Android APP Contact Us
login / register Upload
TRENDING:

Solliance sets records for perovskite solar cells at 29.2 per cent

Posted on by mixos

4T tandem perovskite silicon solar cells reach a record efficiency of 29.2 percent. [via]

The European Solliance research group continues to set records for the efficiency of tandem perovskite solar cells using silicon and CIGS. Increasing the efficiency of low-cost perovskite solar cells is a key way of boosting renewable energy production. Combining the perovskite cell, which absorbs in the infrared, with existing cells based on silicon or other materials captures more of the available energy, providing higher conversion efficiency.

Working with the M2N group of René Janssen at the University of Technology Eindhoven, the researchers at Solliance in the Netherlands used a wide-bandgap (1.69eV) perovskite cell with high near-infrared transparency on top of a silicon solar cell from Panasonic with four terminals (4T).

The perovskite cell reached a stabilized efficiency of 17.8 percent during 5-min maximum-power-point tracking and achieved a record efficiency of 29.2 percent for the 4T perovskite/Si tandem cell.

In combination with the Miasolé copper indium gallium selenide (CIGS) bottom cell, the team also showed a world-record efficiency of 27.1 percent for a flexible 4T perovskite/CIGS tandem.

www.solliance.eu

PiBox 2 Mini – A Raspberry Pi CM4-Based NAS And Cloud Storage Device

Posted on by Emmanuel Odunlade

With the increased number of cloud storage solutions now available to support virtual data access, it is undeniably true that cloud computing has come to stay in the tech ecosystem. KubeSail, a self hosting company, has added to this number with their newest product called the PiBox 2 Mini.

The PiBox 2 Mini with a modular design is a network data storage server built on a Raspberry Pi CM4 board with up to 8GB RAM and 32GB eMMC flash. The PiBox is designed to function as a standard NAS and specifically provide support for home-based private cloud hosting applications capable of replacing popular cloud storage solutions/services like Dropbox and Google photos with easily installable templates (apps/services) available in/for the box. It is furnished with two slots for 2.5″ HDD and SSD compatible drivers, USB ports, and an HDMI port to also function as a computer.

The box features a PCIe carrier board that carries the Raspberry Pi CM4, a PCIe slot for the Raspberry Pi CM4, and a SATA board with interfaces that I already mentioned. The carrier board also exposes a 40-pins GPIO header and a Gigabit Ethernet port. It requires a supply power of 5V/3A. Board specification references Jean-Luc’s content on Cnx Software. 

Key Features and Specifications Include:

  • Raspberry Pi CM4/CM4 Lite
  • 8GB RAM
  • 32GB eMMC flash
  • 5V/3A power supply (through USB-C port)
  • 2x SATA port (for 2.5-inch HDD/SSD drives)
  • MicroSD card socket (CM4 Lite support)
  • RJ45 port
  • Optional 802.11b/g/n/ac WiFi 5, Bluetooth 5.0 module of Raspberry Pi CM4
  • HDMI 2.0 port @ 4Kp60
  • Built-in 1.3-inch colour LCD
  • USB 2.0 ports x 2, USB-C port (power input)
  • Tri-color RGB LED, Disk, CPU,  Power LEDs, PWM cooling fan

As for the software, the board runs KubeSail and supports open-source solutions (templates). These solutions include MySQL, WordPress, Nextcloud – cloud storage solution, Minecraft Server, PhotoPrism — a replacement for Google photos, and more. KubeSail platform is optional software that provides flexibility to its users by granting easy access to user files physically or virtually/remotely. Three subscription plans are included:

  • Community — $0.0 per cluster with limited proxy traffic, dynamic DNS and one user per month.
  • Standard — $5.0 per cluster with custom domains, encrypted backups, 25GB proxy traffic, up to 3 users and deploy from Github per month.
  • Pro — $25.0 per cluster, per month with nearly unlimited backups, many TBs proxy traffic, unlimited users and priority support.

