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Radxa ROCK5 Model B With Embedded Rockchip RK3588 System-on-Chip

Posted on 16 January, 2022 by Abhishek Jadhav

Radxa announced a new Arm Desktop standard single board computer, ROCK 5 Model B based on the Rockchip RK3588 low-power and high-performance processor for edge computing. Radxa became one of the first manufacturers to embed an RK3588 system-on-chip showing the capabilities for digital multimedia applications.

At the heart of the Radxa ROCK5 Model B single-board computer is the RK3588 which comes with integrated quad-core Cortex-A76 and quad-core Cortex-A55 alongside a NEON co-processor. With several powerful hardware embedded inside the system-on-chip, the SBC is capable of supporting H.256 and VP9 video decoder at 8K 60fps and H.264 decoder at 8K 30fps. Along with this comes the embedded 3D GPU from Mali that supports OpenGLES 1.1, 2.0, and 3.0 with Vulkan 1.2. The SoC also introduces an image signal processor that can implement several algorithms accelerates like HDR, fisheye correction, and gamma correction.

Specifications of ROCK5 Model B:

Type: Pico-ITX form factor
SoC: RK3588 on 8nm manufacturing process
- Quad-core Arm Cortex-A76 processor @ 2.4GHz clock frequency
- Quad-core Arm Cortex-A55 processor @1.8GHz clock rate
- NEON co-processor
- Mali-G610 GPU
- 6 TOPS NPU
Wireless connectivity: Wi-Fi 6E and Bluetooth 5.2
Memory: 4GB, 8GB and 16GB LPDDR4 RAM
Storage: 4x PCIe 3.0 NVMe SSD, MicroSD card slot, and eMMC flash socket
Interfaces: 2.5G Ethernet with PoE support
Video output: 2x HDMI 2.1 up to 8K at 60fps and 1x USB Type-C with DisplayPort up to 8K at 30fps
Video input: HDMI IN support up to 4K at 60fps
Operating system: Linux kernel 5.10, Debian Buster/Android 12
GPIOs: 40-pin header
Dimensions: 100×72 mm

The ROCK5 Model B highlights three versions with different LPDDR4 RAM from the 4GB, 8GB, and 16GB options but lets you decide on flash memory through several interfaces. It does not fall behind when it comes to wireless connectivity of the single-board computer by supporting Wi-Fi 6E and Bluetooth 5.2. Video input through HDMI IN supports up to 4K at 60 fps but better video output through HDMI 2.1 and USB Type-C ports.

The base variant of Radxa ROCK5 Model B is priced at $129 going up to $189 for 16GB memory. However, you can save up to $50 on any of your desired models using the R3 code for a discount. You can purchase the hardware through official distributors like Ameridroid and Allnetchina.

KiCad Version 6.0.0 with New Interface and Improved PCB Design Experience

Posted on 13 January, 202213 January, 2022 by Abhishek Jadhav

Many of you might be familiar with the Eagle PCB software suite for electronic design automation. Similar open-source software was introduced about 3 decades ago, KiCad EDA has released a new version with “substantial improvements”. If you are an embedded electronic hacker, KiCad is a famous EDA tool satisfying the needs of the ever-demanding maker community. Also, available to download for Windows, macOS and several Linux distros operating systems. Going back, this article will primarily focus on highlighting the improvements seen in KiCad version 6.0.0.

There have been many important changes that make this release a substantial improvement over the 5.x series and a worthwhile upgrade for users on all platforms. There are hundreds of new features and improvements, as well as hundreds of bugs that have been fixed. Below are some of the highlights of the new release.

In every new software version, the users are always looking for a refreshed graphical interface. Here comes the KiCad 6.0 offering a new user experience making it easier to switch between KiCad and other design automation tools. The barriers to entry for such software suites are very high but with this new update, KiCad aims to reduce the limitations for new users. Working across schematic and PCB will be easier than ever before with harmonized hotkeys and dialogue layouts.

Big upgrades to PCB design come with new options to navigate through complex designs. The KiCad 6.0 version features support for hiding certain nets from the ratsnest and controlling the opacity of zones, pads, vias and tracks. For the schematic window, the improvements include the ability to assign and control net classes while modifying the color and style for wires and buses independently. The visualization of your designed board can be done in several ways through the updated 3D viewer featuring ray-tracing lighting controls, highlighting of objects that are selected in the PCB window and many more.

