Panasonic AQY4C PhotoMOS PCB Mount Solid State Relays are CC-type, normally closed, ultra-miniature, TSON packaged (1.95mm x 1.80mm x 0.8mm) relays using capacitive isolation technology. These relays are approximately 88% smaller than the previous SOP-packaged devices, offering a 3.5mm2 mounting area. Low current consumption and a 0.2mA maximum input current contribute to energy savings and increases drivability. The Panasonic AQY4C PhotoMOS PCB Mount Solid State Relays are voltage driving type components with a 3V to 5V input voltage range. Performance is guaranteed at temperatures up to +105°C. Applications include measuring equipment, security equipment, and voltage operating equipment that requires low electricity consumption.
Features
Ultra-miniature TSON package contributes to space savings and high-density mounting
Guaranteed performance at high temperature (+105°C maximum)
Low current consumption, 0.2mA maximum input current
Voltage driving type (3V to 5V)
RoHS compliant
Applications
Measuring equipment
IC testers
Probe cards
Board testers
Other testing equipment
Security equipment
Security cameras
Intruder detection
Electric/gas meters and other meters
Disaster-preventing equipment
Fire alarms
Smoke/heat/fire detectors
Industrial equipment
Electric measuring equipment
Industrial measuring equipment
Telecommunications equipment
Wearable devices
Specifications
Input
5.5V input voltage
0.2V input reverse voltage
1.2mW power dissipation
1.6V typical operate (OFF) voltage, 2.5V maximum
0.5V minimum reverse (ON) voltage, 1.4V typical
0.04mA to 0.09mA typical input current, 0.1mA to 0.2mA maximum
250mW total power dissipation
200VRMS I/O isolation voltage
Ambient temperature ranges
-40°C to +105°C operating
-40°C to +125°C storage
Output
60VAC peak load voltage
0.15A continuous load current
0.4A peak load current
250mW power dissipation
4Ω typical on resistance, 8Ω maximum
10nA maximum off-state leakage current
Transfer characteristics
0.06ms to 0.11ms typical operate (OFF) time, 0.5ms to 1.0ms maximum
0.3ms to 0.5ms typical reverse (ON) time, 1.5ms maximum
Texas Instruments TPS258x-Q1 Integrated USB Charging Port Solution integrates a monolithic, synchronous, rectified, step-down, switch-mode converter with internal power MOSFETs. It also includes two USB current-limit switches with charging port auto-detection. The TPS2585x-Q1 offers a compact solution that achieves 6.6A of continuous output current with excellent load and line regulation over a wide input supply range. The synchronous buck regulator operates with peak-current mode control and is internally compensated to simplify the design. A resistor on the FREQ pin sets the switching frequency between 200kHz and 3MHz. Operating below 400kHz results in better system efficiency, and operation above 2.1MHz avoids the AM radio bands and allows for use of a smaller inductor.
The Texas Instruments TPS2585x-Q1 integrates standard USB Type-C port controller functionality that includes Configuration Channel (CC) logic for 3A and 1.5A current advertisement. Battery Charging (Rev. 1.2) integration provides the required electrical signatures necessary for non-Type-C, legacy USB devices that use USB data line signaling to determine USB port current sourcing capabilities. The TPS2585x-Q1 also has integrated VCONN power that can meet the USB3.1 power requirement. The part is especially suitable for dual-port applications due to the high system integration and small footprint.
The TPS2585x-Q1 provides various safety features for USB charging and system operations. These include external negative thermistor monitoring, cycle-by-cycle current limit, hiccup short-circuit protection, undervoltage lockout, BUS overcurrent, OUT overcurrent, and die overtemperature protection. The device family is available in a 25-pin, 3.5mm x 4.5mm QFN package.
