Search Results for : Neural Processing Unit
![MYIR Launches i.MX 93 based SoM for Industrial Applications MYIR Launches i.MX 93 based SoM for Industrial Applications](https://www.electronics-lab.com/wp-content/uploads/2024/05/myclmx9xbanner.jpg)
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MYIR Launches i.MX 93 based SoM for Industrial Applications
MYIR has launched a new embedded System on Module (SoM), the MYC-LMX9X, based on the NXP i.MX 9352 processor. This processor belongs to the high-performance i.MX 93 family, featuring dual ARM Cortex-A55 cores clocked at up to 1.7GHz and Cortex-M33 cores running at 250MHz. It also...
Continue Reading![New DART-MX93 System on Module by Variscite Brings Machine Learning to Compact, Cost-Optimized, Rugged Edge Devices New DART-MX93 System on Module by Variscite Brings Machine Learning to Compact, Cost-Optimized, Rugged Edge Devices](https://www.electronics-lab.com/wp-content/uploads/2024/05/DART-MX93-1024x565.png)
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New DART-MX93 System on Module by Variscite Brings Machine Learning to Compact, Cost-Optimized, Rugged Edge Devices
Based on NXP’s i.MX93 processor with Ethos™ neural processing unit Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced the newest member of the DART Pin2Pin family for machine learning on edge devices at a competitive...
Continue Reading![Introducing the Banana Pi BPI-M5 Pro: A Next-Generation AIOT Platform Introducing the Banana Pi BPI-M5 Pro: A Next-Generation AIOT Platform](https://www.electronics-lab.com/wp-content/uploads/2024/05/Banana-Pi-BPI-M5-Pro.jpg)
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Introducing the Banana Pi BPI-M5 Pro: A Next-Generation AIOT Platform
The Banana Pi BPI-M5 Pro presents a cutting-edge solution for AIOT (AI + IoT) applications, boasting the advanced features of the second-generation 8nm high-performance Rockchip RK3576 chip design. This powerhouse is equipped with a 6 TOPS computing power NPU (Neural Processing Unit)...
Continue Reading![ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI](https://www.electronics-lab.com/wp-content/uploads/2024/05/BRBOVo5Udw.png)
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ARM Unveils Ethos-U85 NPU and Corstone-320 Platform for Enhanced Edge AI
Arm Targets the AIoT with High-Performance Ethos-U85 NPU and Corstone-320 Platform New accelerator boasts four times the peak performance and a 20 percent power efficiency boost over its predecessors. Arm has announced its latest designs for the Artificial Intelligence of Things (AIoT)...
Continue Reading![ArmSom Sige7 Review- A Rockchip RK3588 SBC with Dual 2.5GbE Ethernet, NVMe Storage, and Triple Display Output ArmSom Sige7 Review- A Rockchip RK3588 SBC with Dual 2.5GbE Ethernet, NVMe Storage, and Triple Display Output](https://www.electronics-lab.com/wp-content/uploads/2024/04/20240430_100054-e1714806478863-1024x686.jpg)
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ArmSom Sige7 Review- A Rockchip RK3588 SBC with Dual 2.5GbE Ethernet, NVMe Storage, and Triple Display Output
Introduction The ArmSoM Sige7 is a compact single-board computer (SBC) powered by the RK3588, an octa-core 64-bit SoC clocked at 2.4 GHz. The SoC features a 6TOPS NPU for AI tasks and supports up to 32GB of LPDDR4x RAM and 128GB of eMMC flash storage. It includes an M.2 2280 socket for...
Continue Reading![Tangram Vision Self-Calibrating HiFi 3D Sensor Features ROS 2 Integration and On-Device AI Tangram Vision Self-Calibrating HiFi 3D Sensor Features ROS 2 Integration and On-Device AI](https://www.electronics-lab.com/wp-content/uploads/2024/04/Sensor-Front-Left-Angle-e1713877531467.webp)
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Tangram Vision Self-Calibrating HiFi 3D Sensor Features ROS 2 Integration and On-Device AI
The Team at Tangram Vision has recently introduced Self-Calibrating HiFi 3D Sensor a cutting-edge depth sensing solution designed primarily for robotics applications. The camera module integrates high-fidelity 3D sensing with on-device AI capabilities, to provide a Plug-'n'-Play...
Continue Reading![Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices](https://www.electronics-lab.com/wp-content/uploads/2024/04/PjjLzYgI-1024x640.jpeg)
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Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices
Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge. Hailo, the pioneering chipmaker of edge...
Continue Reading![Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor](https://www.electronics-lab.com/wp-content/uploads/2024/04/digi-connectcore-mp25-e1713099052360.jpg)
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Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor
At Embedded World 2024, Digi International unveiled the Digi ConnectCore MP25, an ultra-compact System-on-Module (SoM) powered by the STMicroelectronics STM32MP25 SoC. This module is equipped with advanced connectivity features including 802.11ac Wi-Fi 5, Bluetooth 5.2, options for...
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