrated into larger projects, Pomelo offers everything needed for effective gamma ray detection and analysis.

more information: https://hackaday.io/project/194457-pomelo-gamma-spectroscopy-module

Arduino Unveils Opta Digital, Analog Expansion Modules for Bigger PLC Projects

Posted on by Aditi Ambadkar

Arduino has announced two new entries in its Opta programmable logic controller (PLC) family, designed for those projects that are a little too complex for a single controller: the Opta Digital and Opta Analog Expansion Modules. These new modules offer additional pins and true analog outputs for the analog variant, enhancing the flexibility of any Opta PLC.

“Enhance your Arduino Opta’s real-time control, monitor, and predictive maintenance applications thanks to the Arduino Pro Opta Expansions,” the Arduino team writes of its latest launch. “Quickly put them to work, managing the new I/Os [Inputs/Outputs] from the Opta base unit seamlessly, taking advantage of the open and widely known Arduino ecosystem or PLC IDE IEC 61131-3 programming environment.”

Arduino launched the Opta micro PLC family in November 2022 as it looked to branch out into the industrial programmable logic controller market — complete with a new development environment with support for IEC 61131-3-standard PLC languages, including ladder logic and function block diagrams. Earlier this month, the company launched the PLC Starter Kit, which offers Opta WiFi along with Simulat8 and DIN Celsius add-ons and a 20-hour course to introduce PLCs in general and the Opta and its development environment specifically.

Expansion Socket

The new expansion modules target applications where the base Opta PLCs lack enough connectivity and deliver a cheaper and more easily managed alternative to simply adding additional PLCs into the mix. Mimicking the form factor of the Optas themselves, the expansion modules connect at the side and deliver either additional digital or analog connectivity — all managed from the base Opta using a simple library. Up to five modules can be connected to a single Opta, Arduino has confirmed, connecting side-by-side through their expansion ports.

Digital Expansion Module and Analog Expansion Module
Digital Expansion Module and Analog Expansion Module

The Arduino Opta Digital Expansion Modules come in two varieties: the D1608E offers 16 programmable inputs, which can be used as 0-24V digital or 0-10V analog inputs, and eight electromechanical relays supporting 240V AC at up to 6A; the D1608S has the same 16 voltage inputs but swaps the electromechanical relays for solid-state versions supporting 24V DC at up to 2A. The Arduino Opta Analog Expansion Module, code A0602, meanwhile, adds six analog inputs that can be configured to read voltages from 0-10V, current up to 20mA, and two of which can read temperatures from optional RTD PT100 sensors, four digital outputs with pulse-width modulation (PWM) support, and two true analog outputs supporting 0-10V or up to 20mA programmable output — a feature missing from the unexpanded Opta PLCs.

The Arduino Opta Digital Expansion Modules are the first available, with the Analog Expansion Modules to follow; the D1608E is priced at $136.80 and the D1608S at $146.40, both on the Arduino Store.

Seamless Worldwide IoT: Conexio Debuts Stratus Pro with Global Cellular Compatibility

Posted on by Aditi Ambadkar

Conexio Technologies has unveiled the Conexio Stratus Pro, an advanced cellular-based microcontroller board designed for IoT applications. This new product, available soon on Crowd Supply, features the Nordic Semiconductor nRF9161 SiP and nPM1300 PMIC in a Feather form factor, enhancing its versatility and performance for diverse projects.

The Stratus Pro integrates a Nordic Semiconductor nRF9161 system-in-package (SiP) that includes a microcontroller, LTE cellular radio, and GPS receiver. Additionally, the board houses a Nordic nPM1300 power management IC (PMIC) and a TI BQ25185 IC for charging various battery chemistries such as Li-ion, Li-Poly, and LiFePO4. An STMicroelectronics three-axis accelerometer further extends its functionality. The nRF9161 features an Arm Cortex-M33 with 1MB of flash memory and 256KB of RAM, supported by an external 16-kilobit EEPROM. The cellular modem is compatible with LTE-M and NB-IoT and is DECT NR+ ready, ensuring robust global connectivity.

Stratus Pro Back
Stratus Pro Back

Adopting the Adafruit Feather form factor, the Stratus Pro’s PCB measures 66.04 x 25.40 millimeters, offering 28 GPIO pins, a programmable push button, and an LED. It includes a SparkFun Qwiic-compatible connector for easy peripheral connections without soldering and can be programmed via USB-C or the onboard SWD/JTAG connector. Designed for seamless global use, the device supports eSIM and software SIM, providing reliable connectivity in over 100 countries. It comes with a data plan offering 500MB of cellular data and 250 SMS messages, valid for 10 years.

Conexio plans to open-source the Stratus Pro hardware design post-Crowd Supply campaign. Software examples and board design files will be available on Conexio’s GitHub, with projects built using the Nordic nRF Connect SDK on the Zephyr RTOS. Comprehensive documentation is available now, inviting users to explore the full potential of the Stratus Pro.