Features
AEC-Q100 qualified for automotive applications
–40°C to +125°C TA temperature grade 1
HBM ESD classification level H2
CDM ESD classification level C5
Synchronous buck regulator
High efficiency at 2.1MHz: 93.4% at VIN = 13.5V, IPA_BUS = 3A and IPB_BUS = 3A
18mΩ/10mΩ Low RDS(ON) buck regulator MOSFETs
5.5V to 26V, withstand 36V input operating voltage range
200kHz to 3MHz adjustable frequency
FPWM with spread-spectrum dithering
Selectable output voltage (5.1V, 5.17V, 5.3V, 5.4V)
Internal power path
7mΩ/7mΩ Low RDS(ON) internal USB power MOSFETs
±10% at 3.4A programmable current limit for USB ports with high accuracy:
This isn’t the first time UK-based embedded electronic design and manufacturer, SB Components Ltd has released an RFID HAT for Raspberry Pi. The electronic device supplier has launched a crowdfunding campaign on Kickstarter with a goal of £10,000 for its newly designed 40-pin ultra-high frequency (UHF) HAT for Raspberry Pi. Even though the goal has already been met through 26-backers for the open-source project with various pledging options of £225 for the UHF HAT for Pi and £950 for a pack of 5, unfortunately, the early bird discount is over which was priced at £199 for a single piece.
Before jumping onto UHF HAT for Raspberry Pi, which integrates a compact RFID reader with low-power consumption capabilities, let us take a look at the stand-alone RFID HAT for Raspberry Pi by SB Components Ltd. On September 18, 2020, the team at SB Components released a blog post on its official website titled, “Introduction of RFID HAT for Raspberry Pi” with a special highlight for its in-house RFID module operating at a frequency of 125KHz, priced at just £24.99. The RFID HAT gets a programmable 0.91-inch OLED display that is compatible with all the Raspberry Pi versions and uses UART communication for interfaces. With a standard 40-pin Raspberry Pi GPIO extension header, the HAT is ready to fit on top of the Raspberry Pi single-board computer through the headers.
Taking all these capabilities from the original RFID HAT and upgrading them to design the ultra-high frequency HAT for Raspberry Pi that operates in the frequency range of 865MHz to 870MHz and 915MHz to 928MHz along with an onboard antenna. The Raspberry Pi UHF HAT gets JADAK’s smallest embedded module with ultra-low power consumption and a tiny form factor– ThingMagic M6E Nano UHF RFID reader, ideal for battery-operated applications. The module supports UART serial communication as an interface type and operates on a 3V3 to 5.25V power supply. Also, the HAT is capable of reading the RFID tags at a rate of up to 200 tags per second through adjusting the RF output range of 0dBm to +27dBm with an increment of 0.01dB. Other upgrades include a larger 1.14-inch LCD display and a USB Type-C port for power.
Analysis
As an open-source project, the UHF HAT looks interesting for several use cases such as inventory management, tracking products in the cart, smart billing system, advanced library system, and attendance system to name a few. However, note that for a faster prototype of RFID-based applications, the UHF HAT for Raspberry Pi seems to be extremely expensive in comparison to the original RFID HAT. Despite the higher price points, 26 community enthusiasts have made the product successful on the crowdfunding website. If you are interested in pledging to get your hands on UHF HAT, head to the Kickstarter product page with an expected delivery of April 2022.
Chinese electronic device manufacturer M5Stack unveiled a RISC-V powered M5Stamp C3U IoT module with advanced wireless connectivity for home and industrial automation. For the implementation of IoT projects that are subject to operate at higher temperatures of up to 230℃, the M5Stamp C3U IoT module is shipped inside a heat-resistant plastic enclosure.
At the heart of the module is the ESP32-C3 single-core microcontroller system-on-chip based on the open standard RISC-V architecture clocked at a maximum frequency of 160MHz. The SoC supports wireless connectivity including Wi-Fi and advanced Bluetooth 5.0 Low Energy, making it suitable for remote IoT automation deployment that demands a larger coverage area. ESP32-C3 integrates 22 configurable GPIOs, 384kB ROM, and 400kB internal RAM out of which goes for the 8kB RTC SRAM. To store the custom code developed for the intended application, the M5Stamp C3U IoT module gets 4MB of flash storage.
In terms of security, which is of concern for remote applications, the IoT module combines RSA-3072-based secure boot and the AES-XTS-128-based flash encryption. The ESP32-C3 chip supports the secure boot V2 using the RSA-based app and bootloader verification to protect the module from running any unauthorized code by checking the (second stage bootloader and each application binary) software that is being booted is signed. Another security feature integrated into the SoC is the AES-XTS, which uses 128 bits per cycle for data encryption and advanced encryption standard (AES) block cipher as a subroutine.