For more details on KiCad version 6.0.0 release, proceed towards the official blog post.

Intel’s Loihi 2 – Next-Generation Neuromorphic Research Chip

Posted on 13 January, 202213 January, 2022 by Abhishek Jadhav

The shift from offline training using labeled datasets in parallel computing to learn on-the-fly through neuron firing rules in Neuromorphic Computing has significantly aided the ever-increasing demand for artificial intelligence in a range of applications. Intel’s first-generation Neuromorphic Loihi Chip was presented with self-learning capabilities, novel neuron models, and asynchronous spike-based communication.

After a series of discussions with customers and three years of intensive research on designing a next-gen Neuromorphic chip, Intel introduces the all-new Loihi 2. The new generation of neuromorphic computing architecture comes with 128 neuron cores per chip and twice the number of processors per chip as compared to the predecessor.

Investigators at Los Alamos National Laboratory have been using the Loihi Neuromorphic platform to investigate the trade-offs between quantum and Neuromorphic computing, as well as implementing learning processes on-chip,” said Dr. Gerd J. Kunde, staff scientist, Los Alamos National Laboratory. “This research has shown some exciting equivalences between spiking neural networks and quantum annealing approaches for solving hard optimization problems.

The Loihi 2, Neuromorphic computing architecture offers generalized event-based messaging, which allows spikes to carry integer-valued payloads at little cost in either performance or energy. With greater neuron model programmability, Loihi 2 can be modified supporting common arithmetic, comparison, and program control flow instructions. The programmability further enhances the performance without compromising the efficiency for a wide range of use cases.

When compared with their predecessors, the Loihi 2 is capable of achieving 2x higher synaptic density, which means that the new processor architecture has half the size of the neuron core for the same synaptic memory capacity. To optimally utilize the available memory, Loihi 2 offers advanced connectivity compression features by supporting sparse and dense synapse encoding. Major improvements are seen in the support for convolutional, factorized, and stochastic connections. With Loihi 2 there is an increase in the number of embedded processors per chip to 6 from 3 in the previous version.

A comprehensive comparison between the two versions is also made available by the manufacturer. For more details on Intel’s Loihi 2 Neuromorphic Chip, head to the product page.

ETH Zurich Researchers Introduces A New RISC-V based Processor Architecture

Posted on 13 January, 202213 January, 2022 by Abhishek Jadhav

For the growing demand for floating-point operations per second, a group of researchers at ETH Zurich (home for some significant RISC-V innovation) announced a new RISC-V-based processor architecture with substantial upgrades in performance and energy efficiency. The basic idea behind the innovation comes from the combination of a tiny 10kGE (kilo gate equivalent) control core, now known as Snitch, with a double-precision FPU. Since the traditional approach introduced a trade-off between the non-floating point unit area and floating-point utilization, which has been taken care of by the Snitch. This was done by enhancing the RISC-V instruction set architecture with “two minimally intrusive extensions”.

The decision to include stream semantic registers and a floating-point repetition instruction was the key to reaching the goal. These ISA extensions further reduced the pressure on the core and gave the opportunity to run other tasks which made Snitch and FPU a dual-issue at a minimal incremental cost of 3.2%. The proposed architectural modifications were carried out on an octa-core cluster of 22nm technology. The results show that the methodology achieved over 6x multi-core speed up and a 3.5x gain in energy efficiency.

The contributions made by the group of researchers include the design of a general-purpose, single-stage, single-issue core tuned for high energy efficiency which is aimed towards maximizing the compute per control ratio. The ISA extensions of the stream semantic register are meant to accelerate data oblivious problems by providing an efficient semantic to read and write from memory. An algorithm is called data-oblivious if its control flow and memory access pattern do not depend on its input data.

“We aim to maximize the control to compute ratio by providing a small and agile integer core that can make single-cycle control flow decisions and integer arithmetic and combine it with a large FPU,” the team explains. “The system offers an implementation of the RISC-V atomic extension (A) for efficient multicore programming and can be targeted with a standard RISC-V toolchain.”

The research was published in the journal IEEE Transactions on Computers under closed access terms.

