ASRock Industrial Unveils the 4X4 BOX-5000 Series with AMD Zen 3 Ryzen™ 5000 APUs for Energized Performance

ASRock Industrial announces the 4X4 BOX-5000 Series Mini PCs 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, with enhancement powered by AMD Zen 3 Ryzen™ 5000 U-Series APUs- Ryzen™ 7 5800U, Ryzen™ 5 5600U, and Ryzen™ 3 5400U up to 8 cores/16 threads to energize performance, energy efficiency, and lower latency. Featuring a powerful yet compact design, the 4X4 BOX-5000 Series supports quad display outputs up to 4K with AMD Radeon™ Graphics for the enhanced visual experience. The Series also includes dual LAN ports up to 2.5 Gigabit with one DASH function and Wi-Fi 6E support of 6GHz band for real-time connections. Moreover, it can uphold one M.2 Key M, one SATA 3.0 for storage, and five USB ports (three USB 3.2 Gen 2, two USB 2.0) for ultra-connectivity. The energized features make it the world’s most advanced core for a wide range of home and business applications such as gaming, content creation, working from home, KIOSK, digital signage, and many more.

AMD Zen 3 Ryzen™ 5000 APUs Energize Performance to a Green New Level

With AMD Ryzen™ 5000U Series Processors- Zen 3 Core Architecture, the 4X4 BOX-5000 Series Mini PCs deliver energized performance and reduced latency with up to 17% single-thread and multi-thread performance compared to Zen 2 along with improved graphics capabilities with AMD Radeon™ Graphics. Spanning from the flagship 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, the new Series is powered by AMD Ryzen™ 7 5800U, Ryzen™ 5 5600U, Ryzen™ 3 5400U to increase power efficiency with lower power consumption- 6.7W at idle. The 4X4 BOX-5000 Series also supports dual-channel DDR4 3200MHz SO-DIMM memory up to 64GB for uncompromised multitask computing capabilities.

4K Quad Displays, Dual LAN up to 2.5GbE and Wi-Fi 6E Support of 6GHz Band

The 4X4 BOX-5000 Series enhances working, learning, and gaming experiences all in one go. Key features include four displays outputs and integrated AMD® Radeon™ Graphics, the 4X4 BOX-5000 Series Mini PCs support one HDMI 2.0a, three DisplayPort 1.2a with two from USB 3.2 Gen 2 (Type C) to hold four monitors up to 4096×2160@60Hz for a refreshing visual experience. Moreover, there is one 2.5 Gigabit LAN, one 1 Gigabit LAN with Dash function, plus M.2 Key E for Wi-Fi 6E support of 6GHz band, and Bluetooth 5.2 to speed up data transmission, lower latency, enabling real-time connections, remote management functions for the energized experience.

Expanded Flexibility with Ultra-Connectivity

The 4X4 BOX-5000 Series Mini PCs provide ultra-connectivity with a diverse set of I/Os for extended versatility and flexibility, including one USB 3.2 Gen2 (Type A), two USB 3.2 Gen2 (Type C) supporting DP1.2a, and one audio jack on the front panel. There is also one HDMI 2.0a, one DP 1.2a, one 2.5 Gigabit LAN, one Gigabit LAN, two USB 2.0, and one DC jack on the rear panel. The Series comes in an ultra-compact size of 110.0 x 117.5 x 47.85mm with fanned barebone, while supporting one M.2 Key M, 2242/2260/2280, and SATA 3.0 for NVMe SSD, or HDD, making it easy to carry out storages upgrades. There is also TPM 2.0 onboard for enhanced hardware-based security in support of the Windows 11 upgrade and VESA mounting to save desk space and easily mount a Mini PC to the back of your monitor.

For more product information please go to our website asrockind.com

IBASE Partners with AI Chipmaker Hailo to Launch Edge AI Computing System with 5G Connectivity

IBASE Technology Inc., a leading provider of robust embedded computing platforms, is proud to announce its partnership with leading Artificial Intelligence (AI) chipmaker Hailo. IBASE and Hailo are launching the 11th Gen Intel® Core™ U-Series-based (formerly Tiger Lake) ASB210-953-AI edge AI computing system, targeted at smart Artificial Intelligence of Things (AIoT) applications in multiple sectors, including smart cities, industry 4.0, and the automotive industry.