So, with the community subscription available, KubeSail software appears free for an entire lifespan as long as you use limited resources and stay within the free zone conditions — of one cluster, one user. If you want to try the PiBox OS available on the Github repository on your Raspberry Pi compute module, follow the guides lines for installation.

The KubeSail PiBox 2 Mini is available on Kickstarter for crowdfunding campaign with rewards at $100+ (for bare PiBox circuit board), $ 250+ (for standard bundle), $450+ (for standard bundle + SSD drives installed), and, $2500+ (for founders Edition bundle).

Other useful details can be found on Kickstarter’s website.

Akida Development Kits For Raspberry Pi And Shuttle PC

Posted on by Emmanuel Odunlade

Brainchip has announced the release of two development kits for its Akida AKD1000 neuromorphic processor to further help hobbyists, tinkerers and developers create ultra-low-power applications. This new launch intends to meet the need of developers who wish to run its AKD1000 silicon chip with configurable IP format with a Raspberry Pi or a Shuttle PC.

The AKD1000 silicon is designed to offer high performance for high-end (spiking) neural networks, and edge AI solutions while consuming power only when the spikes are actively processed and decoded. The AKD1000 also provides high security and low power consumption with the ability to undergo onboard AI training and learning without the need for retraining in the cloud.

According to a released statement by Anil Mankar, Brainchip Co-founder and Chief Development Officer of the launch, the new development kits are major steps by Brainchip towards full commercialization of its device. They are equally avenues to see how its present customers and future customers will utilize Akida in applications like industrial applications, consumer electronics, aerospace and defence systems, automotive technology, and healthcare and medical devices. The two development kits are Raspberry Pi-based and Shuttle PC-based. The first is built based on Raspberry’s Pi compute Module 4 open-hardware I/O carrier board while the latter is designed for compatibility with shuttle PC with 10th – gen Intel Core i9/i7/i5/I3, Pentium, Gold and Celeron processors.

Key Specifications of the two Dev Kits Include:

Akida Development Kit – Raspberry Pi:

  • SoC: Broadcom BCM2711C0 quad-core ARM Cortex-A72 (ARMv8-A) 64-bit @ 1.5GHz
  • GPU: Broadcom VideoCore VI
  • 1GB, 2GB, 4GB, or 8GB LPDDR4 SDRAM
  • Optional 2.4 GHz and 5 GHz 802.11b/g/n/ac Wi-Fi, Gigabit Ethernet PHY
  • GPIO: Carrier board dependent
  • PCI Express, 2× DSI, 2× CSI, 2× HDMI
  • External (CM4 Lite), on-board 8GB/16GB/32GB eMMC (CM4)
  • Hirose U.FL antenna connector, 2× 100-pin high-density connectors
  • 20.06cm x 10.5cm x 3.7cm (exc. carrier board)
  • Optional Bluetooth 5.0 and BLE
  • Additional: Includes Akida on Mini PCIe Board installed in the development kit, Meta TF Software Development Environment, Includes User Guide and examples of Akida Models

Akida Development Kit – Shuttle Pc:

  • Power Supply: External 180 W / 19.5 V power adapter
  • OS: Supports Windows 10 and Linux (64-bit)
  • Processor Support: Socket LGA1200 supports 10th-gen Intel Core i9/i7/i5/i3, Pentium Gold, and Celeron processors, codenamed “Comet Lake-S”, max. 65W TDP
  • Heatpipe cooling system with two fans
  • 1x 2.5″ bay for SATA hard disk or SSD, max. 9.5 mm
  • 1x M.2-2280M slot (supports PCIe x4 NVMe or SATA)
  • 1x M.2-2230AE for an optional WLAN card
  • 1x PCI Express X16 v3.0 slot
  • Supports single-slot expansion cards with max. 208 x 120 x 30 mm in size and max. 75 W TDP
  • Onboard 5V auxiliary voltage (max. 2 A) with 4-pin Molex adapter cable
  • HDMI 2.0a, D-Sub VGA, 4x USB 3.2 Gen1, 4x USB 2.0, 1x USB 2.0 internal USB stick, 2x audio (line out, mic), Intel Gigabit LAN (RJ45), Connector for the external power button, “Always-On” jumper, DC input
  • Optional Accessories: WLAN Module (WLN-M), Vertical Stand (PS01), RS232 COM port (H-RS232), Cable for external power button (CXP01)
  •  Chipset:
    • Intel H410 Chipset
    • Includes Akida on Mini PCIe Board installed in the development kit
    • Includes Meta TF Software Development Environment
    • Includes User Guide and examples of Akida Models