[Image Credit: Hackster News]

Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor

Posted on 13 January, 202213 January, 2022 by mixos

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Looking into the booming markets and scenarios ranging from surveillance to gaming, networking, and industrial uses, the growing demand for high-speed LAN solutions is promising. Additionally, interference issues are also occurring more often as the size of the PCIe form factor cannot fit in the smaller design of IPC platforms nowadays. Being the leading global provider of industrial embedded flash and memory, Innodisk is introducing the first M.2 10GbE LAN module designed to meet the demand for increased speed and reduced size, high-speed LAN solutions.

Innodisk’s EGPL-T101 is the first M.2 2280-to-single 10GbE Base-T Ethernet module which is also the smallest 10GbE expansion solution available today and ten times faster than standard Ethernet. By supporting PCI Express Gen 3×2, the EGPL-T101 module can provide sufficient bandwidth for one 10GbE LAN port suitable for server and industrial applications’ high-speed network demands.

As an Innodisk high-speed LAN solution, EGPL-T101 boasts flexible integration. Its standard RJ45 LAN port on a tiny daughterboard provides an easy solution for upgrading to a 10GbE network using existing Cat6/6A copper cables. The EGPL-T101 also features excellent compatibility with its six network standards supported in 10/5/2.5/1Gbps and 100/10Mbps, providing excellent backward compatibility with existing network infrastructure. Lastly, the EGPL-T101 features high-performance computing (HPC) which is ten times faster than the widely used Gigabit Ethernet with low power consumption. EGPL-T101 is suitable for various high-speed scenarios, including:

Machine vision in industrial applications
High throughput network data transmission
High-resolution imaging for surveillance
Low-latency for gaming

Mass production of the EGPL-T101 is expected to begin in December 2021 to meet the growing demand for innovative high-speed LAN solutions.

floLIVE introduces a new iSIM providing regulatory-compliant global connectivity for connecting IoT devices at scale

Posted on 12 January, 2022 by mixos

floLIVE, a leading IoT connectivity provider of advanced 5G network solutions and a full suite of cloud-based global connectivity services, today announced it has collaborated with Kigen – a global leader in eSIM and iSIM security, and Sony Semiconductor Israel (Sony) – a leading Cellular IoT chipset provider.

The three vendors have successfully developed an advanced, state-of-the-art solution based on Sony’s Altair cellular IoT chipset ALT1250 with an integrated SIM (iSIM) powered by Kigen’s iSIM OS and embedded with floLIVE’s global connectivity. The new solution leverages the benefits brought by iSIM technology of lower size, cost, and efficient communications, combined with an advanced LPWA chipset for NB-IoT and CAT-M and local breakouts – all contributing to improving latency and extending battery life – key requirements for modern IoT use cases.

floNET is floLIVE’s global connectivity service; through a globally distributed array of core mobile network instances, it provides enterprise customers with localized connectivity that adheres to privacy and data sovereignty regulations (e.g., GDPR), and is permanent roaming safe.

“Our joint solution is a unique offering in the IoT space, and will be a model for other solutions in the market,” said Nir Shalom, CEO floLIVE. “We are proud to have the opportunity to partner with Sony and Kigen to leverage our highly-effective over-the-air multi-IMSI solution that is in line with Sony’s own target to extend battery life and optimize data usage, and Kigen’s advanced, highly-secure integrated SIM OS.”

This collaboration is a significant step in floLIVE’s growth as a global connectivity leader, and in the worldwide need for innovative, iSIM-based connectivity solutions that meet new business needs.

“Sony is at the forefront of the next generation of connected devices, and to make that happen, we collaborate with vendors who have new approaches to enabling IoT connectivity”, said Aviv Castro, VP Business Development at Sony Semiconductor Israel. “floLIVE offers broad global coverage in our target markets and can address local regulatory challenges. This not only encourages IoT adoption, but also supports specific customer requirements for privacy and scale.”

Having developed its own global software connectivity infrastructure, floLIVE can customize any element of the solution to meet specific customer requirements. The solution supports additional cellular technologies such as 5G, for future use cases.