Integrated with the Hailo-8™ M.2 AI acceleration module, the ASB210-953-AI provides unparalleled performance, with up to 26 Tera-Operations Per Second (TOPS) and high-power efficiency. Measuring 180x150x72mm (WxDxH), the compact system comes with flexible expansion supporting high-speed 5G connectivity and three M.2 modules – B-Key, E-Key and M-Key (with the Hailo-8 AI module installed) – allowing customers to accelerate time to market.

“Our collaboration with Hailo enables us to offer customers edge AI inference systems with unprecedented performance and responsiveness.” said Albert Lee, Executive Vice President at IBASE. “With a best-in-class AI processor packaged in a module, the Hailo-8 is compatible with NGFF M.2 form factor, as well as with M, B+M and A+E keys that can be perfectly adopted in our ASB210-953-AI platform to execute real-time deep neural network inferencing in a wide range of market applications.”

“We are excited to partner with a market leader like IBASE to bring the performance capabilities of their deep learning solutions to a new level and enable smarter AI products,” said Liran Bar, VP Business Development at Hailo. “We look forward to offering our reimagined AI processors to more embedded computing applications via IBASE solutions.”

IBASE will be presenting a live demo with the AI solution at the coming 2022 SPS Italia, Automate, and Embedded World exhibitions. All visitors are welcome to stop by the IBASE booth when they visit the shows.

iWave Systems launches a Solderable System on Module based on the NXP i.MX 8XLite applications processor

iW-RainboW-G46M: The solderable i.MX 8XLite LGA System on Module is built on the OSM 1.0 Standard on a compact form factor of 30mm x 30mm while provisioning for 332 contacts. The module is AEC compliant and built for the next frontier of automotive and transportation solutions.

As the first i.MX Processor to include an on-chip V2X accelerator, while integrated with the V2X Optimized High Security Module (HSM) and Secure Hardware Extension (SHE), the i.MX 8XLite processor offers the required safety and performance required for Vehicle-to-Vehicle communication(V2V), Vehicle to Infrastructure (V2I) and Vehicle to Network (V2N) solutions.

The OSM Standard defines a standard for a system on module to be soldered on the carrier board as a solder-on module LGA package, by the replacement of board-to-board connectors. The main advantages of the OSM module include resistance to vibration, compact form factor with smallest pin to area ratio and provision for technology scalability. OSM Modules provide designers a solution with an ideal mix of scalability, form-factor, and cost.

Key Features of iW-RainboW-G46M

  • MX 8XLite Solo/Dual
  • 2GB LPDDR4 Memory (Expandable)
  • 8GB eMMC Flash (Expandable)
  • CAN Ports x 2
  • RGMII x 1
  • PCIe x 1
  • GPIO x 15
  • Size-SE: 30mm x 30mm
  • AEC Grade
  • -40°C to +125°C Operating Temperature

Featuring an array of high-speed interfaces such as Ethernet, PCIe Gen3, USB 2.0 and CAN Ports, the i.MX 8X Lite is a good fit for Industrial IoT, control and connectivity applications. With 2 x Cortex A-35 cores and 1 Cortex-M4 core powering the required low latency processing and data transmission, the processor is available in single and dual core variants.

“Integrating the powerful NXP i.MX 8XLite application processor in the solderable system on module form factor of the recent OSM Standard, the SoM can be a building block for compact connectivity devices.” said Ahmed Shameem M H, Hardware Project Lead at iWave Systems. “The AEC grade module is power-efficient and easily upgradable to power next-generation of connected mobility and smart city solutions.”

iWave also offers a development kit for the system on module to help customers accelerate their development and evaluation cycle. The system on module and the development kits are application-ready and integrated with all necessary software drivers and BSPs with software support of Ubuntu, Android, and Linux.

You can find more information on the i.MX 8X Lite based solderable System on Module at:

Learn More:

iWave Systems, is a global leader in the design and manufacturing of system on modules and single board computers. As a gold member of the NXP Partner Program, iWave enables companies with an extensive portfolio of i.MX embedded computing platforms.

For further information or inquiries, please write to mktg@iwavesystems.com.

Eggtronic launches ZVS PFC and regulator solution

Eggtronic expands its EcoVoltas AC/DC architecture family with the SmartEgg ZVS PFC and regulator solution for 75 W to 1 kW power applications.

Eggtronic has expanded its EcoVoltas family of high-efficiency AC/DC architectures with the new SmartEgg zero voltage switching (ZVS) PFC and regulator solution. The SmartEgg solution is designed for power applications in the 75 W to 1 kW range that need both output voltage regulation and power factor correction.

The ZVS solution is said to enable a much higher no-load-to-full-load efficiency.