Sized at 34×20 mm with a weight of fewer than 4 grams, the M5Stamp C3U IoT module is designed to support SPI, UART, I2C, I2S, PWM, and USB serial ports among many others. To interface external sensors, the developer can choose any module that supports any of the above-mentioned serial communication protocols. There is a total of 14x input/output interfaces (GPIOs) other than G11-G17 and G20, which are either used for other purposes or are internally connected.
Analysis
Affordable, compact hardware for hobbyist IoT projects, you can consider buying the M5Stamp C3U IoT module at $5.90 plus shipping charges. Also, to get started with a RISC-V-based CPU, the module offers detailed documentation to get started with a variety of options. However, for data-intensive applications that require parallel processing, the hardware is designed with less RAM and might create problems for implementations like live video streaming.
Silanna Semiconductor has further expanded its family of silicon- and GaN-based fast charger reference designs with an all-silicon option that will significantly reduce the time needed to develop high-density 45W applications. Supplied as a fully production-ready solution, the new RD-24 design provides everything needed to rapidly prototype and test a fully functional 45W 1C charger.
The RD-24 delivers fast charging performance while minimizing overall energy consumption by combining the industry’s best operating efficiency with the lowest ‘vampire’ power consumption. Providing an (uncased) power density of 23.5W/inch3 from a cost-effective single PCB design, the RD-24 operates with a peak efficiency of above 92% and no-load power consumption of below 20mW. Efficiency is flat across the universal input voltage range (90 – 265Vac).
At the heart of the latest reference design is Silanna’s ultra-high-efficiency CO2 Smart Power SZ1131 active clamp flyback (ACF) controller, which is rated for powers up to 65W in universal input designs and above 100W in PFC supported applications. This controller offers a much higher level of integration than has previously been available by incorporating an adaptive digital PWM controller, ultra-high-voltage (UHV) active clamp FET, active clamp gate driver, and startup regulator into a single compact device.
The RD-24 joins a comprehensive family of production-ready reference designs that provide everything needed to develop high-density chargers with low operational and no-load/ standby power consumption and minimum component count, BOM cost, and size. This family includes all-silicon 33W and silicon- and GaN-based 65W USB-PD reference designs. All of these designs exceed conducted and radiated EMI requirements from 3dB to 6dB to eliminate the need for pre-production validation and certification. RD-24 utilizes a single-PCB-based design for the ease of production and assembly, which further reduces the cost for the end customer. Full availability of PCB Gerber and production files reduces the time from prototyping to full production.
The SZ1131 operates at frequencies up to 146kHz and provides the ease-of-design of a simple flyback controller with all the benefits of an ACF design. This includes recycling the leakage inductance energy of the flyback transformer and limiting the primary FET drain voltage spike during turn-off events. Employing Silanna Semiconductor’s OptiModeTM digital control architecture, the SZ1131 adjusts the device’s mode of operation on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation, and other key power supply parameters in response to varying line voltage and load conditions.
Supplied in a 16-pin SOIC package, the SZ1131 offers protection against over-temperature, over-voltage, over-current, over-power, output short circuit, and transformer core saturation faults without the need for additional external components.
RD-24 Key Features include: 45W 1C high-power-density (23.5W/inch3 uncased) reference design; More than 92% peak efficiency; Less than 20mW system-level no-load power consumption; More than 6dB conducted and less than 3dB radiated EMI margins; Flat efficiency across universal (90 – 265Vac) input voltage and load; Uses Silanna Semiconductor’s newest fully integrated ACF controller (SZ1131); SZ1131 integrates ACF controller with UHV active clamp FET, active clamp driver, and start-up regulator; Up to 146kHz switching frequency operation; Ultra-low no-load power consumption; OptiMode cycle-by-cycle adaptive digital control; Self-tuning valley mode switching (VMS); Multi-mode operation (burst mode, QR, VMS); OTP, OVP, OCP, OPP, and Output Short Circuit Protections; CO2 Smart Power by Silanna Semiconductor;
Advanced Energy introduced the Artesyn LCC1200 series of fanless, conduction-cooled AC-DC power supplies. The latest addition to AE’s LCC family, the LCC1200 delivers up to 1,200 W power output and 93.5% efficiency in a compact form factor. The new power supplies are well-suited for industrial applications including outdoor digital LED signage, traffic light equipment, industrial lighting, telecommunications antenna, and commercial off-the-shelf (COTS) solutions.