“Kigen initiated the iSIM technology with a vision to simplify the manufacture of global IoT products and scale seamlessly,” said Vincent Korstanje, CEO at Kigen. “This collaboration with Sony and floLIVE combines the best of security through Kigen iSIM OS with out of the box LPWAN connectivity on proven iSIM chipset so OEMs can focus on meeting regulatory and local market needs.”

more information: https://flolive.net/flonet/

Vecow and MOV.AI Partner to Accelerate AMR Development for Enterprise Needs

Posted on 12 January, 202212 January, 2022 by mixos

Vecow Co., Ltd., a team of global embedded experts, and MOV.AI who is revolutionizing Autonomous Mobile Robots (AMR) development, today announced they are collaborating to provide an integrated AMR solution containing the Vecow ECX-1000 Series Workstation-grade Fanless System and MOV.AI Robotics Engine Platform™. The demand for AMRs is growing rapidly – Interact Analysis predicts that 2.1 million mobile robots will be shipped by the end of 2025 including 860,000 in that year alone. AMRs are expected to perform a growing number of mission-critical tasks in dynamic industrial and logistics environments. The strategic technology partnership aims to help AMR manufacturers with an integrated computing and software platform that speeds up AMR development and deployment.

Powered by Intel Core i7 processor running with workstation-grade chipset, Vecow ECX-1000 provides outstanding system performance, always-on 5G/WiFi/4G/LTE/BT mobile availability, smart system manageability, smart power protection features optimized for autonomous operation. The MOV.AI ROS-based Robotics Engine Platform™ provides AMR manufacturers and automation integrators everything needed to easily develop enterprise grade robots. It includes a ROS-based IDE, off-the-shelf autonomous navigation algorithms, deployment tools, and operational tools such as fleet management, flexible interfaces with warehouse environments such as ERP and WMS, cyber-security, and APIs.

Vecow ECX-1000 is embedded with VHub ROS, a turnkey solution which covers AI computing systems, perception SDKs and software platform, and all-in-one integrated functions with versatile platform offerings to accelerate the requirements of AMR applications. With this collaboration, the MOV.AI Robotics Engine Platform is included in the VHub ROS solution and serves as a premium version of VHub ROS for AMR manufacturers.

“We are so glad for this win-win partnership with MOV.AI,” said Thomas Su, Vice President of Vecow. “Vecow ECX-1000 Series Fanless Workstation running with the MOV.AI Robotics Engine Platform™ delivers an enterprise-grade, easy to build, deploy and operate AMR solution to benefit not only our global partners but also Vecow and MOV.AI a competitive advantages and faster time-to-market.”

“We are excited about the partnership with Vecow and the benefit MOV.AI-powered IPCs deliver”, said Motti Kushnir, MOV.AI CEO. “This joint offering is in line with our mission to simplify collaborative robot development and to provide AMR manufacturers and integrators with everything they need to develop and operate great robots. MOV.AI Robotics Engine Platform running on top of Vecow Computing Engine creates a robust end-to-end Robotics infrastructure that powers, high-performance enterprise-grade robots.”

ECX-1000 : Intel® Xeon®/Core™ i7/i5/i3 Processor Workstation-grade Embedded System

VHub ROS Solution : A turnkey autonomous robot solution service to accelerate your AMR applications

MOV.AI Robotics Engine Platform : End-to-end visual ROS-Based robotics software platform and visual IDE

e-con Systems™ launches 13MP high-resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity

Posted on 12 January, 2022 by mixos

13 MP resolution | Monochrome | AR1335 sensor | High Sensitivity | USB 3.1 Gen 1 interface

e-con Systems™, a leading embedded camera company, launches See3CAM_CU135M, a 13MP high-resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity.

e-con Systems is an embedded vision company specialized in designing, developing, and supplying camera solutions for industries such as retail, medical, industrial, agriculture, etc. The latest addition in its portfolio is See3CAM_135M, a monochrome USB camera. See3CAM_CU135M is based on the 1/3.2-inch AR1335 monochrome CMOS image sensor from Onsemi® with advanced 1.1µm pixel BSI technology. This camera comes with the auto exposure feature allowing it to easily adjust to changing lighting conditions. Absence of color filter arrays in this 4K monochrome camera results in higher quantum efficiency in both visible and NIR regions compared to cameras with RGB color filters. This high quantum efficiency helps to capture images with less noise using See3CAM_CU135M in all lighting conditions. Also, this camera comes with the 2×2 and 4×4 pixel binning features that helps to enhance its sensitivity.

Further, See3CAM_CU135M is a high-resolution camera with a resolution of 13MP. This helps to capture images with great details, which is a critical feature in microscopic applications. This 4K monochrome camera streams video data in Full HD @ 60 fps & 4K @ 30 fps with output formats of Y8 and Y16. Also, it has an S-mount lens holder which allows customers to choose and use their own optics.