“Forced ZVS under every load condition delivers efficiencies of up to 95% at full load and 92% at light load,” said the company.

SmartEgg can achieve power densities of 30 W/in3, according to the company. The new architecture also delivers a 50 percent smaller bill of materials (BOM) than conventional converters. It is also said to be one of the first platforms to support the new USB Power Delivery Revision 3.1 specification, delivering up to 240 W of power over full-featured USB Type-C cables and connectors.

SmartEgg consists of an input rectifier (solutions are based on either an input bridge or bridgeless rectifier), two primary FETs, two secondary FET rectifiers, a single magnetic component, and a few capacitors. The main controller manages PFC and output voltage regulation, ZVS, and frequency control.

Traditional medium-power AC/DC PFC architectures use a boost PFC input stage and an LLC stage that controls the output voltage, said Eggtronic. In comparison, the SmartEgg cuts the number of MOSFET and magnetic components in half by replacing these two stages with a single-stage converter capable of controlling both input current and output voltage.

Eggtronic can create custom designs based on the new SmartEgg architecture or can provide the reference design together with the IC controller. Output options are fixed voltage, CC/CV battery charger, and USB PD 3.1. The first fixed-voltage reference design is available now. A multi-port USB PD 3.1 compliant version will be available in May 2022.

Target applications include adapters and chargers for high-performance laptops and power adapters for PCs, home appliances and TV panels. Eggtronic is exhibiting at APEC 2022 in booth #1823.

Barometric pressure sensor claims a new level of accuracy


Bosch Sensortec’s BMP581 barometric pressure sensor claims a new level of accuracy, with low power consumption, for mobile device applications.
Bosch Sensortec GmbH has claimed a new level of accuracy to provide altitude tracking in a small form factor with the introduction of the BMP581 barometric pressure sensor. The BMP581, Bosch’s first capacitive barometric pressure sensor, also delivers low power consumption for longer battery life in mobile devices such as wearables, hearables, GPS modules, and IoT devices.

The BMP581, measuring 2.0 × 2.0 × 0.75 mm3, provides a relative accuracy of +/-0.06 hPa and a typical absolute accuracy of +/-0.3 hPa. The company said the accuracy of the barometric pressure fluctuation is “equivalent to one-thousandth of the weight of a mosquito (7.6 μg).” Full accuracy is available over a wide measurement range from 300 hPa to 1100 hPa.

The typical current consumption of the BMP581 is 1.3 μA at 1 Hz, which “substantially extends battery life,” said Bosch, while the deep standby mode draws 0.5 μA.

Other key specs include a typical temperature coefficient offset (TCO) of +/-0.5 Pa/K, low RMS noise of 0.08 Pa @ 1000 hPa (typical), and long-term drift over 12 months of +/-0.1 hPa. Interfaces include I2C, I3C, and SPI (3-wire/4-wire) digital, serial interface.

Features

  • 300 hPa to 1250 hPa measurement range (full accuracy)
  • ±30 Pa absolute accuracy
  • ±6 Pa relative accuracy pressure
  • ±0.1 hPa long term drift (12 months)
  • 1.65 V to 3.6 V supply voltage (VDD)
  • 1.2 V to 3.6 V I/O supply voltage (VDDIO)
  • Interfaces
    • I2C up to 3.4 MHz
    • SPI 3- and 4-wire, up to 10 MHz
  • Average typical current
    • 1.3 nA at 1 Hz pressure and temperature
    • 0.5 nA in deep standby mode
  • 0.08 Pa noise in pressure lowest bandwidth, highest resolution
  • ±0.5 Pa/K temperature coefficient offset
  • 0.3 hPa solder drift
  • 480 Hz (continuous mode) maximum sampling rate
  • 2.0 mm x 2.0 mm x 0.75 mm metal-lid LGA-10 package

Bosch has reinvented the barometric pressure sensor with a new core MEMS technology as well as a new ASIC and package design to deliver best-in-class performance, quality, and reliability, said Thomas Block, senior product manager, for magnetic and environmental sensors, Bosch Sensortec, in a video presentation.

The BMP581 also achieves a new benchmark due to its unique parameters in the market, which is also ensured in mass production, he added. The BMP581 uses a capacitive MEMS sensor and “it is the first time that Bosch is using this technology.”

Bosch previously used piezoresistive technology and still has many sensors with this alternative technology in production, Block said.

