Search Results for : machine learning
![Meet the ALL-NEW NVIDIA AGX Orin Developer Kit for Edge AI applications Meet the ALL-NEW NVIDIA AGX Orin Developer Kit for Edge AI applications](https://www.electronics-lab.com/wp-content/uploads/2022/04/Jetson-AGX-ORIN-Developer-Kit.png)
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Meet the ALL-NEW NVIDIA AGX Orin Developer Kit for Edge AI applications
Last month, NVIDIA announced the availability of the Jetson AGX Orin Developer Kit to deliver 275 trillion operations per second for energy-efficient advanced robotics and machine learning applications. There has been a lot of movement around the new NVIDIA developer kit that offers 8...
Continue Reading![e-con Systems launches a ready to deploy AI vision kit with e-con’s Sony IMX415 based 4K camera module e-con Systems launches a ready to deploy AI vision kit with e-con’s Sony IMX415 based 4K camera module](https://www.electronics-lab.com/wp-content/uploads/2022/04/Screenshot-2022-04-13-at-09-48-41-Qualcomm®-Edge-AI-Vision-Kit-4K-Smart-Camera-e1649832619137.png)
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e-con Systems launches a ready to deploy AI vision kit with e-con’s Sony IMX415 based 4K camera module
Complete AI vision solution | 4K resolution | Qualcomm® QCS610 | Sony STARVIS IMX415| MIPI CSI 2 e-con Systems™, a leading embedded camera company, launches qSmartAI80_CUQ610, a Qualcomm AI vision kit based on Sony STARVIS IMX415. This ready-to-deploy AI camera kit is suitable...
Continue Reading![Ultra-low profile dc-dc converters power 12-A loads Ultra-low profile dc-dc converters power 12-A loads](https://www.electronics-lab.com/wp-content/uploads/2022/03/TDK_uPOL_DC_DC-Converter_FS1412_202203_kakou-768x512-1.jpg)
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Ultra-low profile dc-dc converters power 12-A loads
TDK Corporation announces the availability of the FS1412 microPOL (μPOL) power module. At 5.8. mm, x 4.9 mm x 1.6 mm, the FS1412 is part of a new series of µPOL DC-DC converters with increased performance, smallest available size, ease of use, and simplified integration for...
Continue Reading![MIT Researchers Develop An ASIC To Defend Against Power-based Side Channel Attacks MIT Researchers Develop An ASIC To Defend Against Power-based Side Channel Attacks](https://www.electronics-lab.com/wp-content/uploads/2022/03/MIT-chip-for-side-channel-attacks.jpg)
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MIT Researchers Develop An ASIC To Defend Against Power-based Side Channel Attacks
A team of researchers affiliated with MIT School of Engineering, Indian Institute of Science, and Analog Devices have collaborated to design a tiny application-specific integrated circuit (ASIC) to defend against power-based side-channel attacks on an IoT device. Before getting into the...
Continue Reading![DIGI ConnectCore® 8M Nano System-On-Modules (SOM) DIGI ConnectCore® 8M Nano System-On-Modules (SOM)](https://www.electronics-lab.com/wp-content/uploads/2022/03/130258685.png)
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DIGI ConnectCore® 8M Nano System-On-Modules (SOM)
DIGI ConnectCore® 8M Nano System-On-Modules (SOM) are designed for industrial reliability and the 10+ year product lifecycles of embedded devices. These SOMs feature up to 4x power efficient Arm® Cortex®-A53 cores and 1x Cortex-M7 core that minimizes power consumption while...
Continue Reading![Aspinity AnalogML Core with Neuromorphic Computing Architecture for Low-power edge processing Aspinity AnalogML Core with Neuromorphic Computing Architecture for Low-power edge processing](https://www.electronics-lab.com/wp-content/uploads/2022/03/AML100-AnalogML-Chip.jpg)
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Aspinity AnalogML Core with Neuromorphic Computing Architecture for Low-power edge processing
Aspinity's analogML core features the improved capabilities of a tinyML chip with low-power analog neuromorphic computing architecture– with a system-level approach to low-power edge processing. Without making use of power-hungry digitization and digital processors, the analogML core...
Continue Reading![ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors](https://www.electronics-lab.com/wp-content/uploads/2022/03/Express-ID7-F-e1646153364430-1024x790.jpg)
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ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors
ADLINK’s new COM-HPC Server Type and COM Express Type 7 Modules boost real-time computing with integrated high-speed Ethernet and industrial-grade reliability & longevity ADLINK Technology Inc., a global leader in edge computing, introduces its latest Intel® Xeon® D-based...
Continue Reading![Dev Board Micro – A microcontroller board with a camera, mic, and Coral Edge TPU Dev Board Micro – A microcontroller board with a camera, mic, and Coral Edge TPU](https://www.electronics-lab.com/wp-content/uploads/2022/01/SN_MeVrDqextkt7bhGvBu3tqIJcw3U6vPwQUdvcXsNtCesepZrdPGWumaUWi7MwYDRmzVu1SMQ-jaRknaJ2ZzcUT-_XY5A5LQN82ZME-tAH_H0XWpcAw2000-rw-1024x576.png)
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Dev Board Micro – A microcontroller board with a camera, mic, and Coral Edge TPU
The Dev Board Micro board combines a camera, microphone and Coral Edge TPU with an NXP i.MX microcontroller Google is launching an edge AI board in the same form factor as a Raspberry Pi Nano for its Coral AI processor and NCP’s i.MX microcontroller for the first time. The Coral Dev...
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