For more information, check out the Stratus Pro Crowd Supply campaign page. There, you can sign up for notifications for when the campaign goes live.

Mekotronics R57 is A Rockchip RK3576 Powred fanless mini PC with dual GbE Ethernet and 6 TOPS AI Power

Posted on by Debashis Das

Mekotronics R57 is a fanless AI mini-PC powered by a Rockchip RK3576 octa-core Cortex-A72/A53 SoC SoC. Other than that it has dual GbE Ethernet, 6 TOPS NPU RS232, RS485, and digital inputs and outputs, and in terms of RAM and Storage it includes up to 4GB LPDDR5, a 32GB eMMC flash.

Previously, we wrote about the Mekotronics R58X RK3588 mini-computer, Mekotronics LS1200 live streaming box, and many other mini-PCs like the AAEON de next-TGU8-EZBOX, MINIX Z100-AERO, MINIX NEO Z100-0dB and many others, feel free to check those out if you are looking for a powerful mini-pc for yourself.

While looking at the specifications of this PC it looked very similar to the Mekotronics R58X but upon looking it’s clear that it has some differences, like it has now got a HDMI IN port and a HDMI Out port and it also got h RS232, RS485, ports.

Mekotronics R57 Mini PC Specifications

  • CPU:
    • Rockchip RK3576, Octa-core
      • Quad-core Cortex A72 @ 2.2GHz
      • Quad-core Cortex A53 @ 1.8GHz
  • GPU:
    • Arm Mali G52
      • OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1
      • Embedded high-performance 2D acceleration hardware
  • NPU:
    • 6 TOPS* for INT8
      • Supports deep learning frameworks: TensorFlow, Caffe, Tflite, PyTorch, Onnx nn, Android NN, etc.
  • Memory:
    • DDR: LPDDR5 32bit 4G, 8G, 16G
    • Flash: EMMC 32G/64G/128G; UFS 32G/64G/128G/256G/512G/1T
  • Video:
    • Decoder: H.264/AVC 4K@60fps; H.264/HEVC, VP9, AVS2, AV1 4K@120fps or 8K@30fps
    • Encoder: H.265, H.264 up to 4K@60fps; supports multi-stream encoding
  • OS Support:
    • Android 14, Buildroot, Debian, Armbian
  • Video Output:
    • HDMI output 4K@120fps or 8K@30fps
    • Type-C (DP1.4 protocol)
  • HDR Support:
    • HDR10 / HDR HLG/HDR ViVid
  • Video Input:
    • HDMI input 4k@60fps
  • Camera:
    • MIPI CSI
  • Display:
    • MIPI DSI
  • Ethernet:
    • Dual G-LAN network 1000Mbps x2
  • Wireless:
    • AP6256, 2.4G/5G WiFi and Bluetooth V5.1 EDR and BLE
  • Clock:
    • Support RTC clock
  • USB:
    • USB3.0, USB2.0, Type-C
  • PCIE:
    • PCIE 3.0 M.2 M-key), support NVMe SSD size 2280
  • Mini PCIe:
    • Mini PCIe for 4G LTE/GPS module
  • SIM Card Slot:
    • Support Nano SIM card for 4G
  • Audio:
    • Support MIC and audio jack
  • Industrial Ports:
    • RS232, RS485
    • GPIO with High/Low switch
  • DC Power:
    • 12V 2Ah (DC port 5.5×2.1)
  • Dimension:
    • 186 x 106 x 33mm
  • Weight:
    • 362g

Mekotronics ensures comprehensive support for multiple operating systems including Android 14, Ubuntu, Debian, and Buildroot. Additionally, the system seamlessly integrates with AI frameworks such as TensorFlow, MXNet, PyTorch, and Caffe through the RKNPU2 toolkit, a feature consistent with other recent Rockchip SoCs.

Mekotronics R57 fanless AI mini PC is available for $140 on the company’s website with the default configuration of 4GB RAM and  32GB of Storage. More details and purchasing options can be found on the products page.

AAEON Revives its SMARC Module Line in Style with the uCOM-ADN

Posted on by mixos

Incredibly robust and with extensive connectivity, the uCOM-ADN offers a compact, efficient, and versatile tool for building industrial IoT applications.

AAEON, a leader in industrial IoT and AI Edge solutions has released the uCOM-ADN, a SMARC module powered by Intel® Atom® x7425E, Intel® Processor N97, and Intel® Core™ i3-N305 processors.

The uCOM-ADN represents the revival of AAEON’s involvement in the SMARC module sphere, where it is clear that the company’s extensive experience in creating reliable and high-performance Computer-on-Modules has proven invaluable. A standout feature of its newest offering is the uCOM-ADN’s support for the 8-core, 8-thread Intel® Core™ i3-N305 Processor, which merges high performance with efficient operation. The product also supports Intel Atom® x7425E and Intel® Processor N97 from the broader Intel® platform, giving users more flexibility.