Unlike other power supplies in the market that require output derating above 55°C, the LCC1200 can maintain its full 1,200 W load capacity from -40 to 85°C baseplate temperature without forced air. With 15 W/in3 power density, one of the industry’s highest, the LCC1200 enables customers to save space and reduce overall system cost. Active current sharing is supported and up to three units can be operated in parallel to support higher load requirements.
Measuring only 4.5 x 11 x 1.57 inches, the LCC1200 series is available in IP20 and IP65 ratings. The IP65 version is housed in a robust, fully-sealed enclosure to protect against dust and water ingress, making it well-suited for fanless outdoor and enclosed industrial applications.
With a universal 90-264 Vac input, the LCC1200 series can be used anywhere in the world without adjustment. The power supplies feature a single 28 or 24 VDC output with wide adjustment and 5 V standby voltage output. The LCC1200 family is fully approved to the international IEC62368-1 ITE safety standard and carries cUL, CE, UKCA, and CCC certifications. The built-in PMBus interface provides flexible and comprehensive digital communication with control and monitoring functions for voltage, current, temperature, and reporting of fault conditions. The LCC1200 has a calculated MTBF of more than two million hours and comes with a three-year warranty.
Infineon Technologies AG has released the new EiceDRIVER 2EDN product family. Aiming at space-limited designs, the next-generation devices complement the existing 2EDN driver ICs by providing higher system-level efficiencies, excellent power density, and consistent system robustness with fewer external components. Building upon this expansion, the 2EDN family is now able to drive the power switch device performance in applications such as servers, telecom, DC-DC converters, industrial SMPS, EV charging stations, motor control, low-speed light electric vehicles, power tools, LED lighting, and solar energy systems.
The new EiceDRIVER 2EDN family comprises robust dual-channel low-side 4 A/5 A gate driver ICs. It is targeting not only fast power MOSFETs but also wide bandgap (WBG) switching devices. The gate drivers enable engineers to meet their design requirements in many different package sizes, ensure safe turn-off before under-voltage lock-out (UVLO) and achieve faster UVLO reaction for robust operation and noise immunity.
The fourteen new devices come in a broad range of packages. Besides the well-known 8-pin DSO, TSSOP, and WSON package options that allow compatibility and drop-in replacement, Infineon now offers the world’s smallest 6-pin SOT23 package (2.8 x 2.9 mm 2) and TSNP package (1.1 x 1.5 mm 2) variants. SOT23 and TSNP packages eliminate the enable (EN) signal, which frequently is not used. As a result, they are able to offer the perfect balance for space-limited designs leading to higher power density and higher Temperature Cycling on Board (TCoB) robustness.
Designers can choose between 4 V and 8 V UVLO options for instant power switch protection under abnormal conditions. Essentially, the new products bring better UVLO filtering time, a faster wake-up from UVLO off status and more than two times faster UVLO reaction from start-up and burst mode. Moreover, they feature high precision, accurate rail-to-rail outputs, and fast active output clamping at V DD = 1.2 V, typically clamping in just 20 ns for extra robustness.
TDK Corporation announces the availability of the FS1412 microPOL (μPOL) power module. At 5.8. mm, x 4.9 mm x 1.6 mm, the FS1412 is part of a new series of µPOL DC-DC converters with increased performance, smallest available size, ease of use, and simplified integration for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT networking, telecommunication, and computing enterprise. μPOL technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs, and others. By minimizing the distance between the converter and the chipset, the resistance and the inductance components are minimized, allowing fast response and accurate regulation with dynamic load currents. Mass production of FS1412 started in Q4 2021.
TDK has been developing this technology over several years to enable system-level solutions to enhance electrical and thermal performance focusing on high-density cost-effective solutions for space-constrained applications which require a low-profile power source. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductors embedded in a substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost than what is currently available.
The new µPOL DC-DC converters series operates at a broad junction temperature range, from -40 °C to 125 °C, and features a high current density of more than 1000 A per cubic inch. The series delivers at 12 A with the lowest commercially available height at 1.6 mm while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs.
Have you ever requested a third-party rapid prototyping services provider to fabricate samples for testing? If so, you were likely offered either 3D printing or CNC machining as options.