Key features of See3CAM_CU135M

Monochrome camera: Absence of color filter arrays helps to capture images with less noise.
M12 lens holder: Fixed focus and liquid lens auto focus support
USB 3.1 Gen 1 interface: Compatible with Windows and Linux operating systems, and Industrial PCs.
2×2 and 4×4 image binning: Enhanced sensitivity

High sensitivity in both visible and NIR regions, image binning capability, ability to capture minuscule details, and low noise capabilities make this camera an ideal fit for applications such as digital microscope, automatic number plate recognition, and quality inspection.

Video

Availability

Customers interested in evaluating See3CAM_CU135M –13MP high resolution monochrome USB 3.1 Gen 1 camera with superior sensitivity – can purchase the product from e-con Systems’ online store. Please visit the See3CAM_CU135M product page and click the buy now button to navigate to the webstore and purchase the product.

AWS IoT ExprssLink SARA-R5 Starter Kit For Under $190.00

Posted on 11 January, 202211 January, 2022 by Emmanuel Odunlade

SparkFun Electronics has launched its development Kit, the AWS IoT ExpressLink SARA-R5 Starter Kit – a product of its collaboration with u-Blox and AWS, to make development using AWS IoT core via a cellular LTE-M network easier.

The AWS IoT ExpressLink offers connectivity software across hardware modules offered by AWS Partners like u-Blox, Infineon, and Espressif. It aims to provide easy connectivity to the cloud with integration into more than 200 AWS IoT services like AWS IoT core. The AWS IoT ExpressLink being a secured out-of-the-box and over-the-air (OTA) connectivity platform for all types of devices, makes it easy to transform existing devices into smart IoT projects.

As the name implies, the development Kit designed for development with the u-blox SARA-R510-AWS module is built on AWS IoT ExpressLink to offer access to AWS IoT core. The Starter Kit comes with a pre-activated u-Blox Thingstream eUICC SIM card which supports cellular communication over a multi-regional network via an LTE antenna also included. It also features a MicroMod Asset Tracker Carrier Board that carries a SARA-R5 module, an ESP32 processor board for running demo applications, and a MicroMod Update Tool for guidance on the use of the MicroMod Asset Tracker Board. The Starter Kit takes power via a USB-C, a breakout pin, or a LiPo battery.

The SparkFun MicroMod Asset Tracker Carrier Board is designed to carry a MicroMod Processor board and allow different microprocessors to be used with it. The Carrier Board comes with an integrated ICM-20948 Inertial Measurement Unit (IMU) and a digital microphone. The IMU which detects the device’s orientation and movement allows a message to be generated and sent whenever the device – asset, is moved from its specific position. The digital microphone being inbuilt allows the device to detect noise that can be dangerous to the system and send an alert, ensuring the safety of the device. The Asset Tracker Carrier Board is also equipped with an onboard micro-SD card socket, and a SIM card slot with a 250 MB global data size SIM card already installed.

Features and Specifications of the AWS IoT ExpressLink SARA-R5 Starter Kit:

Transceiver: u-Blox SARA-R510-AWS module for secure multi-regional AWS IoT Core access

1x MicroMod Update Tool included for communicating directly with the u-Blox SARA-R510AWS module.

Controls:

ICM-20948 Inertial Measurement Unit for 9-Degree Of Freedom orientation and movement detection
“Wake On Motion” is supported
IMU is located in the center of the board for easy frame-of-reference
1x SPH0641 – Digital microphone

Storage:

micro-SD socket (for data storage)

Power/Supply:

Support rechargeable LiPo batteries
LiPo battery charger (MCP73831) with battery fuel gauge (MAX17048)
1x RTC backup battery

Network/wireless:

SMA connection for LTE
SMA connection GNSS antennas
3.3V power for an active GNSS antenna (switchblade)

Connectors:

USB-C connectivity
Nano SIM socket
Qwiic (I2C) connector

3.3V breakout pins for:

1x SPI bus
GNSS timing pulse (1PPS)
D0, D1, A0, A1 PWM0, PWM1
1x SARA I2C
1x Network indicator
SARA-R5 ON
1x I2C bus

LED indicators:

1x Power (VIN and 3.3V)
1x Network indicator
1x SARA-R5 ON
GNSS timing pulse (1PPS)

Video

The SARA-R5 module-based Starter Kit only accepts customized AT Commands, the AWS IoT ExpressLink AT Commands, and will not work with the standard u-Blox SARA-R5 AT Command set. However, SparkFun has provided information on a Hookup Guide for assistance with how to link the MicroMod Update Tool to the SARA-R5 based Asset Tracker Carrier Board. The Company also provides AWS IoT ExpressLink Examples to run on the MicroMod processor on its GitHub repository.