You’ll get the Raspberry Pi-based kit at $4,995 but the Shuttle PC-based kit sells for $9,995 on the company’s products page. They however have not given any date for shipping yet.

MEMS microspeaker for wearables weighs 56mg

Posted on by mixos

Startup xMEMS Labs Inc. (Santa Clara, Calif.) has launched a MEMS microspeaker called Cowell that it claims is the world’s smallest.

It measures 3.2mm by 1.15mm by 6.0mm (22 cubic millimeters) and weighs 56 milligrams making it suitable for true wireless stereo earbuds.

Cowell delivers a sound pressure level of 110dB at 1kHz; provides up to 15dB of gain above 1kHz for improved speech-in-noise performance and greater vocal and instrumental clarity versus electrodynamic and balanced armature µspeakers. Cowell is the first speaker to use xMEMS’ second generation M2 speaker cell architecture enabling increased loudness in smaller form factors. Cowell engineering samples are available now, with mass production in early 2Q22.

“Cowell’s architecture addresses two key hearables market trends: 1) spatial and lossless audio; and 2) over-the-counter (OTC) hearing aids,”

said Mike Housholder, xMEMS’ vice president of marketing and business development.

“Cowell’s small size and performance are perfectly aligned with these market trends with a fast mechanical response, up to 150x faster than incumbent speakers, near zero phase shift and +/-1 degree phase consistency enabling precise placement of audio in 3D space.”

For TWS applications, Cowell can be implemented as a full-range driver in occluded earbud architectures or as a small, high-performance tweeter paired with an electrodynamic woofer driver in non-occluded or leaky 2-way solutions.

For hearing aid applications, Cowell is a full-range driver that is 45 percent smaller than an equivalent balanced armature receiver, making receiver-in-canal applications a possibility.

As with all xMEMS microspeakers, Cowell is a monolithic architecture implementing both actuation and diaphragm in silicon resulting in better part-to-part frequency response consistency and reducing speaker matching or calibration time at manufacturing.

Cowell is paired with the xMEMS Aptos Class-H audio amplifier (1.92 x 1.92 x 0.6mm WLCSP).

more information: www.xmems.com

GENE-TGU6: Greater Performance for Embedded Edge Applications

Posted on by mixos

AAEON, an industry leader in AI Edge solutions, announces the GENE-TGU6 subcompact embedded board. Featuring the 11th Generation Intel® Core™ U processors (formerly Tiger Lake), the board delivers performance and a great range of features designed to power applications from AI processing and Edge IoT, to digital signage and automation.

The GENE-TGU6 is powered by the 11th Generation Intel Core U processors. This latest generation of embedded processors deliver up to 20% better performance over previous generations. By leveraging both innovative thermal design and industrial CPU SKUs, the GENE-TGU6 can support operation in tough environments with temperatures ranging from -40°C to 85°C (0°C to 60°C on standard platforms).

The GENE-TGU6 allows users and developers to leverage the Intel® Iris® Xe embedded graphics to power brilliant displays and accelerate inferences. The GENE-TGU6 features five video outputs on board, supporting up to four simultaneous displays up to 4K, perfect for digital signage and kiosk applications. Additionally, the Intel Iris Xe is designed to be compatible with Intel® distribution of OpenVINO™ toolkit, allowing it to perform AI acceleration tasks. Along with Intel® Deep Learning Boost™, the GENE-TGU6 is capable of AI compute performance 30~40% greater than previous generations.