Sometimes customers have a difficult time trying to decide that prototyping method suits their manufacturing purposes better. This post provides an in-depth comparison of 3D printing, to be exact, binder jetting, and CNC machining. So that you can know for sure that will work better for you.
Types of Rapid Prototyping
Well, there are numerous types of rapid prototyping, all of which can be attributed to either subtractive manufacturing (SM) or additive manufacturing (AM) techniques. The first one implies that the material is cut out of a workpiece to achieve the design required.
The following manufacturing techniques are attributed to SM rapid prototyping:
CNC machining
Metal casting prototyping
Metal extrusion prototyping
Sheet metal prototyping
The second rapid prototyping technique is grounded on adding material layer by layer to achieve the design required or a similar principle. All such types are known as different 3D printing techniques. The following manufacturing types of 3D printing are attributed to AM rapid prototyping:
Binder Jetting
Selective Laser Sintering (SLS)
Fused Deposition Modeling (FDM)
Stereolithography (SLA)
Multi Jet Fusion (MJF)
Injection Molding
Injection molding
As you may see, the number of rapid prototyping options available is extensive. To help you not to get lost in what to choose, we detail the essential aspects of metal machining and the popular 3D printing technique – binder jetting below.
Binder Jetting
Definition
Binder Jetting is an AM technique that is based on creating a 3-dimensional object layer by layer in accordance with a computer-aided design (CAD) file.
The principle of binder jetting is the use of the metal powder material that is solidified with a binding agent layer by layer. First, a piston of a binder jetting machine ensures that the powder is compressed dense enough for binding. Then, powder in the build box is cured with a binding liquid forming a solid shape. Then, with the use of brushes and air blowers, the excess powder is removed.
After the binder jetting is finished, simple post-production procedures are needed. The printed parts are separated from build boxes, cleaned, and bead blasted. You may also perform additional finishing techniques to enhance the properties of parts printed using binder jetting.
Pros and Cons
Here’s the list of the main strengths of binder jetting as a particular method of 3D printing:
One of the quickest rapid prototyping processes overall
Complete design freedom
Minimal material wastage
Simple, single-step manufacture
Cost-effective process
High accessibility of binder jetting machines, spare parts, and printing materials
Environment-friendly
Safe for labor
And the notable weaknesses of the process:
Limited range of materials available
Limited dimensions of components that are possible to print
Require post-processing, but some techniques still do not enable good surface finishing
The structure of printed components typically makes prototypes unsuitable for physical properties testing
Application
This AM technique is widespread in the following industries:
Architecture and construction
Maritime industry
Healthcare
Chemical industry
Mechanics
Food processing industry
Aeronautics
High-tech
Retail
Automotive
Textile and fashion
Robotics
Optics
Electronics
And many others
3D printing enthusiasts use binder jetting to replace literally any goods that can only be printed. The capabilities of binder jetting are limited only with the phantasy of such equipment unit’s owners. Still, binder jetting has even wider industrial use for the production of goods.
Precision sensor probe inspection of gear. Quality control in metalwork. Metrology system for gear
CNC Machining
Definition
CNC machining is an SM technique based on creating a 3-dimensional object by cutting out pieces of material of a workpiece according to a G-coded CAD file. The range of machining operations that can be done using multiple CNC machines is vast and include the following:
Drilling
Milling
Boring
Facing
Planing
Sawing
Broaching
Reaming
Turning
And others
Machines that perform CNC machining are automated, computer-driven centers with spindles that hold cutting tools and move along multiple (4,5,6, and even more) dimensions. They cut metal chips off workpieces’ surfaces, ensuring high dimension accuracy.
CNC machines are named after the process they intended to perform (although advanced centers employ multiple operations). This list includes mills, routers, drills, lathes, turning machines, etc.
Pros and Cons
Here’s the list of the main strengths of CNC machining:
Continuous use of machines without labor involvement
Consistency from batch to batch
Great dimensional accuracy and precision
High quality of the surface
Components machined are fully suitable for properties testing
Cost-effective process, but only if a significant number of products is machined
Good design freedom
A vast range of materials is supported
And the notable weaknesses of the process:
Time-consuming process
Demanding to the expertise of the labor
Not always ensure single-step manufacture
Machines are difficult in maintenance and adjustment
Material wastage
May not be environment-friendly
Is dangerous for labor unless safety measures are taken
Application
Decades ago, manual machining was a prevalent method of fabrication. It is not surprising that in the following contemporary industries, CNC machining is the common manufacturing technique for rapid prototyping as well:
Architecture and construction
Healthcare and pharmacy
Food processing industry
High-tech
Automotive
Robotics
Optics
Electronics
Military and defense
Aerospace
Transportation
Oil and Gas
And nearly any other somewhat
CNC machining utilizes fully automated centers that employ subtractive machining to fabricate components. Rapid prototyping with the use of CNC equipment units is highly common and regarded as a great way to produce samples for testing.