The new BMP-581 has shown “impressive improvements for all performance parameters,” and is significantly improved compared to previous generations of piezoresistive sensors, he said. Compared to the previous generation BMP390 barometric pressure sensors, as an example, the BMP581 reduces current consumption by 85 percent, improves noise by 80 percent, and lowers TCO by 33%.

The extremely high accuracy, which allows the sensor to detect an altitude change of a few centimeters, is said to enable new use cases that were previously impossible. Applications include fitness tracking, fall detection, indoor localization, and indoor navigation. The sensor can monitor movement in fitness applications, and highly accurate location information for indoor localization, navigation, and floor detection for emergency call requirements (E-911).

Other applications cited include monitoring flight stability and landing accuracy in drones and helping to detect water levels in household appliances.

There are three key areas, out of many, where the BMP581 realizes new use cases or improves existing solutions, said Block. “These are fitness applications, indoor localization, and indoor navigation. The BMP581 is simple to integrate due to its small size of 2 ×2-mm square at a height of 0.75 mm and it is suitable for continuous use due to the ultra-low current consumption.”

The sensor solution can address new use cases due to its high accuracy, he added. “Push-ups, sit-ups, stair walking, and bicep curls can now be measured on a very high accuracy level and battery devices can now be used for longer times due to the very low current consumption.”

The BMP581 is housed in a 10-pin LGA package shielded by a metal cover. The BMP581 and evaluation boards are available through Bosch’s distributors, including Arrow Electronics, Digi-Key, Future Electronics, Mouser Electronics, and Rutronik.

Learn more about Bosch Sensortec: https://www.bosch-sensortec.com/products/environmental-sensors/pressure-sensors/bmp580/

Sensirion STS40 ±0.2°C Ultra-low-power temperature sensor

Sensirion STS40 Temperature Sensors are fully digital, high-accuracy I2C temperature sensors. These ultra-low power consumption sensors feature a compact 4 pin DFN SMT package, along with multiple preconfigured I2C addresses for flexible integration into various systems. Sensirion STS40 Temperature Sensors feature flexible operating conditions, with an operating temperature between -40°C and +125°C, as well as a supply voltage range between 1.08V and 3.6V.

Features

  • Temperature accuracy up to ±0.2°C
  • 1.08V to 3.6V supply voltage
  • 0.4μA average current (at 1Hz measure rate)
  • 80nA idle current
  • I2C fast mode plus, CRC checksum
  • Available with multiple I2C addresses
  • -40°C to +125°C operating temperature range
  • NIST traceability

more information: https://sensirion.com/products/catalog/STS40-DIS/

Maxim Integrated MAX16161 nanoPower Supply Supervisor

Maxim Integrated MAX16161 nanoPower Supply Supervisor is an ultra-low current, single-channel supervisory IC with glitch-free power-up. The MAX16161 monitors the power supply voltage and asserts a reset when the input voltage falls below the reset threshold. After the monitoring voltage rises above the factory-set threshold voltage (VTH), the reset output remains asserted for the reset timeout period and then de-asserts, allowing the target microcontroller or microprocessor to leave the reset state and begin operating. The MAX16161 reset output is guaranteed to remain asserted until after a valid VCC is achieved. This feature is important to avoid low-voltage cores leaving the reset state during power-up or power-down. This design also improves performance when using the MAX16161 as a simple power supply sequencer.

The MAX16161 features a Manual Reset (MR) input that asserts a reset when it receives an appropriate input signal, which may be either active-low or active-high, depending on the option. The reset output is active-low open-drain, and the device offers multiple reset timeout period options.

The Maxim Integrated MAX16161 nanoPower Supply Supervisor is specified over the -40°C to +125°C temperature range and is available in tiny, 1.06mm x 0.73mm, 4-bump WLP, and 4-pin SOT23 packages.

Features

  • Glitch-free power-up
  • 825nA (typical) quiescent current extends battery life
  • Positive and negative level-triggered MR input options
  • MR debounce circuitry
  • Multiple available reset timeout periods
  • 1.7V to 4.85V threshold voltage
  • -40°C to +125°C operating temperature range
  • 4-bump WLP and 4-pin SOT23 package options

Application Circuit

 more information: https://www.maximintegrated.com/en/products/power/supervisors-voltage-monitors-sequencers/MAX16161.html

Maxim Integrated MAX77501 Piezo Haptic Actuator Boost Driver

Maxim Integrated MAX77501 Piezo Haptic Actuator Boost Driver is a high-efficiency controller driver for piezo haptic actuators. The driver is optimized for driving up to 2µF piezo elements. It can generate a single-ended haptic waveform of up to 110VPK-PK amplitude from a 2.8V to 5.5V input power supply or a single-cell Li+ battery. Memory playback and haptic waveforms in real-time streaming modes are supported.