With the need to meet demands for higher bandwidth data transfer and processing, the GENE-TGU6 comes with a host of features designed for speed and flexibility. The board comes with two LAN ports, one powered by the Intel® i225 chipset delivering speeds up to 2.5 Gbps, alongside an Intel® i219 Gbps port. Additionally, the board offers four USB3.2 Gen 2 ports as well as USB3.2 Gen 2 Type-C for greater flexibility with modern deployments. Video output is provided thanks to HDMI 2.0b, two DP1.4a ports, DP1.4a via Type C, and on-board LVDS port (eDP optional). Expandability is available through multiple M.2 slots, and Mini Card, supporting functions such as Wi-Fi, high speed NVMe storage, and AI scalability with modules such as the AI Core XM2280.

“The GENE-TGU subcompact board delivers a combination of processing performance and edge capabilities to enable users to power their projects,” said Alan Lan, Product Manager with AAEON’s Embedded Computing Division. “By leveraging features including the Intel Iris Xe graphics controller and scalable expansion support, the GENE-TGU can easily deploy to power applications from brilliant digital signage and displays to Edge IoT gateways and AI processing.”

The GENE-TGU comes with several key features for embedded deployment, including TPM2.0, wide voltage input (9V ~36V), and wide temperature operation. AAEON offers a range of industry leading services and support, from customization to OEM/ODM and manufacturer services.

Which LPWA Module to Choose for Your IoT Applications?

Posted on by mixos

Low-Power Wide-Area (LPWA) network, including LTE-M and NB-IoT, is a power-efficient technology designed to transfer small amounts of data from a large number of devices, offering enhanced network coverage and capacity, lower costs as well as longer battery life suitable for low-power IoT applications. But how to choose the right LPWA module for your project?

NB-IoT vs LTE Cat-M: What Scenarios?

Narrowband IoT (NB-IoT) operates over licensed spectrum designed for IoT devices with low bandwidth requirements. Since cellular technology offers remote support and strong signal penetration, NB-IoT is suitable for long distance and indoor or underground use. However, it cannot handle cellular tower switching, so it can only be used for fixed IoT applications. As a result, it is ideal for simple IoT scenarios that require small, intermittent data transfers and where latency is not critical, such as smart meters for gas, water and electricity, smart city (smart street lighting and parking sensors), smart agricultural (sensors that monitor irrigation systems and detect leaks), and so on.

Compared to NB-IoT, LTE Cat M supports higher uplink and downlink speeds of 1Mbps, as well as lower latency of 10 to 15 milliseconds. LTE M provides high enough bandwidth to replace many current 2G and 3G IoT applications. It supports cellular tower crossover switching so can be applied in devices that require mobility. Use cases of LTE M include smart wearables (fitness wristbands, smartwatches), asset tracking, fleet management, health monitors and smart alarms.

Defined in 3GPP Release 13 in 2016, both NB-IoT and LTE-M have not been globally available yet. NB-IoT is suitable for markets with late LTE adoption, while LTE-M is predominant in North and Latin American as well as Asian markets with early LTE adoption.

Fibocom’s High-Value LPWA Solutions Empower Industry Verticals

Fibocom’s commercial-ready LPWA modules can deliver cost-optimized wireless solutions for large-scale mobile IoT applications, bringing IoT solutions to the market with lower capital and time investment. The Fibocom NB-IoT module N510-GL and LTE Cat M module MA510-GL are especially suitable for IoT industry applications such as smart meter, smart home, smart parking, smart healthcare, asset tracking, smart cities, etc. Importantly, both types of modules are pin-compatible with Fibocom 2G module G510 and LTE Cat 1 module MC610, allowing customers to immigrate easily between different technologies without hardware changes.