Differences Between Binder Jetting and CNC Machining
Regarding the essential differences between these two manufacturing processes, all existing ones are detailed in the table below.
Factor
Binder Jetting
CNC Machining
Principle of functioning
Additive machining
Subtractive machining
Type of files required
CAD files
G-coded CAD files
Parts’ dimensions supported
Strictly limited. Depends on the type of binder jetting machine.
Almost unlimited. Depends on the method of metal machining and the type of CNC unit used.
Material availability
A limited range. Each method has its own small range of materials supported.
A vast range. Almost unlimited, depending on the method of metal machining and the CNC unit used.
Speed of prototyping
A single unit ensures end-to-end performance. Speed depends on the design.
A single prototype can be produced quickly.
Several units may be involved in the end-to-end performance. Speed depends on the design and the number of CNC units.
A single prototype can be produced slowly.
Accuracy / Precision
Good dimension accuracy.
Superior dimensional accuracy.
Repeatability / Consistency
Consistency may vary from batch to batch.
Ensures a high batch-to-batch consistency.
Surface quality
Appropriate surface quality. In some cases, additional finishing processes may not be applicable.
Surface quality depends on the method of metal machining and the type of CNC unit used. Generally, surface quality is high. Suitable for the additional finishing process.
Adherence to physical properties of the intended component.
Generally unusable to produce components for further physical and chemical properties of components testing. Exception – when large-scale manufacturing is 3D printing (binder jetting)-based.
Depending on the manufacturing method employed, it is generally usable to produce components for further physical and chemical properties of components testing.
Complexity of use
Comparatively simple process. Does not require specialized knowledge.
Comparatively complicated process. Require a highly professional team of specialists to run.
Flexibility
Highly flexible process. Nearly any design can be created using a single equipment unit.
Less flexible process. Most designs can be created, depending on the method. May require the use of multiple equipment units.
Cost
Low to medium price range, depending on the process and the material.
Medium, to high price range, depending on the process and the material.
Material wastage
Produce nearly no material wastage.
Is typically associated with high material wastage.
In this comparison, a winner cannot be determined. Depending on your exact needs, materials, requirements to a prototype, timelines, and other factors, you may find any of the techniques being completely applicable.
Final Word
CNC machining is a costly and not that quick technique for fabricating durable prototypes of workpieces. It is great for testing manufacturing techniques and the physical properties of samples.
In contrast, binder jetting is indeed a rapid and cost-effective additive manufacturing prototyping technique. It is great for taking a quick look at newly modeled designs or producing cheap samples for presenting stakeholders. You should guide your decisions based on careful consideration of the factors specified in this post.
PCBs or Printed Circuit Boards are the fundamentals of every modern electronic device. They are used in various devices such as computers, smartphones, GPS devices, and many others.
There are various types of PCBs that include single-sided PCBs, double-sided PCBs, flexible PCBs, rigid PCBs, and many others. However, some PCBs are simple, while others are a bit complex.
To learn more about Multilayer PCBs, here is a simple guide about Multilayer PCBs, their uses, and benefits in the world of electronics.
What is Multilayer PCB?
Multilayer PCB is a printed circuit board with three or more copper foil layers. These are several layers of double-sided PCBs that are glued and laminated together with heat-protective insulation.
Multilayer PCBs were designed due to various changes in the electronic world. And in today’s world, the tasks of electronic devices have become more refined. Hence, they require complex PCBs such as multilayer PCBs.
However, most traditional circuit boards had many issues, such as noise and being very heavy. In addition, they needed to follow specific design constraints.
Due to these issues, it was hard to get a good level of performance. Thus, multilayer PCB was invented. Multilayer PCBs are small, lightweight, and durable.