However, SparkFun advises Customers to confirm that their service provider offers LTE-M coverage before purchasing the starter Kit. More information is available on the product’s page where the product is also available for order at $185.00 on the same page. Information on AWS IoT ExpressLink is available on AWS website.

Meet the Latest Sparkfuns MicroMod Function and Carrier Boards

Posted on 11 January, 2022 by Emmanuel Odunlade

SparkFun recently added a host of new MicroMod boards and Carriers to its fast-growing MicroMod family. The new boards include a MicroMod ESP32 Function Board, a MicroMod DA16200 Function Board, a MicroMod LoRa Function Board, a MicroMod Environmental Function Board, and a Single/Double MicroMod Main Board.

The SparkFun MicroMod DA16200 Function Board debuts additional onboard IEE802.11b/g/n WiFi module featuring a 40MHz crystal oscillator, RF filter, 4MB Flash, 32.768KHz RTC, a Chip antenna, and JTAG connectors for programming and debugging for upgrading any MicroMod solution. With a low current draw of 0.2uA – 3.5uA in sleep mode, the SparkFun MicroMod DA16200 Function Board is suitable for the development of automation projects requiring door locks, sensors, thermostats, and IoT solutions.

MicroMod WiFi Function Board

The second board, the SparkFun MicroMod WiFi Function Board – ESP32 is designed to serve as a coprocessor board, utilizing ESPRESSIF’s ESP32 WROOM (ESP32-DOWD-V3 Chip) to add WiFi and Bluetooth wireless features to original MicroMod processor boards without such features. The onboard ESP32 WROOM is equipped with 16MB Flash, 520KB SRAM, a dual-mode Bluetooth, an IEE802.11b/g/n WiFi transceiver, and an M.2 MicroMod interface to aid connection without inter-board soldering. The board also features a UART port that can be used to control the ESP32 WROOM module via AT commands, USB-C connector, and CP2102 USB-to-Serial converter.

MicroMod LoRa Function Board

The next Board, SparkFun MicroMod LoRa Function Board, is expected to be used alongside a MicroMod processor board on a Main Board (Host) that offers LoRA and LoRaWAN network capabilities for any MicroMod development. The Main Board is designed to host the duo attachments and provide an electrical connection between them. The LoRa Function Board features Ebyte’s LoRa 915M30S module, a 30dBm transceiver utilizing Semtech SX1276 Communication protocol. It has an edge mount RP-SMA connector suitable for 915MHz LoRa antennas, and a U.FL interface.

MicroMod Environmental Function Board

The last function board, the SparkFun MicroMod Environmental Function Board provides sensing capabilities to MicroMod processor boards with an SGP40 sensor for air quality sensing, an SHTC3 sensor for temperature and humidity sensing, and an STC31 sensor for sensing CO2 concentrations in your room. This Board features an I²C port, an AP2112 3.3V voltage regulator, and jumpers for selectively addressing the STC31.

Talking about the Main Boards, the MicroMod Main Boards are special Carrier boards designed to carry a MicroMod processor board and a single or double MicroMod Function board, providing the electrical connection between them. Both boards feature a 2A fuse, 3.3V/1A voltage regulator, and a USB-C interface for power and programming of the processor board. While the Single Main Board allows interfacing a MicroMod processor board with one Function board, the Double Main Board allows interfacing with two Function boards.

There are tutorial links for all the new boards on each Board sales page. You will see links to each product’s page below.

The new MicroMod boards are available for purchase on SparkFun shop at $14.95 for the WiFi Function Board – ESP32; $29.95 for the WiFi Function Board – DA16200; $39.95 for the LoRa Function Board; $149.95 for the Environmental Function Board; $14.95 for the Single Main Board; and $17.95 for the Double Main Board.