Fibocom’s LPWA modules have been certified by various regional telecom operators (T-Mobile, Deutsche Telekom, Verizon, AT&T, Sprint, Vodafone, Telefonica), industry associations (HF, GCF, PTCRB) and local regulations (RoHS, RCM, NCC, IC, Reach, Anatel, CE, TELEC, JATE, CE-RED, FCC), aiming to satisfy different deployment requirements for customers worldwide.

For more information, please visit:

Resources

Bidirectional Speed Control for DC Motors

This is a very simple bidirectional speed control of a small DC brushed motor. The project is built using power OPAMP TCA0372 which can drive a load up to 1A. Connecting a small DC motor and trimmer pot will control the motor forward/reverse operation along with speed control. A Trimmer potentiometer is provided to set the speed and direction of the motor. The motor is stopped when the potentiometer is in the center, turn the pot clockwise to run the motor in the forwarding direction, turning the pot counterclockwise will run the motor in the reverse direction. Operating power supply 12V DC.

Note: Motor control is also possible using a joystick. Trimmer pot can be replaced with Joystick using optional connector CN2.

Features

  • DC Motor 6-12V DC
  • Maximum Motor current up to 1A
  • Operating Power Supply 12V DC
  • Single Trimmer Pot Controls CCW/CW and Speed Control
  • Potentiometer Can be Replaced with Joystick
  • PCB dimensions: 27.62 x 24.92 mm

Schematic

Parts List

NO.QNTY.REF.DESC.MANUFACTURERSUPPLIERPART NO
11CN12 PIN MALE HEADER PITCH 2.54MMWURTHDIGIKEY732-5315-ND
21CN23 PIN MALE HEADER PITCH 2.54MM WURTHDIGIKEYDNP
31C1100uF/16V SMD TANTLUMKEMETDIGIKEY399-18082-1-ND
41C20.1uF/50V SMD SIZE 0805MURATA/YAGEODIGIKEY
51D1LED RED SMD SIZE 0805LITE ON INCDIGIKEY160-1427-1-ND
61MG12 PIN MALE HEADER PITCH 2.54MMWURTHDIGIKEY732-5315-ND
76R4,R5,R6,R7,R9,R1010K 5% SMD SIZE 0805MURATA/YAGEODIGIKEY
81R11K 5% SMD SIZE 0805MURATA/YAGEODIGIKEY
92R2,R80E SMD SIZE 0805MURATA/YAGEODIGIKEY
101R35.1E/5E 1W SMD SIZE 2512MURATA/YAGEODIGIKEY
111U1TCA0372ONSEMIDIGIKEYTCA0372DWR2GOSCT-ND
121PR110K TRIMMER POTKYOCERADIGIKEY478-601030-ND

Connections

Gerber View

Photos

 

Video

TCA0372 Datasheet

3 Channel Capacitive Touch Sensor with I2C

Posted on by mixos

The project described here is a 3 channel capacitive touch sensor based on CAP1203 chip from Microchip which is a multiple-channel capacitive touch sensor controller. It has 3 x individual capacitive touch sensor inputs with programmable sensitivity for use in touch sensor applications. 3 x touchpads are provided on PCB to detect the touch. Each sensor input is calibrated to compensate for system parasitic capacitance and automatically recalibrated to compensate for gradual environmental changes. The CAP1203 includes Multiple Pattern Touch recognition that allows the user to select a specific set of buttons to be touched simultaneously. If this pattern is detected, a status bit is set and an interrupt is generated. The CAP1203 has Active and Standby states, each with its own sensor input configuration controls. Power consumption in the Standby state is dependent on the number of sensor inputs enabled as well as averaging, sampling time, and cycle time. Deep Sleep is the lowest power state available, drawing 5µA (typical) of current. In this state, no sensor inputs are active, and communications will wake the device.

3 Channel Capacitive Touch Sensor with I2C – [Link]

Meet Khadas Vim4 – An 8GB RAM,  Octa-Core Amlogic A311D2 SBC

Posted on by Emmanuel Odunlade

Recent times have shown a variety of Linux-compatible SBCs. One of the most recent is the Khadas Vim4 launched as an enhanced version of its open-spec Khadas Vim3 to give developers enhanced development and deployment experience.