In addition, multilayer PCBs are used in various sectors such as automobile, defense, medical, and many others. They are used in almost every complex electronic gadget.
They are available in many sizes and widths to handle the needs of any electronic gadgets. Layers are generally in even numbers since odd numbers can bring circuit problems such as warping.
Most applications need between four to eight layers, even though devices such as smartphones use around twelve layers. But some PCB manufacturers produce multilayer PCBs with almost a hundred layers.
Although multilayer PCBs are a bit more expensive than simple PCBs, they have become very popular due to the numerous benefits.
Small electronics integrated circuit IC on empty printed circuit board ready for hand assembly
Benefits of Multilayer PCBs
Multilayer PCBs are used in various electrical gadgets because they offer numerous advantages in functions, design, and cost. Here are the main benefits of multilayer PCBs.
1. Small Size and lightweight
The main benefits of multilayer PCBs are their lightweight and size. Due to their smaller size than other PCBs, they are beneficial to most modern electronics.
Hence, it is now possible to have a smaller device but very powerful. Some of these gadgets include laptops, tablets, and smartphones.
With a smaller PCB, it means less weight. Hence, most multilayer PCBs are smaller and very light. This is a benefit to most modern electronic devices moving towards mobility.
2. High quality and durability
Multilayer PCBs are of high quality and very durable from designs to planning. They are of better quality than single-sided PCBs and double-sided PCBs. In addition, they are more reliable.
Also, multilayer PCBs are more durable than other PCBs. They are designed to handle heat and pressure and their own weight.
3. Improved flexibility
Even though not all multilayer PCBs are flexible, you can find a flexible multilayer PCB. The flexible one is essential for some applications where mild bending is needed.
4. More Powerful
Multilayer PCBs are robust and other PCB types. Hence, they can achieve greater capacity and speed even if they are smaller in size.
With the above benefits, multilayer PCBs are useful in a wide range of applications, especially mobile gadgets. And with most industries going mobile, multilayer PCBs are mostly preferred over other PCBs.
Benefits of multilayer PCBs over Single-layer PCBs
Compared to single-layer PCBs, multilayer PCBs come with numerous advantages. Some of the advantages include:
Higher assembly density – since single-layer PCBs are limited by their surface area, multilayer PCBs increase their density through layering.
The increased density increases functionality, enhanced capacity even though they are smaller and lightweight.
Smaller size – generally, multilayer PCBs are smaller than single-layer PCBs. Instead of increasing the size of the surface area, multilayer PCBs have extra layers.
Improved design functionality – multilayer PCBs are more than an average single-layer PCB. Hence, they can accomplish more despite their smaller size and lesser weight.
What are Multilayer PCB Applications?
Multilayer PCBs have become the preferred option for various applications. Some of the leading multiplayer PCB applications include:
Consumer electronics – consumer electronics are the primary devices that use multilayer PCBs. Since most consumer electronics such as smartphones, laptops, and smart-watches are multi-function, they need refined PCBs.
Computer electronics – Most electronics use multilayer PCBs due to their small size and high functionality. In addition, they are perfect for many technologies in the computer industry.
Telecommunications – telecommunication gadgets such as GPS, signal transmission, and satellite use multilayer PCBs. The main reason is because of their functionality and durability.
Medical devices – multilayer PCBs are also used in many medical devices due to their small size, impressive functionality, and are lighter than single-layer PCBs.
They are used in CAT scan equipment, X-ray equipment, heart monitors, and medical testing devices.
Military – since multilayer PCBs are durable, light, and have impressive functionality, they are favored in the military sector.
Automotive – most cars rely on electric components in this modern era. The auto industry uses multilayer PCBs on GPS devices, computers, headlight switches, and many others.
Since they are durable and small, multilayer PCBs are functional and fit for any automobile.
Aerospace – just like cars, planes and jets have computers and other electronics that use PCBs. Hence, multilayer PCB offers an ideal solution for aerospace.
Others – multilayer PCBs are used in other industries such as the research industry, science, security, and some home appliances.
Final Word
Multilayer PCBs come with numerous benefits over single-layer PCBs. Hence, they are preferred for various applications. They are durable, lightweight, small, and very effective.
Due to their benefits, the number of multilayer PCB uses continues to expand. More and more industries are focusing and investing in multilayer solutions. Hence, it would help if you focused and partnered with PCB manufacturers.
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