Features

  • 110VPK-PK haptic waveforms generation
  • Optimized for up to 2µF haptic piezo actuator
  • 2.8V to 5.5V input supply range
  • 600μs start-up time to haptic playback
  • High-efficiency, low IQ extends battery life
    • 75μA standby current/1μA shutdown current
    • Maxim patented ultra-low-power boost architecture
  • 12-bit haptic waveform playback DAC
  • Real-time streaming and RAM playback modes
    • 9k FIFO buffer with FIFO ready status signal
    • 8k RAM buffer for waveforms storage
  • 25MHz SPI interface
    • SPI ready, warning and fault conditions interrupt
  • Protection features
    • Programmable cycle-by-cycle overcurrent limit, 130V overvoltage, UVLO, and thermal protection
  • Small size and low profile
    • 2.42mm x 2.02mm, 30 bump WLP

Application Circuit

AP7368 Series Low-Noise LDO Regulator

Diodes’ low dropout (LDO) regulators feature a selectable 0.5 A / 1 A output current that is optimized for portable applications

Diodes’ AP7368 series LDO linear regulator offers a high PSRR of 80 dB and is optimized for applications that require low-noise voltage rails while occupying a very small space. For increased versatility, the device has a selectable maximum output current of 0.5 A or 1 A. This allows optimized designs for the required output loads which mitigate thermal or protection issues. The built-in current-foldback varies with the output current selection; 60 mA for low-current mode and 110 mA for high-current mode. This alleviates thermal-shutdown cycling during short-circuit fault conditions and helps protect the IC from damage.

The AP7368 has an active-high enable pin. Bringing this pin low disables the LDO and engages an active output-discharge circuit. This ensures that the system/rail always starts up in a known state. The AP7368 is available in the tiny X-DFN1612-8 (Type B) package, features an exposed thermal pad, and occupies a PCB area of 1.2 mm x 1.6 mm.

Features

  • High PSRR: 80 dB at 1 kHz for VOUT ≥1.8 V
    • Rejects line-based noise in audio, video, and RF subsystems
  • Ultra-low dropout voltage: 190 mV (VOUT = 3.3 V, IOUT = 1 A)
    • Maximizes the usable supply voltage range, particularly in battery-powered devices
  • 1.0% output accuracy range: -40°C to +85°C
    • Maintains accuracy under all conditions
  • Wide input voltage range: 1.7 V to 5.5 V
    • Supports standard rails and core-to-core LDO POL applications
  • Small footprint, low thermal impedance X1-DFN1612-8 package (JC = +15.4°C/W)
    • Suitable for high-power-density POL equipment

more information: https://www.diodes.com/part/view/AP7368/

TLV916x RRIO Low-Noise Op Amps

Texas Instruments’ 16 V, 11 MHz op amps are ideal for industrial applications offering high performance and flexibility

Texas Instruments’ TLV916x (TLV9161, TLV9162, and TLV9164) is a family of 16 V, general-purpose op amps that offer exceptional DC precision and AC performance including rail-to-rail input/output (RRIO), low offset, low-offset drift, and low noise. Features including differential and common-mode input voltage ranges to the supply rails, high short-circuit current (±73 mA), and high slew rate (33 V/µs) make these devices flexible, robust, and high-performance op amps for industrial applications.

The TLV916x op amps are available in microsize packages including WSON, as well as standard packages such as SOT-23, SOIC, and TSSOP. The devices offer a temperature range of -40°C to +125°C.

Features

  • Low offset voltage: ±210 µV (typ.)
  • Low offset voltage drift: ±0.25 µV/°C (typ.)
  • Low noise: 6.8 nV/√Hz at 1 kHz, 4.2 nV/√Hz at 10 kHz broadband
  • High common-mode rejection: 110 dB
  • Low bias current: ±10 pA
  • RRIO
  • Supply ranges: ±1.35 V to ±8 V and 2.7 V to 16 V
  • Robust EMIRR performance
  • MUX-friendly/comparator inputs
  • Amp operates with differential inputs up to the supply rails
  • Amp can be used in an open-loop or as a comparator
  • Wide bandwidth: 11 MHz GBW, unity-gain stable
  • High slew rate: 33 V/µs
  • Low quiescent current: 2.4 mA per amp

more information: https://www.ti.com/product/TLV9161

TOP PCB Companies