The Khadas Vim4 is designed on an octa-core – A73 and octa-core – A53 Amlogic A311D2 SoC with an 8GB LPDDR4 RAM for faster systems operation. The Amlogic A311D2 SoC has four Arm Cortex-A73 cores that run at 2.2GHz and four Cortex-A53 cores with a 2.0GHz clock rate.

The A311D2 has an upgraded GPU, an ARM Mali-G5 MP8(8EE) GPU compared to the Arm Mali-G5 MP4 GPU of hexa-core A311D. It supports 8Kp24AV1 video decoding with support for multi-video decoding and 4Kp50 video encoding. The SoC also supports LVDS, eDP, three HDMI 2.1 inputs at 4Kp60 already mentioned and V-by-One interface for fast data throughout over copper twisted-pair communication channels. The on-chip system is also compatible with 16MP ISP at 4Kp50 which allows an extra 4-lane MIPI CSI interface when compared to its junior.

The board is further equipped with WiFi 6, 32GB eMMC flash, microSD card slot, 4Kp60 HDMI input/output; Gigabit Ethernet ports; 40-pins header, USB-3.0, 2.0, 2.0 OTG, 16MP ISP camera support and runs at 2112MHz. The Vim4 also features an STMicro STM32G031 Cortex-M0+ microcontroller that runs at 64MHz to ensure power management and boot media applications. The Khadas’ board takes in an operating voltage of 5V – 20V range via its USB-C port or pogo pads to ensure a wide range of application conditions.

Apart from other advanced features, the Vim4 when compared to the Vim3, can be considered as a true upgrade. The Vim4 supports the use of M.2 PCIe and USB 3.0 at the same time, while the Vim3, allows either the use of a USB 3.0 (without PCIe) or USB 2.0 with PCIe at a time.

Key Features And Specifications of Vim4 Include:

  • SoC: Amlogic A311D2 octa-core processor with 4x Arm Cortex-A73 cores @ up to 2.2 GHz and 4x Cortex A53 cores @ up to 2.0 GHz, Arm Mali-G52 MP(8EE) GPU, NPU shown as TBD
  • MCU: STMicro STM32G031 Cortex-M0+ microcontroller @ 64 MHz for power management, customizations, and boot media configuration
  • 8GB LPDDR4X @ 2112 MHz
  • 32GB eMMC flash, 32MB SPI flash, microSD card slot
  • 5V to 20V power supply via USB-C port or pogo pads
  • HDMI 2.1 up to 4Kp60
  • 30-pin 0.5mm Pitch FPC Connector for 4-lane MIPI-DSI interface up to 1920 x 1080
  • eDP interface
  • LVDS and V-by-One interfaces
  • 1x Micro HDMI port up to 4Kp60
  • Decoding
  • 8Kp24 AV1, H.265, VP9
  • Supports multi-video decoding up to 4Kx2K@60fps + 1x1080P@60fps
  • Dolby Vision and HDR10, HDR10+, HLG, and PRIME HDR video processing
  • Encoding: 4Kp50 H.265 / H.264 60fps decoder
  • 8-ch I2S for microphone array applications over M2 connector
  • FPC connector for 2x 4-lane MIPI CSI with dual camera support; 16MP ISP
  • Gigabit Ethernet with WoL support
  • Dual-band 802.11a/b/g/n/ac/ax WiFI 6, 2X2 MIMO and Bluetooth 5.2 via Ampak 6275S module
  • 1x USB 3.0 Type-A port, 1x USB 2.0 type-A port, 1x USB 2.0 OTG type-C port
  • KXTJ3-1057 3-axis digital accelerometer
  • M.2 Socket with single-lane PCIe 2.0, USB 2.0, I2S, I2C, ADC, 100M Ethernet PHY interface, GPIO, MCU_PA2
  • 40-pins 2.54mm pitch header exposing:
    • CPU signals: USB, I2C, I2S, SPDIF, UART, PWM, ADC
    • MCU signals: SWIM, NRST, PA1
  • 2x IR receiver
  • RTC & battery header
  • 4-pin cooling fan header with PWM speed control
  • 3x User LEDs
  • Power, Function and Reset buttons
  • XPWR pads for an external power button