Featuring up to 8GB of onboard LPDDR5x memory and 64GB of eMMC storage, the uCOM-ADN can achieve excellent data processing speed while providing ample storage capacity. Integrated Intel® UHD Graphics also lend it to applications requiring quality visual output, emphasized by two DP++ and one eDP interface at resolutions up to 3840 x 2160. This selection makes the uCOM-ADN well-suited to digital signage and smart kiosk solutions.

Key Specifications

  • Processor: Alder Lake N (Core i3-N305, Intel Atom x7425E, or Intel Processor N97)
  • Temperature Range: Default SKUs: -20°C ~ 70°C, Extended Temp SKU: -40°C ~ 85°C
  • Display: DP++ x 2, eDP
  • Interfaces & Expansion: MIPI CSI x 2, PCIe Gen 3 x 3, GPIO, SMBus, UART
  • Dimensions: 3.23″ x 1.97″ (82mm x 50mm)
  • Operating Systems: Windows 10/Windows 11 Enterprise, Linux Ubuntu 22.04.2/Kernel 5.19

For visual data acquisition, users have a broad range of interfaces to choose from, including two MIPI CSI, multiple USB, and dual LAN connectors supporting Intel® Ethernet Controllers I226-V or I226-IT, both running at 2.5GbE. For industrial communication, the module offers several UART interfaces, alongside a customizable 7-bit GPIO and SMBus. Expansion can be found in the form of three PCIe Gen 3 slots, while AAEON notes that a fourth PCIe Gen 3 interface is available upon request.

Of particular note is the module’s rugged design, which has a default operating temperature range of -20°C ~ 70°C, with an extended temperature SKU also available boasting a -40°C to 85°C temperature tolerance. This will be good news for those seeking a solution able to withstand challenging industrial environments while maintaining optimal performance.

The inclusion of TPM 2.0 also ensures robust security for critical applications, further lending credence to the uCOM-ADN’s industrial suitability. Support for both Windows® 10, Windows® 11 Enterprise, and Linux Ubuntu 22.04.2/Kernel 5.19 grants the uCOM-ADN broad OS compatibility, making it easy to integrate into existing systems.

For detailed specifications and additional information about the uCOM-ADN, please visit the product page on the AAEON website, or contact an AAEON representative directly.

IBASE Unveils First Ultra-Compact 2.5” Single Board Computer

Posted on by mixos

IBASE Technology Inc., a global leader in embedded computing solutions, proudly unveils its first ultra-compact 2.5” single board computer (SBC) designed for edge computing applications. The advanced IB200 SBC offers exceptional graphics processing performance with the AMD Ryzen™ Embedded R2000 Series. Featuring 4 cores and 8 threads integrated with the AMD Radeon Vega graphics controller, it delivers twice the CPU core count compared to the R1000 Series.

IB200 FEATURES:

  • AMD Ryzen™ Embedded R2000 series APU on board, up to 4 cores/8 threads
  • Onboard DDR4 memory, Max. 8GB
  • 2x HDMI 2.0b & LVDS: 5V/3.3V, 24 bit, dual channel (LVDS: 1920×1200 @60 Hz)
  • 2x GbE LAN, 4x COM, 2x USB 3.2 Gen2 (10Gbps) [with PDPC support], 3x USB 2.0 via pin headers
  • Supports 1x M.2 (M-Key, type 2280) & 1x M.2 (E-Key, type 2230)
  • Supports 4x COM – COM1/COM2: RS-232/422/485, COM3/COM4: RS232 (Default: RS-232, adjustable in BIOS)
  • Energy-efficient 12-25W thermal design

The industrial-grade IB200 SBC ensures a seamless multimedia experience with two HDMI 2.0b ports supporting 4K display and a dual-channel LVDS with a resolution of 1920×1200 @ 60Hz. It offers a comprehensive set of connectivity options, including dual Intel I226IT Gigabit LAN ports, four COM, two USB 3.2 Gen2 (10Gbps) ports with PDPC support, three USB 2.0 headers, and one M.2 2280 M-key and one M.2 2230 E-key slot, ensuring flexibility in storage selection and speed. Additionally, the board is equipped with TPM 2.0 and a SATA II interface, making it a versatile solution for various industrial IoT applications.

The IB200 comes with an energy-efficient 12-25W thermal design and delivers robust operation with an operating temperature range from 0°C to 60°C. The mini SBC, with dimensions of 100mm by 72mm, is designed for industries requiring powerful computing in a compact form factor. Its advanced features and connectivity options make it an ideal choice for modern edge computing applications such as manufacturing, industrial automation and smart retail, ensuring long-term reliability and superior graphics performance.

For more information, please visit www.ibase.com.tw

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