On the software support part, Khadas is yet to release information and documentation on the software aspect but a notification on Cnx Software states that the Vim4 should support Ubuntu 20.04 with Linux 4.9 OS and LibreELEC; CoreELEC; Armbian; and Manjaro Arm as third-party images. This is based on the fact that A311D2 is only an enhanced A311D core.

As of writing this, no product page to reveal pricing and availability of the Khadas Vim4 has been created. Also, Amlogic A311D2 is yet to be included on Amlogic’s website. Further information on Vim4 would eventually show up on Khadas’ website. Information on A311D2 points to the A311D2’s reference manual.

GroupGets’ Teledyne FLIR Lepton FS module sells for half the price of FLIR thermal cameras

Posted on by Emmanuel Odunlade

We all know that getting thermal cameras that are based on FLIR Lepton modules can really be much of a budget to plan for if you’re considering getting one. This is why we are excited to introduce to you a new cost-effective solution called the Teledyne FLIR Lepton FS module – a non-radiometric 160 x 120 resolution micro thermal camera module that sells for about half the price of an ordinary FLIR thermal camera module.

“Just as we were the first place to get FLIR Lepton seven years ago, we are bringing this new Lepton to you first at a highly compelling price to make your thermal imaging application more economically viable,”

writes GroupGets, the platform behind this project.

Currently, the Lepton FS module which sells for $99, costs the lowest in the Lepton family. This was achieved by notably reducing the thermal sensitivity, scene dynamic range, and up to 3% inoperable pixels. If you need an imager and not a radiometric sensor, these specs will just be very good and worth your money.

“These units balance performance and price, enabling monitoring applications where radiometry is not required and pixel-level image information is less important than broad thermal data,”

the company added.

Key Features and Specifications of the FLIR Lepton FS Module Include:

  • Sensor technology: Uncooled VOx microbolometer
  • Spectral range: Longwave infrared, 8 μm to 14 μm
  • Array format: 160 x 120, progressive scan
  • Pixel size of 12 μm
  • Effective frame rate of 8.7 Hz
  • Thermal sensitivity: <75mK NEdt
  • Operability
    • Number of non-defective pixels is 97%
    • Temperature compensation is automatic, and,
    • Output image is independent of camera temperature.
  • Non-uniformity corrections: Integral Shutter
  • Scene dynamic range
    • High Gain Mode: -10 ~ 140°C typical
    • Low Gain Mode: -10 ~ 350°C typical
  • Image optimization: Factory configured and fully automated
  • FOV:
    • horizontal: 57°
    • diagonal: 71°
  • Lens Type: f/1.1
  • Output format: User-selectable 14-bit, 8-bit (AGC applied), or 24-bit RGB (AGC and colorization applied)
  • Integral solar protection
  • Host interfaces: SPI for video data, CCI (I2C-like) for control
  • Input supply voltage: 2.8 V, 1.2 V, 2.5 V to 3.1 VIO
  • Power consumption:
    • 150 mW operating
    • 650 mW during shutter event
    • 5 mW in standby mode
  • Temperature Range:
    • Operating: -10C ~ +65C
    • Storage: -40 C ~ +80 C
  • Dimensions: 11.50 mm x 12.70 mm x 6.84 mm
  • Weight: 0.91g
  • Shock: 1500 G @ 0.4 ms

Application Scenarios:

The Lepton FS module is suitable for a number of applications in fields like smart home and building automation, heat occupancy sensing, and security/location monitoring. It offers integrators the appropriate thermal capability for various innovative thermal monitoring products.

The FLIR Lepton FS currently sells on GroupGets for $99 with shipping.

Other useful details can also be found on the GroupGets page.

TOP PCB Companies